IDT
TM
/ICS
TM
Low Skew Dual Bank DDR I/II Fan-out Buffer 1084C 12/03/09
ICS9P936
Low Skew Dual Bank DDR I/II Fan-out Buffer
10
α
SEATING
PLANE
SEATING
PLANE
A1
A
A2
e
-C-
- C -
b
.10 (.004) C
.10 (.004) C
c
L
INDEX
AREA
INDEX
AREA
12
1 2
N
D
E1
E
209 mil SSOP
MIN MAX MIN MAX
A -- 2.00 -- .079
A1 0.05 -- .002 --
A2 1.65 1.85 .065 .073
b 0.22 0.38 .009 .015
c 0.09 0.25 .0035 .010
D
E 7.40 8.20 .291 .323
E1 5.00 5.60 .197 .220
e
L 0.55 0.95 .022 .037
N
α
V
ARIATIONS
MIN MAX MIN MAX
28 9.90 10.50 .390 .413
10-0033
SYMBOL
In Millimeters In Inches
COMMON DIMENSIONS COMMON DIMENSIONS
SEE VARIATIONS SEE VARIATIONS
0.65 BASIC 0.0256 BASIC
Reference Doc.: JEDEC Publication 95, MO-150
SEE VARIATIONS SEE VARIATIONS
N
D mm. D (inch)
28-pin SSOP Package Drawing and Dimensions
IDT
TM
/ICS
TM
Low Skew Dual Bank DDR I/II Fan-out Buffer 1084C 12/03/09
ICS9P936
Low Skew Dual Bank DDR I/II Fan-out Buffer
11
MIN MAX MIN MAX
A -- 1.20 -- .047
A1 0.05 0.15 .002 .006
A2 0.80 1.05 .032 .041
b 0.19 0.30 .007 .012
c 0.09 0.20 .0035 .008
D
E
E1 4.30 4.50 .169 .177
e
L 0.45 0.75 .018 .030
N
α
aaa -- 0.10 -- .004
VARIATIONS
MIN MAX MIN MAX
28 9.60 9.80 .378 .386
10-0035
4.40 mm. Body, 0.65 mm. Pitch TSSOP
6.40 BASIC 0.252 BASIC
0.0256 BASIC
COMMON DIMENSIONS
In Millimeters In Inches
COMMON DIMENSIONS
(173 mil) (25.6 mil)
SYMBOL
SEE VARIATIONS SEE VARIATIONS
0.65 BASIC
Reference Doc.: JEDEC Publication 95, MO-153
N
SEE VARIATIONS SEE VARIATIONS
D mm. D (inch)
28-pin TSSOP Package Drawing and Dimensions
Ordering Information
Part / Order Number Shipping Packaging Package Temperature
9P936AFLF Tubes 28-pin SSOP 0 to +70°C
9P936AFLFT Tape and Reel 28-pin SSOP 0 to +70°C
9P936AGLF Tubes 28-pin TSSOP 0 to +70°C
9P936AGLFT Tape and Reel 28-pin TSSOP 0 to +70°C
"LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
"A" denotes the revision designator (will not correlate to datasheet revision).
ICS9P936
Low Skew Dual Bank DDR I/II Fan-out Buffer
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© 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated
Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks
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Printed in USA
TM
Revision History
Rev. Issue Date Description Page #
0.1 3/23/2005 Updated Electrical Characteristics 5-9
0.2 4/1/2005 Updated Skew programming bytes and I2c programming address 3, 10
0.3 9/12/2005 Updated LF Ordering Information 11
0.4 9/14/2005 Added TSSOP Ordering Information. 12
0.5 11/13/2006 Updated I2C. 3
0.6 4/5/2007 Updated Switching Characteristics. 6
0.7 6/26/2007 Updated Max Clock Frequency. 1, 7, 10
A 4/8/2009 Released to final.
B 11/12/2009
1. Updated all electrical tables to specify VDDQ = 1.8V and 2.5V.
2. Updated ordering information table
3. Updated pinout and pin descriptions
Various
C 12/2/2009
1.Corrected Byte 19/20 default to 00 hex.
2.Corrected typos in electrical tables, made formatting improvements
for readability.

9P936AGLF

Mfr. #:
Manufacturer:
Description:
Clock Buffer PC BUFFER
Lifecycle:
New from this manufacturer.
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