©2011 Silicon Storage Technology, Inc. DS25076A 10/11
28
512 Kbit SPI Serial Flash
SST25VF512
Data Sheet
Microchip Technology Company
Table 14: Revision History
Revision Description Date
00
• Initial release
May 2001
01
• Remove Cycles 6&7forRead and Write operations.
• Swapped Ready#/Busy logic. (1 = busy, 0 = not busy)
• Change WP# description
• Added SPI protocol timing diagram.
• Updated all timing diagrams
• Remove all Reset# pin description.
• Add HOLD# description.
• Updated Transient Voltage parameter.
• Add Auto Address Increment (AAI) feature and description.
• Global layout changes.
• Updated all Instruction descriptions.
Jan 2002
02
• Removed 15H and 1DH commands for Read ID
Apr 2002
03
• Moved the 2 Mbit and 4 Mbit parts to data sheet S71231
• Moved the 1 Mbit part to data sheet S71233
• Changed AC timing parameter T
CES
and T
CEH
timings to 20 ns
• AC timing point corrected in Figure 19
• Added RDSR instruction in Figure 6
• Added System Power-up Timing
• Re-aligned CE# with CLK in Mode 3 for all figures
• Corrected block address range to A
MS
-A
15
in “Block-Erase” on
page 14
Apr 2003
04
• Removed Industrial temperature parts
• Updated Figures 2, 4 - 14: Aligned SI waveform with rising edge of
clock
Aug 2003
05
• 2004 Data Book
Dec 2003
06
• Added footnote 2 to Table 3 on page 8 (PSN: C0250001)
Apr 2004
07
• Added RoHS compliance information on page 1 and in the “Product
Ordering Information” on page 25
• Updated the surface mount lead temperature from 240°C to 260°C
and the time from 3 seconds to 10 seconds on page 19.
Jan 2005
08
• Revised the Absolute Max. Stress Ratings for Surface Mount Solder
Reflow Temp.
Nov 2005
09
• Updated QA package drawing to version 9.
• Removed leaded parts.
Jan 2006
A
• Applied new document format
• Released document under letter revision system
• Updated Spec number S71192 to DS25076
Oct 2011
