ADP3629/ADP3630/ADP3631
Rev. 0 | Page 10 of 16
TEST CIRCUIT
V
DD
SD
OTW
1
3
8
7
6
5
2
4
C
LOAD
100nF
CERAMIC
4.7µF
CERAMIC
SCOPE
PROBE
ADP3629/ADP3630/ADP3631
VDDPGND
OUTA
OUTB
B
NONINVERTING
INVERTING
A
NONINVERTING
INVERTING
INA,
INA
INB,
INB
08401-007
Figure 20. Test Circuit
ADP3629/ADP3630/ADP3631
Rev. 0 | Page 11 of 16
THEORY OF OPERATION
The ADP3629/ADP3630/ADP3631 family of dual drivers is
optimized for driving two independent enhancement N-channel
MOSFETs or insulated gate bipolar transistors (IGBTs) in high
switching frequency applications.
These applications require high speed, fast rise and fall times, and
short propagation delays. The capacitive nature of MOSFETs and
IGBTs requires high peak current capability, as well.
VDD
V
DD
PGND
OUTA
OUTB
SD
OTW
1
3
8
7
6
5
2
4
V
DS
V
DS
ADP3629/ADP3630/ADP3631
B
NONINVERTING
INVERTING
A
NONINVERTING
INVERTING
INA,
INA
INB,
INB
08401-017
Figure 21. Typical Application Circuit
INPUT DRIVE REQUIREMENTS (INA, INA, INB, INB,
AND SD)
The inputs of the ADP3629/ADP3630/ADP3631 are designed
to meet the requirements of modern digital power controllers;
the signals are compatible with 3.3 V logic levels. At the same
time, the input structure allows for input voltages as high as V
DD
.
The signals applied to the inputs (INA,
INA
, INB, and
INB
)
should have steep and clean fronts. It is not recommended that
slow changing signals be applied to drive these inputs because
such signals can result in multiple switching output signals
when the thresholds are crossed, causing damage to the power
MOSFET or IGBT.
An internal pull-down resistor is present at the input, which
guarantees that the power device is off in the event that the
input is left floating.
The SD input has a precision comparator with hysteresis and is
therefore suitable for slow changing signals (such as a scaled-
down output voltage); see the Shutdown (SD) Function section
for more information about this comparator.
LOW-SIDE DRIVERS (OUTA, OUTB)
The ADP3629/ADP3630/ADP3631 family of dual drivers is
designed to drive ground referenced N-channel MOSFETs. The
bias is internally connected to the V
DD
supply and to PGND.
When the ADP3629/ADP3630/ADP3631 are disabled, both
low-side gates are held low. An internal impedance is present
between the OUTA/OUTB pins and GND, even when V
DD
is
not present; this feature ensures that the power MOSFET is
normally off when bias voltage is not present.
When interfacing the ADP3629/ADP3630/ADP3631 to exter-
nal MOSFETs, the designer should consider ways to create a
robust design that minimizes stresses on both the driver and
the MOSFETs. These stresses include exceeding the short time
duration voltage ratings on the OUTA and OUTB pins, as well
as on the external MOSFET.
Power MOSFETs are usually selected to have low on resistance to
minimize conduction losses, which usually implies a large input
gate capacitance and gate charge.
SHUTDOWN (SD) FUNCTION
The ADP3629/ADP3630/ADP3631 feature an advanced shut-
down function with accurate thresholds and hysteresis.
The SD signal is an active high signal. An internal pull-up is
present on this pin and, therefore, it is necessary to pull down
the pin externally for the drivers to operate normally.
In some power systems, it is sometimes necessary to provide an
additional overvoltage protection (OVP) or overcurrent protection
(OCP) shutdown signal to turn off the power devices (MOSFETs
or IGBTs) in case of failure of the main controller.
An accurate internal reference is used for the SD comparator so
that it can be used to detect OVP or OCP fault conditions.
AC
INPUT
DC
OUTPUT
+
OUTA PGND
V
EN
SD
ADP3629/ADP3630/ADP3631
0
8401-018
Figure 22. Shutdown Function Used for Redundant OVP
ADP3629/ADP3630/ADP3631
Rev. 0 | Page 12 of 16
OVERTEMPERATURE PROTECTIONS
The ADP3629/ADP3630/ADP3631 provide two levels of over-
temperature protection:
Overtemperature warning (
OTW
)
Overtemperature shutdown
The overtemperature warning is an open-drain logic signal and
is active low. In normal operation, when no thermal warning is
present, the signal is high, whereas when the warning threshold
is crossed, the signal is pulled low.
ADP1043
3.3
V
VDD
PGND
PGND
FLAGIN
VDD
OTW
OTW
ADP3629/ADP3630/ADP3631
ADP3629/ADP3630/ADP3631
08401-019
Figure 23.
OTW
Signaling Scheme Example
The
OTW
open-drain configuration allows the connection
of multiple devices to the same warning bus in a wire-ORed
configuration, as shown in . Figure 23
The overtemperature shutdown turns off the device to protect it
in the event that the die temperature exceeds the absolute maxi-
mum limit of 150°C (see Table 2).
SUPPLY CAPACITOR SELECTION
A local bypass capacitor for the supply input (VDD) of the
ADP3629/ADP3630/ADP3631 is recommended to reduce the
noise and to supply some of the peak currents that are drawn.
An improper decoupling can dramatically increase the rise times,
cause excessive resonance on the OUTA and OUTB pins, and, in
some extreme cases, even damage the device due to inductive
overvoltage on the VDD or OUTA/OUTB pins.
The minimum capacitance required is determined by the size of
the gate capacitances being driven, but as a general rule, a 4.7 μF,
low ESR capacitor should be used. Multilayer ceramic chip
(MLCC) capacitors provide the best combination of low ESR
and small size. To further reduce noise, use a smaller ceramic
capacitor (100 nF) with a better high frequency characteristic
in parallel with the main capacitor.
Place the ceramic capacitor as close as possible to the ADP3629/
ADP3630/ADP3631 device and minimize the length of the
traces going from the capacitor to the power pins of the device.
PCB LAYOUT CONSIDERATIONS
Use the following general guidelines when designing printed
circuit boards (PCBs) for the ADP3629/ADP3630/ADP3631:
Trace out the high current paths and use short, wide
(>40 mil) traces to make these connections.
Minimize trace inductance between the OUTA and OUTB
outputs and the MOSFET gates.
Connect the PGND pin as close as possible to the source of
the MOSFETs.
Place the VDD bypass capacitor as close as possible to the
VDD and PGND pins.
When possible, use vias to other layers to maximize thermal
conduction away from the IC.
Figure 24 shows an example of the typical layout based on the
preceding guidelines.
08401-027
Figure 24. External Component Placement Example
PARALLEL OPERATION
The two driver channels in the ADP3629 and ADP3630 devices
can be combined to operate in parallel to increase drive capability
and minimize power dissipation in the driver.
The connection scheme for the ADP3630 is shown in Figure 25.
In this configuration, INA and INB are connected together, and
OUTA and OUTB are connected together.
Particular attention must be paid to the layout in this case to
optimize load sharing between the two drivers.
INA
VDD
V
DD
PGND
ADP3630
OUTA
OUTBINB
SD
OTW
1
3
8
7
6
5
A
B
2
4
V
DS
08401-021
Figure 25. Parallel Operation

ADP3631ARMZ-R7

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Gate Drivers High Speed Dual 2A MOSFET Dvr
Lifecycle:
New from this manufacturer.
Delivery:
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