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19
Isc = 16mA
CLK 1
CLK 0
VCC (receiver )
50 W
50 W
Figure 22. Simplified CML Output Structure with Termination
HCSL Termination
HCSL is a differential signaling standard commonly used
in PCIe systems. The HCSL driver is typical 14.5 mA
switched current open source output that needs a 50 W
termination resistor to ground near the source, and generates
725 mV of signal swing. A series resistor (10 W to 33 W) is
optionally used to achieve impedance matching by limiting
overshoot and ringing due to the rapid rise of current from
the output driver. The open source driver has high internal
impedance, thus a series resistor up to 33 W does not affect
the signal integrity. This resistor can be avoided for low V
DD
supply of operation, unless impedance matching requires it.
CLK1
CLK0
2.6mA
14.5mA
50 W 50 W
Figure 23. Simplified HCSL Output Structure with Termination
Field Programming Kit and Software
The NB3H60113G can be programmed by the user using
the ‘Clock Cruiser Programmable Clock Kit’. This device
uses the 8L daughter card on the hardware kit. To design a
new clock, ‘Clock Cruiser Software’ is required to be
installed from the ON Semiconductor website. The user
manuals for the hardware kit Clock Cruiser Programmable
Clock Kit and Clock Cruiser Software can be found
following the link www.onsemi.com
.
Recommendation for Clock Performance
Clock performance is specified in terms of Jitter in time
the domain and Phase noise in frequency domain. Details
and measurement techniques of Cycle−cycle jitter, period
jitter, TIE jitter and Phase Noise are explained in application
note AND8459/D.
In order to have a good clock signal integrity for minimum
data errors, it is necessary to reduce the signal reflections.
Reflection coefficient can be zero only when the source
impedance equals the load impedance. Reflections are based
on signal transition time (slew rate) and due to impedance
mismatch. Impedance matching with proper termination is
required to reduce the signal reflections. The amplitude of
overshoots is due to the difference in impedance and can be
minimized by adding a series resistor (Rs) near the output
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20
pin. Greater the difference in impedance, greater is the
amplitude of the overshoots and subsequent ripples. The
ripple frequency is dependant on the signal travel time from
the receiver to the source. Shorter traces results in higher
ripple frequency, as the trace gets longer the travel time
increases, reducing the ripple frequency. The ripple
frequency is independent of signal frequency, and only
depends on the trace length and the propagation delay. For
eg. On an FR4 PCB with approximately 150 ps/ inch of
propagation rate, on a 2 inch trace, the ripple frequency = 1
/ (150 ps * 2 inch * 5) = 666.6 MHz; [5 = number of times
the signal travels, 1 trip to receiver plus 2 additional round
trips]
PCB traces should be terminated when trace length tr/f /
(2* tprate); tr/f = rise/ fall time of signal, tprate =
propagation rate of trace.
Ringing
Overshoot
(Positive)
Overshoot
(Negative)
Figure 24. Signal Reflection Components
PCB Design Recommendation
For a clean clock signal waveform it is necessary to have
a clean power supply for the device. The device must be
isolated from system power supply noise. A 0.1 mF and a
2.2 mF decoupling capacitor should be mounted on the
component side of the board as close to the VDD pin as
possible. No vias should be used between the decoupling
capacitor and VDD pin. The PCB trace to VDD pin and the
ground via should be kept thicker and as short as possible.
All the VDD pins should have decoupling capacitors.
Stacked power and ground planes on the PCB should be
large. Signal traces should be on the top layer with minimum
vias and discontinuities and should not cross the reference
planes. The termination components must be placed near the
source or the receiver. In an optimum layout all components
are on the same side of the board, minimizing vias through
other signal layers.
Device Applications
The NB3H60113G is targeted mainly for the Consumer
market segment and can be used as per the examples below.
Clock Generator
Consumer applications like a Set top Box, have multiple
sub−systems and standard interfaces and require multiple
reference clock sources at various locations in the system.
This part can function as a clock generating IC for such
applications generating a reference clock for interfaces like
USB, Ethernet, Audio/Video, ADSL, PCI etc.
Figure 25. Application as Clock Generator
Clock Buffer/
Crystal
Oscillator and
Phase
Detector
Charge
Pump
VCO
CMOS /
Diff
buffer
CMOS/
Diff
buffer
Feedback
Divider
XIN/CLKIN
XOUT
Crystal
CLK1
CLK2
CLK0
VDD
GND
Output
Divider
Output
Divider
Output
Divider
Configuration
Memory
PLL Block
Frequency
and SS
PD#
Output control
Crystal/Clock Control
PLL Bypass Mode
AGC
CMOS
buffer
25MHz
48MHz
25MHz
Video
USB
Ethernet
27MHz
Buffer and Logic/Level Translator
The NB3H60113G is useful as a simple CMOS Buffer in
PLL bypass mode. One or more outputs can use the PLL
Bypass mode to generate the buffered outputs. If the PLL is
configured to use spread spectrum, all outputs using PLL
Bypass feature will not be subjected to the spread spectrum.
The device can be simultaneously used as logic translator for
converting the LVCMOS input clock to HCSL, LVDS,
LVPECL, or CML.
For instance this device can be used in applications like an
LCD monitor, for converting the LVCMOS input clock to
LVDS output.
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21
NOTE: LVCMOS signal level cannot be translated to a higher level of LVCMOS voltage.
Figure 26. Application as Level Translator
Clock Buffer/
Crystal
Oscillator and
Phase
Detector
Charge
Pump
VCO
CMOS /
Diff
buffer
CMOS/
Diff
buffer
Feedback
Divider
XIN/CLKIN
XOUT
Crystal
CLK1
CLK2
CLK0
VDD
GND
Output
Divider
Output
Divider
Output
Divider
Configuration
Memory
PLL Block
Frequency
and SS
PD#
Output control
Crystal/Clock Control
PLL Bypass Mode
AGC
CMOS
buffer
LVCMOS/
LVTTL
LVDS
EMI Attenuator
Spread spectrum through frequency modulation
technique enables the reduction of the EMI radiated from the
high frequency clock signals by spreading the spectral
energy to the nearby frequencies. While using frequency
modulation, the same selection is applied to all the PLL
clock outputs (not bypass outputs) even if they are at
different frequencies. In Figure 27, CLK0 uses the PLL and
hence is subjected to the spread spectrum modulation while
CLK1 and CLK2 use the PLL Bypass mode and hence are
not subjected to the spread spectrum modulation.
Figure 27. Application as EMI Attenuator
Clock Buffer/
Crystal
Oscillator and
Phase
Detector
Charge
Pump
VCO
CMOS /
Diff
buffer
CMOS/
Diff
buffer
Feedback
Divider
XIN/CLKIN
XOUT
Crystal
CLK1
CLK2
CLK0
VDD
GND
Output
Divider
Output
Divider
Output
Divider
Configuration
Memory
PLL Block
Frequency
and SS
PD#
Output control
Crystal/Clock Control
PLL Bypass Mode
AGC
CMOS
buffer
12MHz
12MHz
12MHz
CPU
USB1
USB2
12MHz ± 0.375%
ORDERING INFORMATION
Device Case Package Shipping
NB3H60113G00MTR2G 511AT DFN−8
(Pb−Free)
3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.

NB3H60113G00MTR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Generators & Support Products 3.3 V/2.5 V OmniCloc LVCMOS/LVTTL LVPECL
Lifecycle:
New from this manufacturer.
Delivery:
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