LPC2212_2214 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 14 June 2011 10 of 47
NXP Semiconductors
LPC2212/2214
Single-chip 16/32-bit ARM microcontrollers
P3[3]/A3 81 O External memory address line 3.
P3[4]/A4 80 O External memory address line 4.
P3[5]/A5 74 O External memory address line 5.
P3[6]/A6 73 O External memory address line 6.
P3[7]/A7 72 O External memory address line 7.
P3[8]/A8 71 O External memory address line 8.
P3[9]/A9 66 O External memory address line 9.
P3[10]/A10 65 O External memory address line 10.
P3[11]/A11 64 O External memory address line 11.
P3[12]/A12 63 O External memory address line 12.
P3[13]/A13 62 O External memory address line 13.
P3[14]/A14 56 O External memory address line 14.
P3[15]/A15 55 O External memory address line 15.
P3[16]/A16 53 O External memory address line 16.
P3[17]/A17 48 O External memory address line 17.
P3[18]/A18 47 O External memory address line 18.
P3[19]/A19 46 O External memory address line 19.
P3[20]/A20 45 O External memory address line 20.
P3[21]/A21 44 O External memory address line 21.
P3[22]/A22 41 O External memory address line 22.
P3[23]/A23/XCLK 40 O A23 — External memory address line 23.
O XCLK — Clock output.
P3[24]/CS3 36 O LOW-active Chip Select 3 signal.
(Bank 3 addresses range 0x8300 0000 to 0x83FF FFFF)
P3[25]/CS2 35 O LOW-active Chip Select 2 signal.
(Bank 2 addresses range 0x8200 0000 to 0x82FF FFFF)
P3[26]/CS1 30 O LOW-active Chip Select 1 signal.
(Bank 1 addresses range 0x8100 0000 to 0x81FF FFFF)
P3[27]/WE 29 O LOW-active Write enable signal.
P3[28]/BLS3/AIN7 28 O BLS3 — LOW-active Byte Lane Select signal (Bank 3).
I AIN7 — ADC, input 7. This analog input is always connected to its pin.
P3[29]/BLS2/AIN6 27 O BLS2 — LOW-active Byte Lane Select signal (Bank 2).
I AIN6 — ADC, input 6. This analog input is always connected to its pin.
P3[30]/BLS1 97 O LOW-active Byte Lane Select signal (Bank 1).
P3[31]/BLS0 96 O LOW-active Byte Lane Select signal (Bank 0).
n.c. 22 Pin not connected.
RESET
135 I external reset input; a LOW on this pin resets the device, causing I/O ports
and peripherals to take on their default states, and processor execution to
begin at address 0. TTL with hysteresis, 5 V tolerant.
XTAL1 142 I input to the oscillator circuit and internal clock generator circuits.
XTAL2 141 O output from the oscillator amplifier.
Table 3. Pin description
…continued
Symbol Pin Type Description
LPC2212_2214 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 14 June 2011 11 of 47
NXP Semiconductors
LPC2212/2214
Single-chip 16/32-bit ARM microcontrollers
[1] SSP interface is available on LPC2212/01 and LPC2214/01 only.
V
SS
3, 9, 26,
38, 54, 67,
79, 93,
103, 107,
111, 128
I ground: 0 V reference
V
SSA
139 I analog ground; 0 V reference. This should nominally be the same voltage as
V
SS
, but should be isolated to minimize noise and error.
V
SSA(PLL)
138 I PLL analog ground; 0 V reference. This should nominally be the same voltage
as V
SS
, but should be isolated to minimize noise and error.
V
DD(1V8)
37, 110 I 1.8 V core power supply; this is the power supply voltage for internal circuitry.
V
DDA(1V8)
143 I analog 1.8 V core power supply; this is the power supply voltage for internal
circuitry. This should be nominally the same voltage as V
DD(1V8)
but should be
isolated to minimize noise and error.
V
DD(3V3)
2, 31, 39,
51, 57, 77,
94, 104,
112, 119
I 3.3 V pad power supply; this is the power supply voltage for the I/O ports
V
DDA(3V3)
14 I analog 3.3 V pad power supply; this should be nominally the same voltage as
V
DD(3V3)
but should be isolated to minimize noise and error
Table 3. Pin description …continued
Symbol Pin Type Description
LPC2212_2214 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 14 June 2011 12 of 47
NXP Semiconductors
LPC2212/2214
Single-chip 16/32-bit ARM microcontrollers
6. Functional description
Details of the LPC2212/2214 systems and peripheral functions are described in the
following sections.
6.1 Architectural overview
The ARM7TDMI-S is a general purpose 32-bit microprocessor, which offers high
performance and very low power consumption. The ARM architecture is based on
Reduced Instruction Set Computer (RISC) principles, and the instruction set and related
decode mechanism are much simpler than those of microprogrammed Complex
Instruction Set Computers. This simplicity results in a high instruction throughput and
impressive real-time interrupt response from a small and cost-effective processor core.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM7TDMI-S processor also employs a unique architectural strategy known as
Thumb, which makes it ideally suited to high-volume applications with memory
restrictions, or applications where code density is an issue.
The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the
ARM7TDMI-S processor has two instruction sets:
The standard 32-bit ARM set.
A 16-bit Thumb set.
The Thumb set’s 16-bit instruction length allows it to approach twice the density of
standard ARM code while retaining most of the ARM’s performance advantage over a
traditional 16-bit processor using 16-bit registers. This is possible because Thumb code
operates on the same 32-bit register set as ARM code.
Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the
performance of an equivalent ARM processor connected to a 16-bit memory system.
6.2 On-chip flash program memory
The LPC2212/2214 incorporate a 128 kB and 256 kB flash memory system respectively.
This memory may be used for both code and data storage. Programming of the flash
memory may be accomplished in several ways. It may be programmed In System via the
serial port. The application program may also erase and/or program the flash while the
application is running, allowing a great degree of flexibility for data storage field firmware
upgrades, etc. When on-chip bootloader is used, 120/248 kB of flash memory is available
for user code.
The LPC2212/2214 flash memory provides a minimum of 100000 erase/write cycles and
20 years of data retention.
On-chip bootloader (as of revision 1.60) provides Code Read Protection (CRP) for the
LPC2212/2214 on-chip flash memory. When the CRP is enabled, the JTAG debug port,
external memory boot and ISP commands accessing either the on-chip RAM or flash
memory are disabled. However, the ISP flash erase command can be executed at any

LPC2214FBD144/01,5

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU ARM7 256KF/16KR/ADC
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