13
FN6831.0
February 4, 2009
Separate enable pins allow for full soft-start sequencing.
Because low shutdown quiescent current is necessary to
prolong battery life in notebook applications, the LDO5 5V
LDO is held off until any of the three enable signals (EN1,
EN2 or LDO3EN) is pulled high. Soft-start of all outputs will
only start until after LDO5 is above the 4.2V POR threshold.
In addition to user-programmable sequencing, the ISL62386
includes a pre-programmed sequential SMPS soft-start
feature. Table 1 shows the SMPS enable truth table.
VCC
The VCC nominal operation voltage is 5V. If EN1, EN2 and
LDO3EN are all logic low, the VCC start-up voltage is 3.6V
when VIN is applied on ISL62386. As described before, the
LDO5 5V LDO is held off until any of the three enable signals
(EN1, EN2 or LDO3EN) is pulled high. When LDO5 is above
the 4.2V VCC POR threshold, VCC will switchover to LDO5.
After VIN is applied, the VCC start-up 3.6V voltage can be used
as the logic high signal of any of EN1, EN2 and LDO3EN to
enable LDO5 if there is no other power supply on the board.
MOSFET Gate-Drive Outputs LGATE and UGATE
The ISL62386 has internal gate-drivers for the high-side and
low-side N-Channel MOSFETs. The low-side gate-drivers
are optimized for low duty-cycle applications where the
low-side MOSFET conduction losses are dominant,
requiring a low r
DS(ON)
MOSFET. The LGATE pull-down
resistance is small in order to clamp the gate of the MOSFET
below the V
GS(th)
at turnoff. The current transient through
the gate at turn-off can be considerable because the gate
charge of a low r
DS(ON)
MOSFET can be large. Adaptive
shoot-through protection prevents a gate-driver output from
turning on until the opposite gate-driver output has fallen
below approximately 1V. The dead-time shown in Figure 25
is extended by the additional period that the falling gate
voltage stays above the 1V threshold. The typical dead-time
is 21ns. The high-side gate-driver output voltage is
measured across the UGATE and PHASE pins while the
low-side gate-driver output voltage is measured across the
LGATE and PGND pins. The power for the LGATE
gate-driver is sourced directly from the LDO5 pin. The power
for the UGATE gate-driver is sourced from a “boot” capacitor
connected across the BOOT and PHASE pins. The boot
capacitor is charged from the 5V LDO5 supply through a
“boot diode” each time the low-side MOSFET turns on,
pulling the PHASE pin low. The ISL62386 has integrated
boot diodes connected from the LDO5 pins to BOOT pins.
Diode Emulation
FCCM is a logic input that controls the power state of the
ISL62386. If forced high, the ISL62386 will operate in forced
continuous-conduction-mode (CCM) over the entire load
range. This will produce the best transient response to all
load conditions, but will have increased light-load power
loss. If FCCM is forced low, the ISL62386 will automatically
operate in diode-emulation-mode (DEM) at light load to
optimize efficiency in the entire load range. The transition is
automatically achieved by detecting the load current and
turning off LGATE when the inductor current reaches 0A.
Positive-going inductor current flows from either the source
of the high-side MOSFET, or the drain of the low-side
MOSFET. Negative-going inductor current flows into the
drain of the low-side MOSFET. When the low-side MOSFET
conducts positive inductor current, the phase voltage will be
negative with respect to the GND and PGND pins.
Conversely, when the low-side MOSFET conducts negative
TABLE 1. SMPS ENABLE SEQUENCE LOGIC
EN1 EN2 START-UP SEQUENCE
0 0 Both SMPS outputs OFF simultaneously
0 Float Both SMPS outputs OFF simultaneously
Float 0 Both SMPS outputs OFF simultaneously
Float Float Both SMPS outputs OFF simultaneously
0 1 SMPS1 OFF, SMPS2 ON
1 0 SMPS1 ON, SMPS2 OFF
1 1 Both SMPS outputs ON simultaneously
Float 1 SMPS1 enabled after SMPS2 is in regulation
1 Float SMPS2 enabled after SMPS1 is in regulation
FIGURE 24. SOFT-START SEQUENCE FOR ONE SMPS
VCC and LDO5
VOUT
EN
PGOOD
FB
1.5ms
2.75ms
t
SOFT-START
PGOOD Delay
FIGURE 25. LGATE AND UGATE DEAD-TIME
UGATE
LGATE
50%
50%
t
LGFUGR
t
UGFLGR
ISL62386
14
FN6831.0
February 4, 2009
inductor current, the phase voltage will be positive with
respect to the GND and PGND pins. The ISL62386 monitors
the phase voltage when the low-side MOSFET is conducting
inductor current to determine its direction.
When the output load current is greater than or equal to ½
the inductor ripple current, the inductor current is always
positive, and the converter is always in CCM. The ISL62386
minimizes the conduction loss in this condition by forcing the
low-side MOSFET to operate as a synchronous rectifier.
When the output load current is less than ½ the inductor
ripple current, negative inductor current occurs. Sinking
negative inductor current through the low-side MOSFET
lowers efficiency through unnecessary conduction losses.
The ISL62386 automatically enters DEM after the PHASE
pin has detected positive voltage and LGATE was allowed to
go high for eight consecutive PWM switching cycles. The
ISL62386 will turn off the low-side MOSFET once the phase
voltage turns positive, indicating negative inductor current.
The ISL62386 will return to CCM on the following cycle after
the PHASE pin detects negative voltage, indicating that the
body diode of the low-side MOSFET is conducting positive
inductor current.
Efficiency can be further improved with a reduction of
unnecessary switching losses by reducing the PWM
frequency. It is characteristic of the R
3
architecture for the
PWM frequency to decrease while in diode emulation. The
extent of the frequency reduction is proportional to the
reduction of load current. Upon entering DEM, the PWM
frequency makes an initial step-reduction because of a 33%
step-increase of the window voltage V
W
.
Because the switching frequency in DEM is a function of
load current, very light load conditions can produce
frequencies well into the audio band. This can be
problematic if audible noise is coupled into audio amplifier
circuits. To prevent this from occurring, the ISL62386 allows
the user to float the FCCM input. This will allow DEM at light
loads, but will prevent the switching frequency from going
below ~28kHz to prevent noise injection into the audio band.
A timer is reset each PWM pulse. If the timer exceeds 30µs,
LGATE is turned on, causing the ramp voltage to reduce until
another UGATE is commanded by the voltage loop.
Overcurrent Protection
The overcurrent protection (OCP) setpoint is programmed
with resistor, R
OCSET
, that is connected across the OCSET
and PHASE pins.
Figure 26 shows the overcurrent-set circuit for SMPS1. The
inductor consists of inductance L and the DC resistance
(DCR). The inductor DC current I
L
creates a voltage drop
across DCR, given by Equation 6:
The ISL62386 sinks a 10µA current into the OCSET1 pin,
creating a DC voltage drop across the resistor R
OCSET
,
given by Equation 7:
Resistor R
O
is connected between the ISEN1 pin and the
actual output of the converter. During normal operation, the
ISEN1 pin is a high impedance path, therefore there is no
voltage drop across R
O
. The DC voltage difference between
the OCSET1 pin and the ISEN1 pin can be established using
Equation 8:
The ISL62386 monitors the OCSET1 pin and the ISEN1 pin
voltages. Once the OCSET1 pin voltage is higher than the
ISEN1 pin voltage for more than 10µs, the ISL62386 declares
an OCP fault. The value of R
OCSET
is then written as
Equation 9:
Where:
-R
OCSET
(Ω) is the resistor used to program the
overcurrent setpoint
-I
OC
is the output current threshold that will activate the
OCP circuit
- DCR is the inductor DC resistance
For example, if I
OC
is 20A and DCR is 4.5mΩ, the choice of
R
OCSET
is R
OCSET
= 20Ax4.5mΩ/10µA = 9kΩ.
Resistor R
OCSET
and capacitor C
SEN
form an RC network
to sense the inductor current. To sense the inductor current
correctly, not only in DC operation but also during dynamic
operation, the RC network time constant R
OCSET
C
SEN
needs to match the inductor time constant L/DCR. The value
of C
SEN
is then written as Equation 10:
For example, if L is 1.5µH, DCR is 4.5mΩ, and R
OCSET
is
9kΩ, the choice of C
SEN
= 1.5µH/(9kΩ x 4.5mΩ) = 0.037µF.
Upon converter start-up, the C
SEN
capacitor bias is 0V. To
prevent false OCP during this time, a 10µA current source
V
DCR
I
L
DCR=
(EQ. 6)
FIGURE 26. OVERCURRENT-SET CIRCUIT
PHASE1
C
O
L
V
O
R
OCSET
C
SEN
OCSET1
ISEN1
R
O
ISL62386
DCR
I
L
10µF
+
_
V
DCR
+
_
V
ROCSET
V
ROCSET
10μAR
OCSET
=
(EQ. 7)
V
OCSET1
V
ISEN1
I
L
DCR 10μAR
OCSET
=
(EQ. 8)
(EQ. 9)
R
OCSET
I
OC
DCR
10μA
---------------------------
=
(EQ. 10)
C
SEN
L
R
OCSET
DCR
-----------------------------------------
=
ISL62386
15
FN6831.0
February 4, 2009
flows out of the ISEN1 pin, generating a voltage drop on the
R
O
resistor, which should be chosen to have the same
resistance as R
OCSET
. When PGOOD pin goes high, the
ISEN1 pin current source will be removed.
When an OCP fault is detected in one SMPS channel, the
PGOOD pin will pull down to 32Ω. The ISL62386 turns the
faulted channel UGATE and LGATE off and latches off the
faulted channel.
The fault will remain latched until either of the EN pins has
been pulled below the falling EN threshold voltage, or until
V
IN
has decayed below the falling POR threshold.
When using a discrete current sense resistor, inductor
time-constant matching is not required. Equation 7 remains
unchanged, but Equation 8 is modified in Equation 11:
Furthermore, Equation 9 is changed in Equation 12:
Where R
SENSE
is the series power resistor for sensing
inductor current. For example, with an R
SENSE
= 1mΩ and
an OCP target of 10A, R
OCSET
= 1kΩ.
Overvoltage Protection
The OVP fault detection circuit triggers after the FB pin
voltage is above the rising overvoltage threshold for more
than 2µs. The FB pin voltage is 0.6V in normal operation.
The rising overvoltage threshold is typically 116% of that
value, or 1.16*0.6V = 0.696V.
If an OVP is detected in one SMPS channel, the PGOOD pin
will pull-down to 32Ω, and the LGATE gate-driver will turn on
the low-side MOSFET to discharge the output voltage, thus
protecting the load from potentially damaging voltage levels.
Once the FB pin voltage falls to 106% of the reference
voltage, or 1.06*0.6V = 0.636V, the faulted channel will
resume the normal switching, and PGOOD will go high when
the output voltage is in regulation. This process repeats as
long as the OVP fault is present.
Undervoltage Protection
The UVP fault detection circuit triggers after the FB pin
voltage is below the undervoltage threshold for more than
2µs. The undervoltage threshold is typically 86% of the
reference voltage, or 0.86*0.6V = 0.516V.
If a UVP fault is detected in one SMPS channel, the PGOOD
pin will pull-down to 32Ω. The ISL62386 turns the faulted
channel UGATE and LGATE off and latches off the faulted
channel.
The fault will remain latched until either of the EN pins has
been pulled below the falling EN threshold voltage, or until
VIN has decayed below the falling POR threshold.
Programming the Output Voltage
When the converter is in regulation there will be 0.6V
between the FB and GND pins. Connect a two-resistor
voltage divider across the OUT and GND pins with the
output node connected to the FB pin as shown in Figure 27.
Scale the voltage-divider network such that the FB pin is
0.6V with respect to the GND pin when the converter is
regulating at the desired output voltage. The output voltage
can be programmed from 0.6V to 5.5V.
Programming the output voltage is written as Equation 13:
Where:
-V
OUT
is the desired output voltage of the converter
- The voltage to which the converter regulates the FB pin
is the V
REF
(0.6V)
-R
TOP
is the voltage-programming resistor that connects
from the FB pin to the converter output. In addition to
setting the output voltage, this resistor is part of the loop
compensation network
-R
BOTTOM
is the voltage-programming resistor that
connects from the FB pin to the GND pin
Choose R
TOP
first when compensating the control loop, and
then calculate R
BOTTOM
according to Equation 14:
Compensation Design
Figure 27 shows the recommended Type-II compensation
circuit. The FB pin is the inverting input of the error amplifier.
The COMP signal, the output of the error amplifier, is inside the
chip and unavailable to users. C
INT
is a 100pF capacitor
integrated inside the IC that connects across the FB pin and the
COMP signal. R
TOP
, R
FB
, C
FB
and C
INT
form the Type-II
compensator. The frequency domain transfer function is given
by Equation15:
V
OCSET1
V
ISEN1
I
L
R
SENSE
10μAR
OCSET
=
(EQ. 11)
R
OCSET
I
OC
R
SENSE
10μA
-------------------------------------
=
(EQ. 12)
V
OUT
V
REF
1
R
TOP
R
BOTTOM
---------------------------- -
+
⎝⎠
⎜⎟
⎛⎞
=
(EQ. 13)
R
BOTTOM
V
REF
R
TOP
V
OUT
V
REF
-------------------------------------
=
(EQ. 14)
(EQ. 15)
G
COMP
s()
1sR
TOP
R
FB
+()C
FB
+
sR
TOP
C
INT
1sR
FB
C
FB
+()
-------------------------------------------------------------------------------------------
=
ISL62386
R
BOTTOM
EA
+
FB
C
INT
= 100pF
-
REF
VO
FIGURE 27. COMPENSATION REFERENCE CIRCUIT
R
TOP
R
FB
C
FB
COMP
ISL62386

ISL62386HRTZ-T

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Switching Controllers QD-OUTPUT SYSTEM CNTRLR 5X5 TQFN
Lifecycle:
New from this manufacturer.
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