ADF4360-8 Data Sheet
Rev. D | Page 24 of 24
OUTLINE DIMENSIONS
0.50
BSC
0.50
0.40
0.30
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGD-8.
BOTTOM VIEWTOP VIEW
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.203 REF
COPLANARITY
0.08
PIN 1
INDICATOR
1
24
7
12
13
18
19
6
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
01-18-2012-A
0.30
0.25
0.20
PIN 1
INDIC
A
T
OR
0.20 MIN
2.40
2.30 SQ
2.20
EXPOSED
PAD
Figure 30. 24-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm x 4 mm Body and 0.75 mm Package Height
(CP-24-14)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Frequency Range Package Description Package Option
ADF4360-8BCPZ −40°C to +85°C 65 MHz to 400 MHz 24-Lead Lead Frame Chip Scale Package [LFCSP] CP-24-14
ADF4360-8BCPZRL −40°C to +85°C 65 MHz to 400 MHz 24-Lead Lead Frame Chip Scale Package [LFCSP] CP-24-14
24-Lead Lead Frame Chip Scale Package [LFCSP]
EV-ADF4360-8EB1Z Evaluation Board
1
Z = RoHS Compliant Part.
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D04763-0-5/16(D)
