LT1976/LT1976B
7
1976bfg
TYPICAL PERFOR A CE CHARACTERISTICS
UW
Dropout Operation
INPUT VOLTAGE (V)
2
OUTPUT VOLTAGE (V)
1.5
2.0
2.5
3.5
4.5
1976 G23
1.0
0.5
0
2.5 3 4
3.0
3.5
4.0
V
OUT
= 3.3V
BOOST DIODE = DIODES INC. B1100
LOAD CURRENT = 1.25A
LOAD CURRENT = 250mA
INPUT VOLTAGE (V)
2
0
OUTPUT VOLTAGE (V)
1
2
3
4
34
5
6
1976 G24
5
6
2.5 3.5
4.5
5.5
V
OUT
= 5V
BOOST DIODE = DIODES INC. B1100
LOAD CURRENT = 1.25A
LOAD CURRENT = 250mA
LT1976 No Load 1A
Step Response
V
OUT
100mV/DIV
I
OUT
500mA/DIV
V
IN
= 12V TIME (1ms/DIV) 1976 G17
V
OUT
= 3.3V
C
OUT
= 47μF
0A
1A
LT1976 Burst Mode Operation
LT1976 Burst Mode Operation
V
OUT
50mV/
DIV
I
SW
100mA/
DIV
V
IN
= 12V TIME (10μs/DIV) 1976 G15
V
OUT
= 3.3V
I
Q
= 100μA
0A
0A
Dropout Operation
Minimum On Time Boost Current vs Load Current
TEMPERATURE (°C)
–50
0
ON TIME (ns)
50
150
200
250
500
350
–10
30
50
1976 G21
100
400
450
300
–30 10
70
90
110
LOAD CURRENT = 0.5A
LOAD CURRENT = 1A
LOAD CURRENT (mA)
0
0
BOOST CURRENT (mA)
5
15
20
25
50
35
400
800
1000
1976 G22
10
40
45
30
200 600
1200
1400
TEMPERATURE (˚C)
–50
V
C
VOLTAGE (V)
400
500
600
70 90 110
1976 G26
300
200
–10 3010–30 50
100
0
700
LT1976B V
C
Switching Threshold
vs Temperature
V
OUT
50mV/DIV
AC
COUPLED
I
SW
100mA/DIV
V
IN
= 12V TIME (10μs/DIV) 1976 G27
V
OUT
= 3.3V
I
Q
= 1.6mA
LT1976B No Load Operation
(Pulse-Skipping Mode)
V
OUT
50mV/DIV
I
SW
100mA/DIV
V
IN
= 12V TIME (5ms/DIV) 1976 G14
V
OUT
= 3.3V
I
Q
= 100μA
0A
LT1976/LT1976B
8
1976bfg
NC (Pins 1, 3, 5): No Connection. Pins 1, 3, 5 are
electrically isolated from the LT1976. They may be con-
nected to PCB traces to aid in PCB layout.
SW (Pin 2): The SW pin is the emitter of the on-chip power
NPN switch. This pin is driven up to the input pin voltage
during switch on time. Inductor current drives the SW pin
negative during switch off time. Negative voltage is clamped
with the external Schottky catch diode to prevent exces-
sive negative voltages.
V
IN
(Pin 4): This is the collector of the on-chip power NPN
switch. V
IN
powers the internal control circuitry when a
voltage on the BIAS pin is not present. High di/dt edges
occur on this pin during switch turn on and off. Keep the
path short from the V
IN
pin through the input bypass
capacitor, through the catch diode back to SW. All trace
inductance on this path will create a voltage spike at switch
off, adding to the V
CE
voltage across the internal NPN.
BOOST (Pin 6): The BOOST pin is used to provide a drive
voltage, higher than the input voltage, to the internal
bipolar NPN power switch. Without this added voltage, the
typical switch voltage loss would be about 1.5V. The
additional BOOST voltage allows the switch to saturate
and its voltage loss approximates that of a 0.2Ω FET
structure, but with much smaller die area.
C
T
(Pin 7): A capacitor on the C
T
pin determines the amount
of delay time between the PGFB pin exceeding its thresh-
old (V
PGFB
) and the PG pin set to a high impedance state.
When the PGFB pin rises above V
PGFB
, current is sourced
from the C
T
pin into the external capacitor. When the volt-
age on the external capacitor reaches an internal clamp
(V
CT
), the PG pin becomes a high impedance node. The
resultant PG delay time is given by t = C
CT
• V
CT
/I
CT
. If the
voltage on the PGFB pin drops below V
PGFB
, C
CT
will be
discharged rapidly to 0V and PG will be active low with a
200μA sink capability. If the C
T
pin is clamped (Power Good
condition) during normal operation and SHDN is taken low,
the C
T
pin will be discharged and a delay period will occur
when SHDN is returned high. See the Power Good section
in Applications Information for details.
GND (Pins 8, 17): The GND pin connection acts as the
reference for the regulated output, so load regulation will
suffer if the “ground” end of the load is not at the same
voltage as the GND pin of the IC. This condition will occur
when load current or other currents flow through metal
paths between the GND pin and the load ground. Keep the
path between the GND pin and the load ground short and
use a ground plane when possible. The GND pin also acts
as a heat sink and should be soldered (along with the
exposed leadframe) to the copper ground plane to reduce
thermal resistance (see Applications Information).
UU
U
PI FU CTIO S
TYPICAL PERFOR A CE CHARACTERISTICS
UW
LT1976 Step Response
V
OUT
100mV/DIV
I
OUT
500mA/DIV
V
IN
= 12V TIME (1ms/DIV) 1976 G18
V
OUT
= 3.3V
C
OUT
= 47μF
I
DC
= 250mA
0A
1A
LT1976/LT1976B
9
1976bfg
UU
U
PI FU CTIO S
C
SS
(Pin 9): A capacitor from the C
SS
pin to the regulated
output voltage determines the output voltage ramp rate
during start-up. When the current through the C
SS
capaci-
tor exceeds the C
SS
threshold (I
CSS
), the voltage ramp of
the output is limited. The C
SS
threshold is proportional to
the FB voltage (see Typical Performance Characteristics)
and is defeated for FB voltage greater than 0.9V (typical).
See Soft-Start section in Applications Information for
details.
BIAS (Pin 10): The BIAS pin is used to improve efficiency
when operating at higher input voltages and light load
current. Connecting this pin to the regulated output volt-
age forces most of the internal circuitry to draw its
operating current from the output voltage rather than the
input supply. This architecture increases efficiency espe-
cially when the input voltage is much higher than the
output. Minimum output voltage setting for this mode of
operation is 3V.
V
C
(Pin 11): The V
C
pin is the output of the error amplifier
and the input of the peak switch current comparator. It is
normally used for frequency compensation, but can also
serve as a current clamp or control loop override. The V
C
pin sits about 0.45V for light loads and 2.2V at current
limit. The LT1976 clamps the V
C
pin slightly below the
burst threshold during sleep periods for better transient
response. Driving the V
C
pin to ground will disable switch-
ing and also place the LT1976 into sleep mode.
FB (Pin 12): The feedback pin is used to determine the
output voltage using an external voltage divider from the
output that generates 1.25V at the FB pin . When the FB pin
drops below 0.9V, switching frequency is reduced, the
SYNC function is disabled and output ramp rate control is
enabled via the C
SS
pin. See the Feedback section in
Applications Information for details.
PGFB (PIN 13): The PGFB pin is the positive input to a
comparator whose negative input is set at V
PGFB
. When
PGFB is taken above V
PGFB
, current (I
CSS
) is sourced into
the C
T
pin starting the PG delay period. When the voltage
on the PGFB pin drops below V
PGFB
, the C
T
pin is rapidly
discharged resetting the PG delay period. The PGFB volt-
age is typically generated by a resistive divider from the
regulated output or input supply. See Power Good section
in Applications Information for details.
SYNC (Pin 14): The SYNC pin is used to synchronize the
internal oscillator to an external signal. It is directly logic
compatible and can be driven with any signal between
20% and 80% duty cycle. The synchronizing range is
equal to maximum initial operating frequency up to 700kHz.
When the voltage on the FB pin is below 0.9V the SYNC
function is disabled. See the Synchronizing section in
Applications Information for details.
SHDN (Pin 15): The SHDN pin is used to turn off the
regulator and to reduce input current to less than 1μA. The
SHDN pin requires a voltage above 1.3V with a typical
source current of 5μA to take the IC out of the shutdown
state.
PG (Pin 16): The PG pin is functional only when the SHDN
pin is above its threshold, and is active low when the
internal clamp on the C
T
pin is below its clamp level and
high impedance when the clamp is active. The PG pin has
a typical sink capability of 200μA. See the Power Good
section in Applications Information for details.

LT1976EFE#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 1.5A, 200kHz uP HV Step-down Converter
Lifecycle:
New from this manufacturer.
Delivery:
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