52
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync
72-BIT FIFO
16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72
DEPTH EXPANSION CONFIGURATION (FWFT MODE ONLY)
The IDT72T7285 can easily be adapted to applications requiring depths
greater than 16,384, 32,768 for the IDT72T7295, 65,536 for the IDT72T72105
and 131,072 for the IDT72T72115 with an 72-bit bus width. In FWFT mode,
the FIFOs can be connected in series (the data outputs of one FIFO connected
to the data inputs of the next) with no external logic necessary. The resulting
configuration provides a total depth equivalent to the sum of the depths
associated with each single FIFO. Figure 37 shows a depth expansion using
two IDT72T7285/72T7295/72T72105/72T72115 devices.
Care should be taken to select FWFT mode during Master Reset for all FIFOs
in the depth expansion configuration. The first word written to an empty
configuration will pass from one FIFO to the next ("ripple down") until it finally
appears at the outputs of the last FIFO in the chain – no read operation is
necessary but the RCLK of each FIFO must be free-running. Each time the
data word appears at the outputs of one FIFO, that device's OR line goes LOW,
enabling a write to the next FIFO in line.
For an empty expansion configuration, the amount of time it takes for OR of
the last FIFO in the chain to go LOW (i.e. valid data to appear on the last FIFO's
outputs) after a word has been written to the first FIFO is the sum of the delays
for each individual FIFO:
(N – 1)*(4*transfer clock) + 3*TRCLK
where N is the number of FIFOs in the expansion and TRCLK is the RCLK
period. Note that extra cycles should be added for the possibility that the tSKEW1
specification is not met between WCLK and transfer clock, or RCLK and transfer
clock, for the OR flag.
The "ripple down" delay is only noticeable for the first word written to an empty
depth expansion configuration. There will be no delay evident for subsequent
words written to the configuration.
The first free location created by reading from a full depth expansion
configuration will "bubble up" from the last FIFO to the previous one until it finally
moves into the first FIFO of the chain. Each time a free location is created in one
FIFO of the chain, that FIFO's IR line goes LOW, enabling the preceding FIFO
to write a word to fill it.
For a full expansion configuration, the amount of time it takes for IR of the first
FIFO in the chain to go LOW after a word has been read from the last FIFO is
the sum of the delays for each individual FIFO:
(N – 1)*(3*transfer clock) + 2 TWCLK
where N is the number of FIFOs in the expansion and TWCLK is the WCLK
period. Note that extra cycles should be added for the possibility that the tSKEW1
specification is not met between RCLK and transfer clock, or WCLK and transfer
clock, for the IR flag.
The Transfer Clock line should be tied to either WCLK or RCLK, whichever
is faster. Both these actions result in data moving, as quickly as possible, to the
end of the chain and free locations to the beginning of the chain.
Figure 37. Block Diagram of 32,768 x 72, 65,536 x 72, 131,072 x 72 and 262,144 x 72 Depth Expansion
Dn
INPUT READY
WRITE ENABLE
WRITE CLOCK
WEN
WCLK
IR
DATA IN
RCLK
READ CLOCK
RCLK
REN
OE
OUTPUT ENABLE
OUTPUT READY
Qn
Dn
IR
GND
WEN
WCLK
OR
REN
OE
Qn
READ ENABLE
OR
DATA OUT
TRANSFER CLOCK
5994 drw42
n
n n
FWFT/SI FWFT/SI
FWFT/SI
RCS
READ CHIP SELECT
RCS
IDT
72T7285
72T7295
72T72105
72T72115
IDT
72T7285
72T7295
72T72105
72T72115
53
CORPORATE HEADQUARTERS for SALES: for Tech Support:
6024 Silver Creek Valley Road 800-345-7015 or 408-284-8200 408-360-1753
San Jose, CA 95138 fax: 408-284-2775 email: FIFOhelp@idt.com
www.idt.com
ORDERING INFORMATION
Plastic Ball Grid Array (PBGA, BB324-1)
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
Low Power
5994 drw43
XXXXX
Device Type
X
Power
XX
Speed
X
Package
X
Process /
Temperature
Range
BLANK
I
(1)
72T7285 16,384 x 72 2.5V TeraSync FIFO
72T7295 32,768 x 72 2.5V TeraSync FIFO
72T72105 65,536 x 72 2.5V TeraSync FIFO
72T72115 131,072 x 72 2.5V TeraSync FIFO
BB
L
Commercial Only
Commercial and Industrial
Commercial Only
Commercial Only
Clock Cycle Time (t
CLK
)
Speed in Nanoseconds
4-4
5
6-7
10
Green
G
(2)
X
DATASHEET DOCUMENT HISTORY
05/25/2001 pgs. 1, and 8.
07/19/2001 pgs. 1, and 8.
10/22/2001 pgs. 1-52.
11/19/2001 pgs. 1, 9, 12, 39, and 40.
11/29/2001 pgs. 1, 39, and 40.
01/15/2002 pg. 41.
03/04/2002 pgs. 9, and 27.
06/05/2002 pgs. 9, and 13.
06/10/2002 pg. 9.
02/11/2003 pgs. 7, 8, and 30.
03/03/2003 pgs. 1, 9-11, 28, and 30-31.
09/02/2003 pgs. 6, 15, and 23.
01/11/2007 pgs. 1, and 53.
02/05/2009 pg. 53.
NOTES:
1. Industrial temperature range product for 5ns speed grade is available as a standard device. All other speed grades are available by special order.
2. Green parts available. For specific speeds contact your sales office.

72T72115L5BBI

Mfr. #:
Manufacturer:
IDT
Description:
FIFO 2.5V 128K X 72 TERASYNC
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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