LT3957
27
3957f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
UHE Package
Variation: UHE28MA
36-Lead Plastic QFN (5mm × 6mm)
(Reference LTC DWG # 05-08-1836 Rev B)
5.00 p 0.10
6.00 p 0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 p 0.10
1
363530 31 32 33 34
28
20
21
23
24
25
27
2
3
4
6
8
9
10
121314151617
BOTTOM VIEW—EXPOSED PAD
2.00 REF
1.50 REF
0.75 p 0.05
R = 0.125
TYP
R = 0.10
TYP
PIN 1 NOTCH
R = 0.30 OR
0.35 s 45o
CHAMFER
0.25 p 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UHE28MA) QFN 0409 REV B
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 p0.05
4.10 p 0.05
5.50 p 0.05
PACKAGE OUTLINE
1.88 p 0.10
1.53 p 0.10
2.00 REF
1.50 REF
5.10 p 0.05
6.50 p 0.05
3.00 p 0.10
3.00 p 0.10
0.12
p 0.10
1.88
p 0.05
1.53
p 0.05
3.00 p 0.05
3.00 p 0.05
0.48 p 0.05
0.12
p 0.05
0.48 p 0.10
0.25 p0.05
0.50 BSC
1012 34 6 89
17
20212324252728
30
31
32
33
34
35
36
12
13
14
15
16
