ADV7280 Data Sheet
Rev. A | Page 28 of 28
OUTLINE DIMENSIONS
08-16-2010-B
1
0.50
BSC
BOTTOM VIEWTOP VIEW
PIN 1
INDICATOR
32
9
16
17
24
25
8
EXPOSED
PAD
PIN 1
INDIC
A
TOR
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.50
0.40
0.30
0.25 MIN
*
3.75
3.60 SQ
3.55
*
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-5
WITH THE EXCEPTION OF THE EXPOSED PAD DIMENSION.
Figure 18. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad
(CP-32-12)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1, 2
Temperature Range Package Description Package Option
32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
ADV7280WBCPZ-RL −40°C to +105°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-12
ADV7280BCPZ −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-12
ADV7280BCPZ-RL −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-12
ADV7280KCPZ −10°C to +70°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-12
ADV7280KCPZ-RL −10°C to +70°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-12
ADV7280WBCPZ-M −40°C to +105°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-12
ADV7280WBCPZ-M-RL −40°C to +105°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-12
ADV7280BCPZ-M −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-12
ADV7280BCPZ-M-RL −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-12
ADV7280KCPZ-M −10°C to +70°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-12
32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
EVAL-ADV7280EBZ Evaluation Board for the ADV7280
EVAL-ADV7280MEBZ Evaluation Board for the ADV7280-M
1
Z = RoHS Compliant Part.
2
W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The ADV7280W models are available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers should
review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in automotive
applications. Contact your local Analog Devices account representative for specific product ordering information and to obtain the specific
Automotive Reliability reports for these models.
I
2
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
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D11634-0-2/14(A)