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PCA8575BQ,118

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30
PCA8575_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 21 March 2007 22 of 30
NXP Semiconductors
PCA8575
Remote 16-bit I/O expander for I
2
C-bus with interrupt
Fig 25. Package outline SOT355-1 (TSSOP24)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
7.9
7.7
4.5
4.3
0.65
6.6
6.2
0.4
0.3
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT355-1 MO-153
99-12-27
03-02-19
0.25
0.5
0.2
w M
b
p
Z
e
112
24
13
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
D
y
0 2.5 5 mm
scale
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
A
max.
1.1
PCA8575_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 21 March 2007 23 of 30
NXP Semiconductors
PCA8575
Remote 16-bit I/O expander for I
2
C-bus with interrupt
Fig 26. Package outline SOT815-1 (DHVQFN24)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
SOT815-1 - - - - - - - - -
03-04-29
SOT815-1
0 2.5 5 mm
scale
b
y
y
1
C
C
AC
C
B
v
M
w
M
e
1
e
2
terminal 1
index area
terminal 1
index area
X
UNIT
A
(1)
max.
A
1
bc eE
h
Le
1
ywv
mm
1
0.05
0.00
0.30
0.18
0.5 4.5
e
2
1.50.2
2.25
1.95
D
h
4.25
3.95
0.05 0.05
y
1
0.10.1
DIMENSIONS (mm are the original dimensions)
0.5
0.3
D
(1)
5.6
5.4
E
(1)
3.6
3.4
D
E
B
A
e
DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package;
no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm
A
A
1
c
detail X
E
h
L
D
h
2
23
11
14
13
12
1
24
PCA8575_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 21 March 2007 24 of 30
NXP Semiconductors
PCA8575
Remote 16-bit I/O expander for I
2
C-bus with interrupt
Fig 27. Package outline SOT616-1 (HVQFN24)
0.51 0.2
A
1
E
h
b
UNIT
ye
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
4.1
3.9
D
h
2.25
1.95
y
1
4.1
3.9
2.25
1.95
e
1
2.5
e
2
2.5
0.30
0.18
c
0.05
0.00
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT616-1 MO-220 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT616-1
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
712
24
19
18
13
6
1
X
D
E
C
B
A
e
2
01-08-08
02-10-22
terminal 1
index area
terminal 1
index area
AC
C
B
v
M
w
M
1/2 e
1/2 e
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
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PCA8575BQ,118

Mfr. #:
Buy PCA8575BQ,118
Manufacturer:
NXP Semiconductors
Description:
IC I/O EXPANDER I2C 16B 24DHVQFN
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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