ADP3629/ADP3630/ADP3631
Rev. 0 | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VDD −0.3 V to +20 V
OUTA, OUTB
DC −0.3 V to V
DD
+ 0.3 V
<200 ns −2 V to V
DD
+ 0.3 V
INA, INA, INB, INB, SD
−0.3 V to V
DD
+ 0.3 V
ESD
Human Body Model (HBM) 3.5 kV
Field Induced Charged Device
Model (FICDM)
SOIC_N 1.5 kV
MSOP 1.0 kV
Junction Temperature Range −40°C to +150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature
Soldering (10 sec) 300°C
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for a device soldered in a 4-layer circuit board
and is measured per JEDEC standards JESD51-2, JESD51-5,
and JESD51-7.
Table 3. Thermal Resistance
Package Type θ
JA
Unit
8-Lead SOIC_N 110.6 °C/W
8-Lead MSOP 162.2 °C/W
ESD CAUTION
