LT3957
13
3957f
APPLICATIONS INFORMATION
The Internal Power Switch Current
For control and protection, the LT3957 measures the
internal power MOSFET current by using a sense resistor
(R
SENSE
) between GND and the MOSFET source. Figure 3
shows a typical waveform of the internal switch current
(I
SW
).
Due to the current limit (minimum 5A) of the internal power
switch, the LT3957 should be used in the applications
that the switch peak current I
SW(PEAK)
during steady state
normal operation is lower than 5A by a suffi cient margin
(10% or higher is recommended).
The LT3957 switching controller incorporates 100ns
timing interval to blank the ringing on the current sense
signal across R
SENSE
immediately after M1 is turned on.
This ringing is caused by the parasitic inductance and
capacitance of the PCB trace, the sense resistor, the diode,
and the MOSFET. The 100ns timing interval is adequate
for most of the LT3957 applications. In the applications
that have very large and long ringing on the current sense
signal, a small RC fi lter can be added to fi lter out the excess
ringing. Figure 4 shows the RC fi lter on the SENSE1 and
SENSE2 pins. It is usually suffi cient to choose 22 for
R
FLT
and 2.2nF to 10nF for C
FLT
. Keep R
FLT
s resistance
low. Remember that there is 65µA (typical) fl owing out of
the SENSE2 pin. Adding R
FLT
will affect the internal power
switch current limit threshold:
I
SW _ILIM
= 1
65µA R
FLT
48mV
•5A
On-Chip Power Dissipation and Thermal Lockout (TLO)
The on-chip power dissipation of LT3957 can be estimated
using the following equation:
P
IC
≈ I
2
SW
• D • R
DS(ON)
+ V
2
PEAK
• I
SW
• ƒ • 200pF/A +
V
IN
• (1.6mA + ƒ • 10nC)
where R
DS(ON)
is the internal switch on-resistance which
can be obtained from the Typical Performance Characteris-
tics section. V
SW(PEAK)
is the peak switch off-state voltage.
The maximum power dissipation P
IC(MAX)
can be obtained
by comparing P
IC
across all the V
IN
range at the maximum
output current . The highest junction temperature can be
estimated using the following equation:
T
J(MAX)
≈ T
A
+ P
IC(MAX)
• 42°C/W
It is recommended to measure the IC temperature in steady
state to verify that the junction temperature limit is not
exceeded. A low switching frequency may be required to
ensure T
J(MAX)
does not exceed 125°C.
If LT3957 die temperature reaches thermal lockout
threshold at 165°C (typical), the IC will initiate several
protective actions. The power switch will be turned off.
A soft-start operation will be triggered. The IC will be en-
abled again when the junction temperature has dropped
by 5°C (nominal).
Figure 3. The Switch Current During a Switching Cycle
3957 F03
I
SW(PEAK)
$I
SW
I
SW
t
DT
S
T
S
Figure 4. The RC Filter on SENSE1 Pin and SENSE2 Pin
3957 F04
LT3957
R
FLT
C
FLT
SENSE2
SGND
SENSE1
LT3957
14
3957f
APPLICATIONS INFORMATION
APPLICATION CIRCUITS
The LT3957 can be confi gured as different topologies. The
rst topology to be analyzed will be the boost converter,
followed by the fl yback, SEPIC and inverting converters.
Boost Converter: Switch Duty Cycle and Frequency
The LT3957 can be confi gured as a boost converter for
the applications where the converter output voltage is
higher than the input voltage. Remember that boost con-
verters are not short-circuit protected. Under a shorted
output condition, the inductor current is limited only by
the input supply capability. For applications requiring a
step-up converter that is short-circuit protected, please
refer to the Applications Information section covering
SEPIC converters.
The conversion ratio as a function of duty cycle is
V
OUT
V
IN
=
1
1D
in continuous conduction mode (CCM).
For a boost converter operating in CCM, the duty cycle
of the main switch can be calculated based on the output
voltage (V
OUT
) and the input voltage (V
IN
). The maximum
duty cycle (D
MAX
) occurs when the converter has the
minimum input voltage:
D
MAX
=
V
OUT
V
IN(MIN)
V
OUT
Discontinuous conduction mode (DCM) provides higher
conversion ratios at a given frequency at the cost of reduced
effi ciencies and higher switching currents.
Boost Converter: Maximum Output Current Capability
and Inductor Selection
For the boost topology, the maximum average inductor
current is:
I
L(MAX)
= I
O(MAX)
1
1D
MAX
Due to the current limit of its internal power switch, the
LT3957 should be used in a boost converter whose maxi-
mum output current (I
O(MAX)
) is less than the maximum
output current capability by a suffi cient margin (10% or
higher is recommended):
I
O(MAX)
<
V
IN(MIN)
V
OUT
•5A 0.5 ΔI
SW
(
)
The inductor ripple current ΔI
SW
has a direct effect on the
choice of the inductor value and the converters maximum
output current capability. Choosing smaller values of
ΔI
SW
increases output current capability, but
requires
large inductances and reduces the current loop gain (the
converter will approach voltage mode). Accepting larger
values of ΔI
SW
provides fast transient response and
allows the use of low inductances, but results in higher
input current ripple and greater core losses, and reduces
output current capability.
Given an operating input voltage range, and having chosen
the operating frequency and ripple current in the inductor,
the inductor value of the boost converter can be determined
using the following equation:
L =
V
IN(MIN)
ΔI
SW
•ƒ
•D
MAX
The peak inductor current is the switch current limit (5.9A
typical), and the RMS inductor current is approximately
equal to I
L(MAX)
. The user should choose the inductors
having suffi cient saturation and RMS current ratings.
Boost Converter: Output Diode Selection
To maximize effi ciency, a fast switching diode with low
forward drop and low reverse leakage is desirable. The
peak reverse voltage that the diode must withstand is
equal to the regulator output voltage plus any additional
ringing across its anode-to-cathode during the on-time.
The average forward current in normal operation is equal
to the output current.
It is recommended that the peak repetitive reverse voltage
rating V
RRM
is higher than V
OUT
by a safety margin (a 10V
safety margin is usually suffi cient).
LT3957
15
3957f
APPLICATIONS INFORMATION
The power dissipated by the diode is:
P
D
= I
O(MAX)
• V
D
where V
D
is diode’s forward voltage drop, and the diode
junction temperature is:
T
J
= T
A
+ P
D
• R
θJA
The R
θJA
to be used in this equation normally includes the
R
θJC
for the device plus the thermal resistance from the board
to the ambient temperature in the enclosure. T
J
must not
exceed the diode maximum junction temperature rating.
Boost Converter: Output Capacitor Selection
Contributions of ESR (equivalent series resistance), ESL
(equivalent series inductance) and the bulk capacitance
must be considered when choosing the correct output
capacitors for a given output ripple voltage. The effect of
these three parameters (ESR, ESL and bulk C) on the output
voltage ripple waveform for a typical boost converter is
illustrated in Figure 5.
The choice of component(s) begins with the maximum
acceptable ripple voltage (expressed as a percentage of
the output voltage), and how this ripple should be divided
between the ESR step ΔV
ESR
and the charging/discharg-
ing ΔV
COUT
. For the purpose of simplicity, we will choose
2% for the maximum output ripple, to be divided equally
between ΔV
ESR
and ΔV
COUT
. This percentage ripple will
change, depending on the requirements of the application,
and the following equations can easily be modifi ed. For a
1% contribution to the total ripple voltage, the ESR of the
output capacitor can be determined using the following
equation:
ESR
COUT
0.01• V
OUT
I
D(PEAK)
For the bulk C component, which also contributes 1% to
the total ripple:
C
OUT
I
O(MAX)
0.01• V
OUT
•ƒ
The output capacitor in a boost regulator experiences high
RMS ripple currents, as shown in Figure 5. The RMS ripple
current rating of the output capacitor can be determined
using the following equation:
I
RMS(COUT)
I
O(MAX)
D
MAX
1D
MAX
Multiple capacitors are often paralleled to meet ESR require-
ments. Typically, once the ESR requirement is satisfi ed, the
capacitance is adequate for fi ltering and has the required
RMS current rating. Additional ceramic capacitors in par-
allel are commonly used to reduce the effect of parasitic
inductance in the output capacitor, which reduces high
frequency switching noise on the converter output.
Boost Converter: Input Capacitor Selection
The input capacitor of a boost converter is less critical
than the output capacitor, due to the fact that the inductor
is in series with the input, and the input current wave-
form is continuous. The input voltage source impedance
determines the size of the input capacitor, which is typi-
cally in the range of 1µF to 100µF. A low ESR capacitor
is recommended, although it is not as critical as for the
output capacitor.
The RMS input capacitor ripple current for a boost con-
verter is:
I
RMS(CIN)
= 0.3 • ΔI
L
Figure 5. The Output Ripple Waveform of a Boost Converter
V
OUT
(AC)
t
ON
$V
ESR
RINGING DUE TO
TOTAL INDUCTANCE
(BOARD + CAP)
$V
COUT
3957 F05
t
OFF

LT3957EUHE#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators High Input Voltage, Boost, flyback, SEPIC and Inverting Converter
Lifecycle:
New from this manufacturer.
Delivery:
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