NCL30051
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4
Table 2. MAXIMUM RATINGS (Notes 1 and 2)
Rating Symbol Value Unit
High Voltage Input Voltage V
HV
−0.3 to 600 V
High Voltage Input Current I
HV
10 mA
Supply Input Voltage V
CC
−0.3 to 20 V
Supply Input Current I
CC
10 mA
Oscillator Input Voltage V
OSC
−0.3 to V
REF
V
Oscillator Input Current I
OSC
10 mA
Bandgap Reference Decoupling Output Voltage V
REF
−0.3 to 9 V
Bandgap Reference Decoupling Output Current I
REF
10 mA
PFC Feedback Voltage Input Voltage V
PFB
−0.3 to 10 V
PFC Feedback Voltage Input Current I
PFB
10 mA
PFC Current Sense Input Voltage V
PCS
−0.3 to 10 V
PFC Current Sense Input Current I
PCS
10 mA
PFC Zero Current Detection Input Voltage V
PZCD
−0.3 to 10 V
PFC Zero Current Detection Input Current I
PZCD
10 mA
PFC Control Input Voltage V
PControl
−0.3 to V
REF
V
PFC Control Input Current I
PControl
1.2 mA
PFC On Time Control Input Voltage V
PCT
−0.3 to V
REF
V
PFC On Time Control Input Current I
PCT
9 mA
PFC Drive Signal Voltage V
PDRV
−0.3 to V
CC
V
PFC Drive Signal Current I
PDRV
100 mA
Half−Bridge Low Side Driver Input Voltage V
HDRVlo
−0.3 to V
CC
V
Half−Bridge Low Side Driver Input Current I
HDRVlo
100 mA
Half−Bridge High Side Driver Source Connection Input Voltage V
HVS
−1.0 to 600 V
Half−Bridge High Side Driver Source Connection Input Current I
HVS
100 mA
Half−Bridge High Side Driver Input Voltage V
HDRVhi
−1.3 to V
HVS
+V
CC
V
Half−Bridge High Side Driver Input Current I
HDRVhi
100 mA
Half−Bridge High Side Driver Charge Pump Input Voltage V
HBoost
−0.3 to V
HVS
+V
CC
V
Half−Bridge High Side Driver Charge Pump Input Current I
HBoost
100 mA
High Side Boost Circuit Supply Voltage (between HBoost and HVS pins) V
HBoost(supply)
−0.3 to V
CC
V
High Side Boost Circuit Supply Voltage (between HBoost and HVS pins) I
HBoost(supply)
100 mA
Half−Bridge High Side Driver Source Connection Slew Rate dV
HVS
/dt 50 V/ns
Junction Temperature (Biased) T
J
150 °C
Storage Temperature Range T
stg
–60 to 150 °C
Power Dissipation (T
A
= 25°C, 1 Oz Cu, 0.155 Sq Inch, Printed Circuit Copper Clad)
D Suffix, Plastic Package Case 751B−05 (SOIC−16)
P
D
0.95 W
Thermal Resistance, Junction to Ambient
(1 Oz Cu, 0.155 Sq Inch, Printed Circuit Copper Clad)
D Suffix, Plastic Package Case 751B−05 (SOIC−16)
R
θ
JA
130 °C/W
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device(s) contains ESD protection and exceeds the following tests:
Pins 1, 14, 15 and 16 rated to the maximum voltage of the respective pins based on the maximum ratings table.
All Other Pins: Human Body Model 1500 V per JEDEC Standard JESD22−A114E.
All Other Pins: Machine Model 150 V per JEDEC Standard JESD22−A115−A.
2. This device contains Latch−Up protection and exceeds ± 100 mA per JEDEC Standard JESD78.