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PCA8575BQ,118
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P30
PCA8575_2
© NXP B.V
. 2007. All rights reserved.
Product data sheet
Rev
. 02 — 21 March 2007
19 of 30
NXP Semiconductors
PCA8575
Remote 16-bit I/O expander f
or I
2
C-bus with interrupt
14.
P
acka
g
e outline
Fig 22.
P
ackage outline SO
T137-1 (SO24)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
(1)
eH
E
LL
p
Q
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
2.65
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT137-1
X
12
24
w
M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
c
L
v
M
A
13
(A )
3
A
y
0.25
075E05
MS-013
pin 1 index
0.1
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.61
0.60
0.30
0.29
0.05
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
e
1
0
5
10 mm
scale
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
99-12-27
03-02-19
PCA8575_2
© NXP B.V
. 2007. All rights reserved.
Product data sheet
Rev
. 02 — 21 March 2007
20 of 30
NXP Semiconductors
PCA8575
Remote 16-bit I/O expander f
or I
2
C-bus with interrupt
Fig 23.
P
ackage outline SO
T340-1 (SSOP24)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
8.4
8.0
5.4
5.2
0.65
1.25
7.9
7.6
0.9
0.7
0.8
0.4
8
0
o
o
0.13
0.1
0.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
1.03
0.63
SOT340-1
MO-150
99-12-27
03-02-19
X
w
M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
11
2
24
13
0.25
y
pin 1 index
0
2.5
5 mm
scale
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
A
max.
2
PCA8575_2
© NXP B.V
. 2007. All rights reserved.
Product data sheet
Rev
. 02 — 21 March 2007
21 of 30
NXP Semiconductors
PCA8575
Remote 16-bit I/O expander f
or I
2
C-bus with interrupt
Fig 24.
P
ackage outline SO
T556-1 (SSOP24)
UNIT
A
1
A
2
A
3
H
E
L
p
b
p
cD
(1)
E
(1)
Z
(1)
eL
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.25
0.10
1.55
1.40
0.25
0.31
0.20
0.25
0.18
8.8
8.6
4.0
3.8
0.635
1
6.2
5.8
0.89
0.41
1.05
0.66
8
0
o
o
8
0
o
o
0.18
0.25
0.1
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm (0.008 inch) maximum per side are not included.
SOT556-1
99-12-27
03-02-18
w
M
b
p
D
H
E
E
Z
e
c
v
M
A
X
A
y
1
12
24
13
θ
A
A
1
A
2
L
p
detail X
L
(A )
3
MO-137
0
2.5
5 mm
scale
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm
SOT556-1
A
max.
1.73
inches
0.0098
0.0040
0.061
0.055
0.01
0.012
0.008
0.0098
0.0075
0.344
0.337
0.157
0.150
0.025
0.041
0.244
0.228
0.035
0.016
0.040
0.026
0.007
0.01
0.004
0.068
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P30
PCA8575BQ,118
Mfr. #:
Buy PCA8575BQ,118
Manufacturer:
NXP Semiconductors
Description:
IC I/O EXPANDER I2C 16B 24DHVQFN
Lifecycle:
New from this manufacturer.
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