AD7811/AD7812
–10–
REV. B
CIRCUIT DESCRIPTION
Converter Operation
The AD7811 and AD7812 are successive approximation analog-
to-digital converters based around a charge redistribution DAC.
The ADCs can convert analog input signals in the range 0 V to
V
DD
. Figures 2 and 3 show simplified schematics of the ADC.
Figure 2 shows the ADC during its acquisition phase. SW2 is
closed and SW1 is in position A, the comparator is held in a
balanced condition and the sampling capacitor acquires the
signal on V
IN
.
V
IN
V
DD
/3
COMPARATOR
CONTROL
LOGIC
CLOCK
OSC
ACQUISITION
PHASE
SW1
A
B
SW2
AGND
SAMPLING
CAPACITOR
CHARGE
REDISTRIBUTION
DAC
Figure 2. ADC Acquisition Phase
When the ADC starts a conversion, see Figure 3, SW2 will
open and SW1 will move to position B causing the comparator
to become unbalanced. The Control Logic and the Charge
Redistribution DAC are used to add and subtract fixed amounts
of charge from the sampling capacitor to bring the comparator
back into a balanced condition. When the comparator is rebal-
anced, the conversion is complete. The Control Logic generates
the ADC output code. Figure 10 shows the ADC transfer
function.
V
IN
V
DD
/3
COMPARATOR
CONTROL
LOGIC
CLOCK
OSC
CONVERSION
PHASE
SW1
A
B
SW2
SAMPLING
CAPACITOR
AGND
CHARGE
REDISTRIBUTION
DAC
Figure 3. ADC Conversion Phase
TYPICAL CONNECTION DIAGRAM
Figure 4 shows a typical connection diagram for the AD7811/
AD7812. The AGND and DGND are connected together at
the device for good noise suppression. The serial interface is
implemented using three wires with RFS/TFS connected to
CONVST see Serial Interface section for more details. V
REF
is
connected to a well decoupled V
DD
pin to provide an analog
input range of 0 V to V
DD
. If the AD7811 or AD7812 is not
sharing a serial bus with another AD7811 or AD7812 then A0
(package address pin) should be hardwired low. The default
power up value of the package address bit in the control register
is 0. For applications where power consumption is of concern,
the automatic power down at the end of a conversion should be
used to improve power performance. See Power-Down Options
section of the data sheet.
SUPPLY
2.7V TO 5.5V
10F
µC/µP
THREE-WIRE
SERIAL
INTERFACE
10nF
V
REF
DIN
SCLK
CONVST
V
DD
C
REF
V
IN1
AGND
TFS
RFS
DOUT
A0
DGND
0.1F
V
IN2
V
IN4
(8)
AD7811/
AD7812
0V TO
V
REF
INPUT
Figure 4. Typical Connection Diagram
Analog Input
Figure 5 shows an equivalent circuit of the analog input struc-
ture of the AD7811 and AD7812. The two diodes D1 and D2
provide ESD protection for the analog inputs. Care must be
taken to ensure that the analog input signal never exceeds the
supply rails by more than 200 mV. This will cause these diodes
to become forward biased and start conducting current into
the substrate. 20 mA is the maximum current these diodes can
conduct without causing irreversible damage to the part. How-
ever, it is worth noting that a small amount of current (1 mA)
being conducted into the substrate due to an overvoltage on an
unselected channel can cause inaccurate conversions on a
selected channel. The capacitor C2 in Figure 5 is typically about
4 pF and can primarily be attributed to pin capacitance. The
resistor R1 is a lumped component made up of the on resistance
of a multiplexer and a switch. This resistor is typically about
125 . The capacitor C1 is the ADC sampling capacitor and
has a capacitance of 3.5 pF.
CONVERSION PHASE – SWITCH OPEN
TRACK PHASE – SWITCH CLOSED
V
IN
D1
D2
V
DD
/3
C1
3.5pF
R1
125
C2
4pF
V
DD
Figure 5. Equivalent Analog Input Circuit
The analog inputs on the AD7811 and AD7812 can be config-
ured as single ended with respect to analog ground (AGND),
as pseudo differential with respect to a common, and also as
pseudo differential pairs—see Control Register section.
C
AD7811/AD7812
–11–REV. B
An example of the pseudo differential scheme using the AD7811
is shown in Figure 6. The relevant bits in the AD7811 Control
Register are set as follows DIF/SGL = 1, CH1 = CH2 = 0, i.e.,
V
IN1
pseudo differential with respect to V
IN2
. The signal is
applied to V
IN1
but in the pseudo differential scheme the sam-
pling capacitor is connected to V
IN2
during conversion and not
AGND as described in the Converter Operation section. This
input scheme can be used to remove offsets that exist in a sys-
tem. For example, if a system had an offset of 0.5 V the offset
could be applied to V
IN2
and the signal applied to V
IN1
. This has
the effect of offsetting the input span by 0.5 V. It is only pos-
sible to offset the input span when the reference voltage is less
than V
DD
–OFFSET.
V
IN1
V
DD
/3
COMPARATOR
CONTROL
LOGIC
CLOCK
OSC
CONVERSION
PHASE
V
OFFSET
SAMPLING
CAPACITOR
V
IN+
V
IN
V
IN2
V
IN1
CHARGE
REDISTRIBUTION
DAC
V
OFFSET
Figure 6. Pseudo Differential Input Scheme
When using the pseudo differential input scheme the signal on
V
IN2
must not vary by more than a 1/2 LSB during the conver-
sion process. If the signal on V
IN2
varies during conversion, the
conversion result will be incorrect. In single-ended mode the
sampling capacitor is always connected to AGND during con-
version. Figure 7 shows the AD7811/AD7812 pseudo differen-
tial input being used to make a unipolar dc current measurement.
A sense resistor is used to convert the current to a voltage and
the voltage is applied to the differential input as shown.
R
L
R
SENSE
AD7811/
AD7812
V
IN+
V
IN
V
DD
Figure 7. DC Current Measurement Scheme
DC Acquisition Time
The ADC starts a new acquisition phase at the end of a conver-
sion and ends on the falling edge of the CONVST signal. At the
end of a conversion a settling time is associated with the sam-
pling circuit. This settling time lasts approximately 100 ns. The
analog signal on V
IN+
is also being acquired during this settling
time. Therefore, the minimum acquisition time needed is
approximately 100 ns.
Figure 8 shows the equivalent charging circuit for the sampling
capacitor when the ADC is in its acquisition phase. R2 repre-
sents the source impedance of a buffer amplifier or resistive
network; R1 is an internal multiplexer resistance, and C1 is the
sampling capacitor. During the acquisition phase the sampling
capacitor must be charged to within a 1/2 LSB of its final value.
The time it takes to charge the sampling capacitor (T
CHARGE
) is
given by the following formula:
T
CHARGE
= 7.6 × (R2 + 125 ) × 3.5 pF
C1
3.5pF
V
IN+
R1
125
R2
SAMPLING
CAPACITOR
Figure 8. Equivalent Sampling Circuit
For small values of source impedance, the settling time associ-
ated with the sampling circuit (100 ns) is, in effect, the acquisi-
tion time of the ADC. For example, with a source impedance
(R2) of 10 the charge time for the sampling capacitor is
approximately 4 ns. The charge time becomes significant for
source impedances of 2 k and greater.
AC Acquisition Time
In ac applications it is recommended to always buffer analog
input signals. The source impedance of the drive circuitry must
be kept as low as possible to minimize the acquisition time of
the ADC. Large values of source impedance will cause the THD
to degrade at high throughput rates. In addition, better perfor-
mance can generally be achieved by using an External 1 nF
capacitor on V
IN
.
ON-CHIP REFERENCE
The AD7811 and AD7812 have an on-chip 2.5 V reference
circuit. The schematic in Figure 9 shows how the reference
circuit is implemented. A 1.23 V bandgap reference is gained up
to provide a 2.5 V ± 2% reference voltage. The on-chip refer-
ence is not available externally (SW2 is open). An external refer-
ence (1.2 V to V
DD
) can be applied at the V
REF
pin. However in
order to use an external reference the EXTREF bit in the con-
trol register (Bit 0) must first be set to a Logic 1. When EXTREF
is set to a Logic 1 SW2 will close, SW3 will open and the ampli-
fier will power down. This will reduce the current consumption
of the part by about 1 mA. It is possible to use two different
reference voltages by selecting the on-chip reference or external
reference.
7pF
2.5V
EXTERNAL
CAPACITOR
1.23V
V
REF
C
REF
AGND
SW3
SW2
SW1
Figure 9. On-Chip Reference Circuitry
C
AD7811/AD7812
–12–
REV. B
When using automatic power-down between conversions to
improve the power performance of the part (see Power vs.
Throughput) the switch SW1 will open when the part enters its
power-down mode if using the internal on-chip reference. This
provides a high impedance discharge path for the external
capacitor (see Figure 9). A typical value of external capacitance
is 10 nF. When the part is in Mode 2 Full Power-Down, because
the external capacitor holds its charge during power-down, the
internal bandgap reference will power up more quickly after
relatively short periods of full power-down. When operating the
part in Mode 2 Partial Power-Down the external capacitor is not
required as the on-chip reference stays powered up while the
rest of the circuitry powers down.
ADC TRANSFER FUNCTION
The output coding of the AD7811 and AD7812 is straight
binary. The designed code transitions occur at successive inte-
ger LSB values (i.e., 1 LSB, 2 LSBs, etc.). The LSB size is =
V
REF
/1024. The ideal transfer characteristic for the AD7811 and
AD7812 is shown in Figure 10.
000...000
0V
ANALOG INPUT
111...111
000...001
000...010
111...110
111...000
011...111
1LSB
+V
REF
1LSB
1LSB = V
REF
/1024
ADC CODE
Figure 10. AD7811 and AD7812 Transfer Characteristic
POWER-DOWN OPTIONS
The AD7811 and AD7812 provide flexible power management
to allow the user to achieve the best power performance for a
given throughput rate.
The power management options are selected by programming
the power-down bits (i.e., PD1 and PD0) in the control register.
Table III below summarizes the options available. When the
power-down bits are programmed for Mode 2 Power Down (full
and partial), a rising edge on the CONVST pin will power up
the part. This feature is used when powering down between
conversions—see Power vs. Throughput. When the AD7811
and AD7812 are placed in partial power-down the on-chip
reference does not power down. However, the part will power
up more quickly after long periods of power-down when using
partial power-down—see Power-Up Times section.
Table III. AD7811/AD7812 Power-Down Options
PD1 PD0 CONVST* Description
1 1 x Full Power-Up
0 0 x Full Power-Down
0 1 0 Mode 2 Partial Power-Down
(Reference Stays Powered-Up)
0 1 1 No Power-Down
1 0 0 Mode 2 Full Power-Down
1 0 1 No Power-Down
*
This refers to the state of the CONVST signal at the end of a conversion.
POWER-ON-RESET
If during normal operation, a power-save is performed by removing
power from the AD7811 and AD7812; the user must be wary
that a proper reset is done when power is applied to the part
again. To ensure proper power-on-reset, we recommend that
both PD bits are set to 0 and then set to 1. This procedure
causes an internal reset to occur.
POWER-UP TIMES
The AD7811 and AD7812 have a 1.5 µs power-up time when
using an external reference or when powering up from partial
power-down. When V
DD
is first connected, the AD7811 and
AD7812 are in a low current mode of operation. In order to
carry out a conversion the AD7811 and AD7812 must first be
powered up by writing to the control register of each ADC to
set the power-down bits (i.e., PD1 = 1, PD0 = 1) for a full
power-up. See the Quick Evaluation Setup section on the fol-
lowing page.
Mode 2 Full Power-Down (PD1 = 1, PD0 = 0)
The power-up time of the AD7811 and AD7812 after power is
first connected, or after a long period of Full Power-Down, is
the time it takes the on-chip 1.23 V reference to power up plus
the time it takes to charge the external capacitor C
REF
—see
Figure 9. The time taken to charge C
REF
to the 10-bit level is
given by the equation (7.6 × 2 k × C
REF
). For C
REF
= 10 nF
the power-up time is approximately 152 µs. It takes 30 µs to
power up the on-chip reference so the total power-up time of
either ADC in either of these conditions is 182 µs. However,
when powering down fully between conversions to achieve a
better power performance this power-up time reduces to 1.5 µs
after a relatively short period of power-down as C
REF
holds its
charge (see On-Chip Reference section). The AD7811 and
AD7812 can therefore be used in Mode 2 with throughput
rates of 250 kSPS and under.
Mode 2 Partial Power-Down (PD1 = 0, PD0 = 1)
The power-up time of the AD7811 and AD7812 from a Partial
Power-Down is 1.5 µs maximum. When using a Partial Power-
Down between conversions, there is no requirement to connect
an external capacitor to the C
REF
pin because the reference
remains powered up. This means that the AD7811 and AD7812
will power up in 30 µs after the supplies are first connected as
there is no requirement to charge an external capacitor.
POWER VS. THROUGHPUT
By using the Automatic Power-Down (Mode 2) at the end of a
conversion—see Operating Modes section of the data sheet,
superior power performance can be achieved.
Figure 11 shows how the Automatic Power-Down is implemented
using the CONVST signal to achieve the optimum power
performance for the AD7811 and AD7812. The AD7811 and
AD7812 are operated in Mode 2 and the control register Bits
PD1 and PD0 are set to 1 and 0 respectively for Full Power-Down,
or 0 and 1 for Partial Power-Down. The duration of the CONVST
pulse is set to be equal to or less than the power-up time of the
devices—see Operating Modes section. As the throughput rate
is reduced, the device remains in its power-down state longer
and the average power consumption over time drops accordingly.
C

AD7811YRUZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 10-Bit 4-Ch 350kSPS Serial
Lifecycle:
New from this manufacturer.
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