HCPL-2533-300E

Features
Data rates to 250 kb/s NRZ
LSTTL compatible
High common mode transient immunity:
> 1000 V/µs
High density packaging
Open collection outputs
Guaranteed performance from temperature:
0°C to 70°C
Safety approval
- UL Recognized - 3750V
rms
for 1min (5000V
rms
for
1 min Option 020 devices) per UL1577.
- IEC/EN/DIN EN 60747-5-2 Approved
- V
IORM
= 630 V
peak
for option 060
Applications
High speed logic ground isolation
– LSTTL-to-LSTTL and TTL-to-LSTTL
High voltage isolation
Analog signal ground isolation
Schematic
HCPL-2533
Dual Channel, High Speed Logic Interface Optocoupler
Data Sheet
Description
The HCPL-2533 is a dual channel optocoupler which is
specied for use in LSTTL-to-LSTTL and TTL-to-LSTTL
logic interfaces. A nominal 8 mA LSTTL sink current
through the input LED will provide enough output
current for proper operation of 1 LSTTL gate under
worst-case conditions when used in the recommended
circuits. The CTR of the HCPL-2533 is 15% minimum at
I
F
= 8 mA.
The HCPL-2533 contains a pair of light emitting diodes
and integrated photon detectors with a 3000 Vdc
withstand test between input and output. Separate
connection for the photodiode bias and output tran-
sistor collector reduce the base-collector capacitance,
giving improved speed compared with conventional
phototransistor couplers.
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
I
F1
SHIELD
8
7
V
CC
+
2
V
O1
I
CC
V
F1
I
O1
1
-
I
F2
6
5
GND
-
4
V
O2
V
F2
I
O2
3
+
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED.
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
2
Absolute Maximum Ratings
Storage Temperature ......................................................................................................................................................... –55°C to +125°C
Operating Temperature ................................................................................................................................................... –55°C to +100°C
Lead Solder Temperature (1.6 mm below seating plane) ..........................................................................................260°C for 10 s
Average Input Current – I
F
(each channel) ..................................................................................................................................25 mA
[1]
Peak Input Current – I
F
(each channel) (50% duty cycle, 1 ms pulse width) ..................................................................50 mA
[2]
Peak Transient Input Current – I
F
(each channel) (≤1 µs pulse width, 300 pps) ................................................................... 1.0 A
Reverse Input Voltage – V
R
(each channel) ............................................................................................................................................5 V
Input Power Dissipation (each channel) .....................................................................................................................................45 mW
[3]
Average Output Current – I
O
(each channel) ....................................................................................................................................8 mA
Peak Output Current – I
O
(each channel) ........................................................................................................................................16 mA
Supply and Output Voltage – V
CC
(Pin 8-5), V
O
(Pin 7, 6-5) .............................................................................................–0.5 V to 7 V
Output Power Dissipation (each channel) .................................................................................................................................35 mW
[4]
Notes:
1. Derate linearly above +70˚C free-air temperature at a rate of 0.8 mA/˚C.
2. Derate linearly above +70˚C free-air temperature at a rate of 1.6 mA/˚C.
3. Derate linearly above +70˚C free-air temperature at a rate of 0.9 mW/˚C.
4. Derate linearly above +70˚C free-air temperature at a rate of 1.0 mW/˚C.
Ordering Information
HCPL-2533 is UL Recognized with 3750 Vrms and 5000 Vrms (Option 020) for 1 minute per UL1577 and are approved
under CSA Component Acceptance Notice #5, File CA 88324.
Part
number
Option
Package
Surface
Mount
Gull
Wing
Tape
& Reel
UL 5000 Vrms/
1 Minute rating
IEC/EN/DIN
EN 60747-5-2 Quantity
RoHS
Compliant
Non RoHS
Compliant
HCPL-2533
-000E No option
300mil
DIP-8
50 per tube
-300E -300 X X 50 per tube
-500E -500 X X X 1000 per reel
-020E -020 X 50 per tube
-320E -320 X X X 50 per tube
-520E -520 X X X X 1000 per reel
-060E -060 X 50 per tube
-360E -360 X X X 50 per tube
-560E -560 X X X X 1000 per reel
To order, choose a part number from the part number column and combine with the desired option from the option
column to form an order entry.
Example 1:
HCPL-2533-500E to order product of 300mil DIP Gull Wing Surface Mount package in Tape and Reel packag-
ing with RoHS compliant.
Example 2:
HCPL-2533 to order product of 300mil DIP package in tube packaging and non RoHS compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since 15th July 2001 and
RoHS compliant option will use ‘-XXXE‘.
3
Regulatory Information
The devices contained in this data sheet have been approved by the following organizations:
Solder Reow Thermal Prole
Recommended Pb-Free IR Prole
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01.
(Option 060 only)
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
217
°
C
RAMP-DOWN
6
°
C/SEC. MAX.
RAMP-UP
3
°
C/SEC. MAX.
150 - 200
°
C
260 +0/-5
°
C
t 25
°
C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5
°
C of ACTUAL
PEAK TEMPERATURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERATURE
NOTES:
THE TIME FROM 25
°
C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200
°
C, T
smin
= 150
°
C
Note: Non-halide flux should be used.
0
TIME (SECONDS)
TEMPERATURE (
°
C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160
°
C
140
°
C
150
°
C
PEAK
TEMP.
245
°
C
PEAK
TEMP.
240
°
C
PEAK
TEMP.
230
°
C
SOLDERING
TIME
200
°
C
PREHEATING TIME
150
°
C, 90 + 30 SEC.
2.5
°
C ± 0.5
°
C/SEC.
3
°
C + 1
°
C/- 0.5
°
C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3
°
C + 1
°
C/- 0.5
°
C/SEC.
REFLOW HEATING RATE 2.5
°
C ± 0.5
°
C/SEC.
Note: Non-halide flux should be used.

HCPL-2533-300E

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
High Speed Optocouplers 1MBd 2Ch 16mA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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