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IR3507MTRPBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P19
IR3507PbF
Page 16 of 19 IR Confidential April 2, 2009
NOT RECOMMENDED FOR NEW DESIGNS
REPLACEMENT PRODUCT – IR3507ZPBF
PCB Metal and Component Placement
• Lead land width should be equal to nominal part lead width. The minimum lead to lead spacing should be
0.2mm to minimize shorting.
• Lead land length should be equal to maximum part lead length + 0.3 mm outboard extension + 0.05mm
inboard extension. The outboard extension ensures a large and inspectable toe fillet, and the inboard
extension will accommodate any part misalignment and ensure a fillet.
• Center pad land length and width should be equal to maximum part pad length and width. However, the
minimum metal to metal spacing should be 0.17mm for 2 oz. Copper ( 0.1mm for 1 oz. Copper and
0.23mm for 3 oz. Copper)
• Four 0.3mm diameter vias shall be placed in the pad land spaced at 1.2mm, and connected to ground to
minimize the noise effect on the IC and to transfer heat to the PCB.
• No PCB traces should be routed nor vias placed under any of the 4 corners of the IC package. Doing so can
cause the IC to rise up from the PCB resulting in poor solder joints to the IC leads.
IR3507PbF
Page 17 of 19 IR Confidential April 2, 2009
NOT RECOMMENDED FOR NEW DESIGNS
REPLACEMENT PRODUCT – IR3507ZPBF
Solder Resist
• The solder resist should be pulled away from the metal lead lands and center pad by a minimum of 0.06mm.
The solder resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all
Non Solder Mask Defined (NSMD). Therefore, pulling the S/R 0.06mm will always ensure NSMD pads.
• The minimum solder resist width is 0.13mm. At the inside corner of the solder resist where the lead land
groups meet, it is recommended to provide a fillet so a solder resist width of 0.17mm remains.
• Ensure that the solder resist in-between the lead lands and the pad land is 0.15mm due to the high aspect
ratio of the solder resist strip separating the lead lands from the pad land.
• The 4 vias in the land pad should be tented with solder resist 0.4mm diameter, or 0.1mm larger than the
diameter of the via.
IR3507PbF
Page 18 of 19 IR Confidential April 2, 2009
NOT RECOMMENDED FOR NEW DESIGNS
REPLACEMENT PRODUCT – IR3507ZPBF
Stencil Design
• The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands.
Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm pitch
devices the leads are only 0.25mm wide, the stencil apertures should not be made narrower; openings in
stencils < 0.25mm wide are difficult to maintain repeatable solder release.
• The stencil lead land apertures should therefore be shortened in length by 80% and centered on the lead
land.
• The land pad aperture should be striped with 0.25mm wide openings and spaces to deposit approximately
50% area of solder on the center pad. If too much solder is deposited on the center pad the part will float
and the lead lands will be open.
• The maximum length and width of the land pad stencil aperture should be equal to the solder resist opening
minus an annular 0.2mm pull back to decrease the incidence of shorting the center land to the lead lands
when the part is pushed into the solder paste.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P19

IR3507MTRPBF

Mfr. #:
Buy IR3507MTRPBF
Manufacturer:
Infineon / IR
Description:
Power Management Specialized - PMIC XPHASE3 DDR VTT 7V 2A 3 Wire
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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