CDP68HC68T1M Datasheet CDP68HC68T1MZ, CDP68HC68T1EZ, CDP68HC68T1M2Z | P22-P24

FN1547.9

Decemember 8, 2015

CDP68HC68T1

Dual-In-Line Plastic Packages (PDIP)

NOTES:

1. Controlling Dimensions: INCH. In case of conflict between English and

Metric dimensions, the inch dimensions control.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication No. 95.

4. Dimensions A, A1 and L are measured with the package seated in JE-

DEC seating plane gauge GS-3.

5. D, D1, and E1 dimensions do not include mold flash or protrusions.

Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).

6. E and are measured with the leads constrained to be perpendic-

ular to datum .

7. e

and e

are measured at the lead tips with the leads unconstrained.

must be zero or greater.

8. B1 maximum dimensions do not include dambar protrusions. Dambar

protrusions shall not exceed 0.010 inch (0.25mm).

9. N is the maximum number of terminal positions.

10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,

E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).

-C-

-B-

INDEX

12 3 N/2

AREA

SEATING

BASE

PLANE

-C-

-A-

0.010 (0.25) C AM BS

E16.3 (JEDEC MS-001-BB ISSUE D)

16 LEAD DUAL-IN-LINE PLASTIC PACKAGE

SYMBOL

INCHES MILLIMETERS

NOTESMIN MAX MIN MAX

A - 0.210 - 5.33 4

A1 0.015 - 0.39 - 4

A2 0.115 0.195 2.93 4.95 -

B 0.014 0.022 0.356 0.558 -

B1 0.045 0.070 1.15 1.77 8, 10

C 0.008 0.014 0.204 0.355 -

D 0.735 0.775 18.66 19.68 5

D1 0.005 - 0.13 - 5

E 0.300 0.325 7.62 8.25 6

E1 0.240 0.280 6.10 7.11 5

e 0.100 BSC 2.54 BSC -

0.300 BSC 7.62 BSC 6

- 0.430 - 10.92 7

L 0.115 0.150 2.93 3.81 4

N16 169

Rev. 0 12/93

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9001 quality systems.

Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

FN1547.9

Decemember 8, 2015

CDP68HC68T1

Small Outline Plastic Packages (SOIC)

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006

inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Interlead

flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above

the seating plane, shall not exceed a maximum value of 0.61mm (0.024

inch)

10. Controlling dimension: MILLIMETER. Converted inch dimensions are

not necessarily exact.

INDEX

AREA

123

-B-

0.25(0.010) C AM BS

-A-

-C-

SEATING PLANE

0.10(0.004)

h x 45°

0.25(0.010) BM M



M16.3 (JEDEC MS-013-AA ISSUE C)

16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE

SYMBOL

INCHES MILLIMETERS

NOTESMIN MAX MIN MAX

A 0.0926 0.1043 2.35 2.65 -

A1 0.0040 0.0118 0.10 0.30 -

B 0.013 0.0200 0.33 0.51 9

C 0.0091 0.0125 0.23 0.32 -

D 0.3977 0.4133 10.10 10.50 3

E 0.2914 0.2992 7.40 7.60 4

e 0.050 BSC 1.27 BSC -

H 0.394 0.419 10.00 10.65 -

h 0.010 0.029 0.25 0.75 5

L 0.016 0.050 0.40 1.27 6

N16 167



0° 8° 0° 8° -

Rev. 1 6/05

FN1547.9

Decemember 8, 2015

CDP68HC68T1

Package Outline Drawing

M20.3

20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOIC)

Rev 3, 2/11

7. The lead width as measured 0.36mm (0.14 inch) or greater above

the seating plane, shall not exceed a maximum value of 0.61mm

DETAIL "X"

SIDE VIEW

TYPICAL RECOMMENDED LAND PATTERN

TOP VIEW

13.00

0.75

0.25

x 45°

0.32

0.23

MAX

8°

1.27

0.40

10.65

10.00

7.60

7.40

123

INDEX

AREA

2.65

2.35

0.30

MAX

BSC

1.27

0.35

0.49

0.25 (0.10) MC SBMA

0.10 (0.004)

0.25 (0.10)

1.27 BSC

(9.40mm)

SEATING PLANE

(0.60)

(2.00)

NOTES:

1. Dimensioning and tolerancing per ASME Y14.5M-1994.

2. Dimension does not include mold flash, protrusions or gate

3. Dimension does not include interlead lash or protrusions. Interlead

flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.

4. The chamfer on the body is optional. If it is not present, a visual

index feature must be located within the crosshatched area.

5. Dimension is the length of terminal for soldering to a substrate.

6. Terminal numbers are shown for reference only.

8. Controlling dimension: MILLIMETER.

9. Dimensions in ( ) for reference only.

burrs. Mold flash, protrusion and gate burrs shall not exceed

0.15mm (0.006 inch) per side.

(0.024 inch)

10. JEDEC reference drawing number: MS-013-AC.

12.60

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CDP68HC68T1M

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