LTC2228/LTC2227/LTC2226
27
222876fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
UH Package
32-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1693 Rev D)
5.00 p 0.10
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 p 0.10
31
1
2
32
BOTTOM VIEW—EXPOSED PAD
3.50 REF
(4-SIDES)
3.45 p 0.10
3.45 p 0.10
0.75 p 0.05
R = 0.115
TYP
0.25 p 0.05
(UH32) QFN 0406 REV D
0.50 BSC
0.200 REF
0.00 – 0.05
0.70 p0.05
3.50 REF
(4 SIDES)
4.10 p0.05
5.50 p0.05
0.25 p 0.05
PACKAGE OUTLINE
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
PIN 1 NOTCH R = 0.30 TYP
OR 0.35 s 45o CHAMFER
R = 0.05
TYP
3.45 p 0.05
3.45 p 0.05
