PCA8575_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 21 March 2007 5 of 30
NXP Semiconductors
PCA8575
Remote 16-bit I/O expander for I
2
C-bus with interrupt
6.2 Pin description
[1] HVQFN and DHVQFN package die supply ground is connected to both the V
SS
pin and the exposed center
pad. The V
SS
pin must be connected to supply ground for proper device operation. For enhanced thermal,
electrical, and board-level performance, the exposed pad needs to be soldered to the board using a
corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias
need to be incorporated in the PCB in the thermal pad region.
Table 2. Pin description
Symbol Pin Description
SO24, SSOP24,
TSSOP24, DHVQFN24
HVQFN24
INT 1 22 interrupt output (active LOW)
AD1 2 23 address input 1
AD2 3 24 address input 2
P00 4 1 quasi-bidirectional I/O 00
P01 5 2 quasi-bidirectional I/O 01
P02 6 3 quasi-bidirectional I/O 02
P03 7 4 quasi-bidirectional I/O 03
P04 8 5 quasi-bidirectional I/O 04
P05 9 6 quasi-bidirectional I/O 05
P06 10 7 quasi-bidirectional I/O 06
P07 11 8 quasi-bidirectional I/O 07
V
SS
12
[1]
9
[1]
supply ground
P10 13 10 quasi-bidirectional I/O 10
P11 14 11 quasi-bidirectional I/O 11
P12 15 12 quasi-bidirectional I/O 12
P13 16 13 quasi-bidirectional I/O 13
P14 17 14 quasi-bidirectional I/O 14
P15 18 15 quasi-bidirectional I/O 15
P16 19 16 quasi-bidirectional I/O 16
P17 20 17 quasi-bidirectional I/O 17
AD0 21 18 address input 0
SCL 22 19 serial clock line input
SDA 23 20 serial data line input/output
V
DD
24 21 supply voltage