PCK9456_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 31 July 2006 16 of 18
Philips Semiconductors
PCK9456
2.5 V and 3.3 V LVCMOS clock fan-out buffer
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
14. Abbreviations
15. Revision history
Table 16. Abbreviations
Acronym Description
CMOS Complementary Metal Oxide Semiconductor
DUT Device Under Test
HBM Human Body Model
LVCMOS Low Voltage Complementary Metal Oxide Semiconductor
LVPECL Low Voltage Positive Emitter Coupled Logic
MM Machine Model
PECL Positive Emitter Coupled Logic
Table 17. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PCK9456_1 20060731 Product data sheet - -
PCK9456_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 31 July 2006 17 of 18
Philips Semiconductors
PCK9456
2.5 V and 3.3 V LVCMOS clock fan-out buffer
16. Legal information
16.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL
http://www.semiconductors.philips.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Philips Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Philips Semiconductors
sales office. In case of any inconsistency or conflict with the short data sheet,
the full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, Philips Semiconductors does not give any representations
or warranties, expressed or implied, as to the accuracy or completeness of
such information and shall have no liability for the consequences of use of
such information.
Right to make changes — Philips Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — Philips Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a Philips Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. Philips Semiconductors accepts no liability for inclusion and/or use
of Philips Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Philips Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and and
operation of the device at these or any other conditions above those given in
the Characteristics sections of this document is not implied. Exposure to
limiting values for extended periods may affect device reliability.
Terms and conditions of sale — Philips Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at
http://www.semiconductors.philips.com/profile/terms, including those
pertaining to warranty, intellectual property rights infringement and limitation
of liability, unless explicitly otherwise agreed to in writing by Philips
Semiconductors. In case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
Philips Semiconductors
PCK9456
2.5 V and 3.3 V LVCMOS clock fan-out buffer
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.
Date of release: 31 July 2006
Document identifier: PCK9456_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
18. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Functional description . . . . . . . . . . . . . . . . . . . 4
6.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Recommended operating conditions. . . . . . . . 5
9 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
10 Application information. . . . . . . . . . . . . . . . . . 10
10.1 Driving transmission lines. . . . . . . . . . . . . . . . 10
11 Test information. . . . . . . . . . . . . . . . . . . . . . . . 12
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
13 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
13.1 Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
13.2 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 14
13.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 14
13.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 15
13.5 Package related soldering information . . . . . . 15
14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 16
15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16
16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
17 Contact information. . . . . . . . . . . . . . . . . . . . . 17
18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

PCK9456BD,151

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC CLK BUFFER 1:10 250MHZ 32LQFP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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