General Description
DDR2 SDRAM modules are high-speed, CMOS dynamic random access memory mod-
ules that use internally configured 4 or 8-bank DDR2 SDRAM devices. DDR2 SDRAM
modules use DDR architecture to achieve high-speed operation. DDR2 architecture is
essentially a 4n-prefetch architecture with an interface designed to transfer two data
words per clock cycle at the I/O pins. A single read or write access for the DDR2 SDRAM
module effectively consists of a single 4n-bit-wide, one-clock-cycle data transfer at the
internal DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data
transfers at the I/O pins.
DDR2 modules use two sets of differential signals: DQS, DQS# to capture data and CK
and CK# to capture commands, addresses, and control signals. Differential clocks and
data strobes ensure exceptional noise immunity for these signals and provide precise
crossing points to capture input signals. A bidirectional data strobe (DQS, DQS#) is
transmitted externally, along with data, for use in data capture at the receiver. DQS is a
strobe transmitted by the DDR2 SDRAM device during READs and by the memory con-
troller during WRITEs. DQS is edge-aligned with data for READs and center-aligned
with data for WRITEs.
DDR2 SDRAM modules operate from a differential clock (CK and CK#); the crossing of
CK going HIGH and CK# going LOW will be referred to as the positive edge of CK. Com-
mands (address and control signals) are registered at every positive edge of CK. Input
data is registered on both edges of DQS, and output data is referenced to both edges of
DQS, as well as to both edges of CK.
Serial Presence-Detect EEPROM Operation
DDR2 SDRAM modules incorporate serial presence-detect. The SPD data is stored in a
256-byte EEPROM. The first 128 bytes are programmed by Micron to identify the mod-
ule type and various SDRAM organizations and timing parameters. The remaining 128
bytes of storage are available for use by the customer. System READ/WRITE operations
between the master (system logic) and the slave EEPROM device occur via a standard
I
2
C bus using the DIMM’s SCL (clock) SDA (data), and SA (address) pins. Write protect
(WP) is connected to V
SS
, permanently disabling hardware write protection.
1GB, 2GB (x64, SR) 200-Pin DDR2 SDRAM SODIMM
General Description
PDF: 09005aef83c2a451
htf8c128_256x64hz.pdf - Rev. E 4/14 EN
7
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2009 Micron Technology, Inc. All rights reserved.
Electrical Specifications
Stresses greater than those listed may cause permanent damage to the module. This is a
stress rating only, and functional operation of the module at these or any other condi-
tions outside those indicated in the device data sheet are not implied. Exposure to abso-
lute maximum rating conditions for extended periods may adversely affect reliability.
Table 7: Absolute Maximum Ratings
Symbol Parameter Min Max Units
V
DD
V
DD
supply voltage relative to V
SS
–1.0 2.3 V
V
DDQ
V
DDQ
supply voltage relative to V
SS
–0.5 2.3
V
DDL
V
DDL
supply voltage relative to V
SS
–0.5 2.3
V
IN
, V
OUT
Voltage on any pin relative to V
SS
–0.5 2.3 V
I
I
Input leakage current; Any input 0V V
IN
V
DD
; V
REF
input 0V V
IN
0.95V; (All other
pins not under test = 0V)
Command/Address, RAS#,
CAS#, WE#, S#, CKE, ODT
–40 40 µA
CK, CK# –20 20
DM –5 5
I
OZ
Output leakage current; 0V V
OUT
V
DDQ
;
DQ and ODT are disabled
DQ, DQS, DQS# –5 5 µA
I
VREF
V
REF
leakage current; V
REF
= valid V
REF
level –16 16 µA
T
C
1
DDR2 SDRAM component operating tem-
perature
2
Commercial 0 85 °C
Industrial –40 95 °C
T
A
Module ambient operating temperature Commercial 0 70 °C
Industrial –40 85 °C
Notes:
1. The refresh rate is required to double when T
C
exceeds 85°C.
2. For further information, refer to technical note TN-00-08: "Thermal Applications," avail-
able on Micron’s Web site.
1GB, 2GB (x64, SR) 200-Pin DDR2 SDRAM SODIMM
Electrical Specifications
PDF: 09005aef83c2a451
htf8c128_256x64hz.pdf - Rev. E 4/14 EN
8
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2009 Micron Technology, Inc. All rights reserved.
DRAM Operating Conditions
Recommended AC operating conditions are given in the DDR2 component data sheets.
Component specifications are available on Micron's Web site. Module speed grades cor-
relate with component speed grades.
Table 8: Module and Component Speed Grades
DDR2 components may exceed the listed module speed grades; module may not be available in all listed speed grades
Module Speed Grade Component Speed Grade
-1GA -187E
-80E -25E
-800 -25
-667 -3
-53E -37E
-40E -5E
Design Considerations
Simulations
Micron memory modules are designed to optimize signal integrity through carefully de-
signed terminations, controlled board impedances, routing topologies, trace length
matching, and decoupling. However, good signal integrity starts at the system level. Mi-
cron encourages designers to simulate the signal characteristics of the system's memo-
ry bus to ensure adequate signal integrity of the entire memory system.
Power
Operating voltages are specified at the DRAM, not at the edge connector of the module.
Designers must account for any system voltage drops at anticipated power levels to en-
sure the required supply voltage is maintained.
1GB, 2GB (x64, SR) 200-Pin DDR2 SDRAM SODIMM
DRAM Operating Conditions
PDF: 09005aef83c2a451
htf8c128_256x64hz.pdf - Rev. E 4/14 EN
9
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2009 Micron Technology, Inc. All rights reserved.

MT8HTF25664HZ-800C1

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Manufacturer:
Micron
Description:
Memory Modules DDR2 2GB SODIMM
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