Atmel AT88SA10HS [DATASHEET] 19
8595HCRYPTO9/2012
6.7 PauseShort
Forces the chip into a busy mode for a period of t
PAUSE.
During execution of this command the chip will ignore all activity on
the IO signal. This command is used to prevent bus conflicts in a system that also includes one or more AT88SA100S or
AT88SA102S client chips sharing the same signal wire.
Table 6-15. Input Parameters
Name Size Notes
Opcode
PAUSESHORT 1 0x00
Param1
Ignored 1 Must be 0x00.
Param2
Ignored 2 Must be 0x0000.
Data
Ignored 0
Table 6-16. Output Parameters
Name Size Notes
Success 1
After a delay of t
PAUSE
, the AT88SA10HS will return a value of zero in response to a transmit flag.
Atmel AT88SA10HS [DATASHEET] 20
8595HCRYPTO9/2012
7. Pinout
Table 7-1. Pin Definitions
SOIC Pin # Name Description
5
1
Signal IO channel to the system, open drain output. It is expected that an external pull-up
resistor will be provided to pull this signal up to V
CC
for proper communications. When
the chip is not in use this pin can be pulled to either V
CC
or GND.
8 2
V
CC
Power supply, 2.7 – 5.25V. This pin should be bypassed with a high quality 0.1µF
capacitor close to this pin with a short trace to GND. See applications notes on the
Atmel website for more details.
4 3 GND
Connect to system ground.
1,2,3,6,7 -- NC Not connected.
Atmel AT88SA10HS [DATASHEET] 21
8595HCRYPTO9/2012
8. Package Drawing
3TS1 – 3-lead Shrink SOT
TITLE
DRAWING NO.
GPC
REV.
3TS1
12/11/09
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
End View
Side View
Top View
3TS1, 3-lead, 1.30mm Body, Plastic Thin
Shrink Small Outline Package (Shrink SOT)
BTBG
0.89
0.01
0.88
2.80
2.10
1.20
0.30
A
A1
A2
D
E
E1
L1
e1
b
-
-
-
2.90
-
1.30
0.54 REF
1.90 BSC
-
1.12
0.10
1.02
3.04
2.64
1.40
0.50
1,2
1,2
3
Notes: 1. Dimension D does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.25mm per
end. Dimension E1 does not include interlead flash or protrusion.
Interlead flash or protrusion shall not exceed 0.25mm per side.
2. The package top may be smaller than the package bottom.
Dimensions D and E1 are determined at the outermost extremes of
the plastic body exclusive of mold flash, tie bar burrs, gate burrs and
interlead flash, but including any mismatch between the top and
bottom of the plastic body.
3. These dimensions apply to the flat section of the lead between 0.08
mm and 0.15mm from the lead tip.
This drawing is for general information only. Refer to JEDEC Drawing
TO-236, Variation AB for additional information.
C
L
L1
3
E
E1
1
2
e1
SEATING
PLANE
b
A2
A
A1e
D
GND
SDA V
CC
Package Drawing Contact:
packagedrawings@atmel.com

AT88SA10HS-TSU-T

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
Security ICs / Authentication ICs Host Auth. IC CryptoAuth SHA-256
Lifecycle:
New from this manufacturer.
Delivery:
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