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S25FL256SAGMFVR00

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P29
©2011 Silicon Storage Technology, Inc. DS25076A 10/11
25
512 Kbit SPI Serial Flash
SST25VF512
Data Sheet
A
Microchip Technology Company
Product Ordering Information
Valid combinations for SST25VF512
SST25VF512-20-4C-SAE SST25VF512-20-4C-QAE
Note:Valid combinations are those products in mass production or will be in mass production. Consult your SST
sales representative to confirm availability of valid combinations and to determine availability of new combi-
nations.
SST 25 VF 512 - 20 - 4C - SAE
XX XX XXX - XX - XX
-
XXX
Environmental Attribute
E
1
= non-Pb
Package Modifier
A = 8 leads or contacts
Package Type
S = SOIC
Q = WSON
Temperature Range
C = Commercial = 0°C to +70°C
Minimum Endurance
4 = 10,000 cycles
Operating Frequency
20 = 20 MHz
Device Density
512 = 512 Kbit
Voltage
V = 2.7-3.6V
Product Series
25 = Serial Peripheral Interface flash
memory
1. Environmental suffix “E” denotes non-Pb solder.
SST non-Pb solder devices are “RoHS Compliant”.
©2011 Silicon Storage Technology, Inc. DS25076A 10/11
26
512 Kbit SPI Serial Flash
SST25VF512
Data Sheet
A
Microchip Technology Company
Packaging Diagrams
Figure 21: 8-lead Small Outline Integrated Circuit (SOIC) 150 mil body width (4.9mm x 6mm)
SST Package Code: SA
08-soic-5x6-SA-8
Note: 1. Complies with JEDEC publication 95 MS-012 AA dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends and 0.25 mm between leads.
TOP VIEW
SIDE VIEW
END VIEW
5.0
4.8
6.20
5.80
4.00
3.80
Pin #1
Identifier
0.51
0.33
1.27 BSC
0.25
0.10
1.75
1.35
7°
4 places
0.25
0.19
1.27
0.40
45°
7°
4 places
0°
8°
1mm
©2011 Silicon Storage Technology, Inc. DS25076A 10/11
27
512 Kbit SPI Serial Flash
SST25VF512
Data Sheet
A
Microchip Technology Company
Figure 22: 8-contact Very-very-thin Small Outline No-lead (WSON)
SST Package Code: QA
Note: 1. All linear dimensions are in millimeters (max/min).
2. Untoleranced dimensions (shown with box surround)
are nominal target dimensions.
3. The external paddle is electrically connected to the
die back-side and possibly to certain V
SS
leads.
This paddle can be soldered to the PC board;
it is suggested to connect this paddle to the V
SS
of the unit.
Connection of this paddle to any other voltage potential can
result in shorts and/or electrical malfunction of the device.
8-wson-5x6-QA-9.0
4.0
1.27 BSC
Pin #1
0.48
0.35
0.076
3.4
5.00 ± 0.10
6.00 ± 0.10
0.05 Max
0.70
0.50
0.80
0.70
0.80
0.70
Pin #1
Corner
TOP VIEW BOTTOM VIEW
CROSS SECTION
SIDE VIEW
1mm
0.2
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P29

S25FL256SAGMFVR00

Mfr. #:
Buy S25FL256SAGMFVR00
Manufacturer:
Cypress Semiconductor
Description:
NOR Flash Nor
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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