RBic
Lite
TM
Analog Output
Sensor Signal Conditioner
ZSC31010
Datasheet
© 2016 Integrated Device Technology, Inc.
1
January 20, 2016
ZSC31010
Bsink
VBP
VBN
VSS
Sig™
Vgate
0.1µF
V
supply
Ground
+4.5 to +5.5 V
OUT/OWI
VDD
10nF
Brief Description
The ZSC31010 is a sensor signal conditioner inte-
grated circuit, which enables easy and precise
calibration of resistive bridge sensors via EEPROM.
When mated to a resistive bridge sensor, it will
digitally correct offset and gain with the option to
correct offset and gain coefficients and linearity over
temperature. A second-order compensation can be
enabled for temperature coefficients of gain or offset
or bridge linearity. The ZSC31010 communicates via
IDT’s ZACwire™ serial interface to the host
computer and is easily mass calibrated in a
Windows® environment. Once calibrated, the output
pin Sig™ can provide selectable 0 to 1 V, rail-to-rail
ratiometric analog output, or digital serial output of
bridge data with optional temperature data.
Features
Digital compensation of sensor offset, sensitivity,
temperature drift, and non-linearity
Accommodates differential sensor signal spans,
from 3 mV/V to 105 mV/V
ZACwire™ One-Wire Interface (OWI)
Internal temperature compensation and detection
via bandgap PTAT (proportional to absolute
temperature)
Output options: rail-to-rail analog output voltage,
absolute analog voltage, digital ZACwireOne-
Wire Interface (OWI)
Optional sequential output of both temperature
and bridge readings on ZACwire™ digital output
Fast response time, 1 ms (typical)
High voltage protection up to 30 V with
external JFET
Chopper-stabilized true differential ADC
Buffered and chopper-stabilized output DAC
Benefits
No external trimming components required
Simple PC-controlled configuration and
calibration via ZACwire™ One-Wire Interface
High accuracy (±0.1% FSO @ -25 to 85°C;
±0.25% FSO @ -50 to 150°C)
Single pass calibration quick and precise
Suitable for battery-powered applications
Small SOP8 package
Available Support
Development Kit available
Mass Calibration Kit available
Support for industrial mass calibration available
Quick circuit customization possible for large
production volumes
Physical Characteristics
Supply voltage 2.7 to 5.5 V, with external JFET
5.5V to 30 V
Current consumption depending on adjusted
sample rate: 0.25 mA to 1 mA
Wide operational temperature: 50 to +150°C
ZSC31010 Application CircuitDigital Output
RBic
Lite
TM
Analog Output
Sensor Signal Conditioner
ZSC31010
Datasheet
© 2016 Integrated Device Technology, Inc.
2
January 20, 2016
2
1
5
6
7
8
3
4
ZSC31010
Bsink
VBP
N/C
VBN
VSS
SIG
TM
VDD
Vgate
0.1 mF
V
supply
Ground
+5.5 to +30 V
OUT
Optional Bsink
S D
JFET
10 nF
ADC
Analog Block
Digital Block
RBic
LITE
ZSC31010
0 V to
1
V
Ratiometric
Rail-
to
-Rail
OWI
/
ZACwire
TM
0.
1 m
F
VSS
VBP
DAC
OUTBUF
ZACwire
TM
Interface
DSP
EEPROM
PREAMP
INMUX
Temp
.
Reference
VDD
Regulator
Power Save
POR Osc
.
VBN
Vgate
VDD
SIG
TM
Bsink
optional
2
.
7 to
5.
5
V
JFET
(optional if supply is
2.
7
to 5
.5
V
)
DS
V
SUPPLY
5
.
5 V to
30
V
1nF
Highly Versatile Applications
in Many Markets Including
Industrial
Building Automation
Office Automation
White Goods
Automotive
Portable Devices
Your Innovative Designs
2
1
5
6
7
8
3
4
ZSC31010
Bsink
VBP
N/C
VBN
VSS
SIG
TM
VDD
Vgate
0.1 mF
V
supply
Ground
+2.7 to +5.5 V
OUT
Optional Bsink
10 nF
ZSC31010 Block Diagram
Rail-to-Rail Ratiometric Voltage Output Applications Absolute Analog Voltage Output Applications
Ordering Examples (Please see section 11 in the data sheet for additional options.)
Description
Package
ZSC31010CEB ZSC31010 Die Temperature range: -50°C to +150°C Unsawn on Wafer
ZSC31010CEC ZSC31010 Die Temperature range: -50°C to +150°C Sawn on Wafer Frame
ZSC31010CEG1 ZSC31010 SOP8 (150 mil) Temperature range: -50°C to +150°C Tube: add “-T” to sales code
Reel: add “-R”
ZSC31010KIT ZSC31010 ZACwire™ SSC Evaluation Kit: Communication Board, SSC Board, Sensor Replacement
Board, USB Cable, 5 IC Samples
Kit
Corporate Headquarters
6024 Silver Creek Valley Road
San Jose, CA 95138
www.IDT.com
Sales
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
www.IDT.com/go/sales
Tech Support
www.IDT.com/go/support
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance
specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The
information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an
implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property
rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be
reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the
property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary
. All contents of this document are copyright of Integrated
Device Technology, Inc. All rights reserved.
ZSC31010 Datasheet
© 2016 Integrated Device Technology, Inc.
3
January 20, 2016
Contents
List of Figures ............................................................................................................................................................. 4
List of Tables .............................................................................................................................................................. 5
1 Electrical Characteristics ..................................................................................................................................... 6
1.1. Absolute Maximum Ratings .......................................................................................................................... 6
1.2. Recommended Operating Conditions .......................................................................................................... 6
1.3. Electrical Parameters ................................................................................................................................... 7
1.3.1. Supply/Regulation Characteristics ......................................................................................................... 7
1.3.2. Analog Front-End (AFE) Characteristics................................................................................................ 7
1.3.3. EEPROM Parameters ............................................................................................................................ 7
1.3.4. A/D Converter Characteristics ............................................................................................................... 7
1.3.5. Analog Output (DAC and Buffer) Characteristics .................................................................................. 7
1.3.6. ZACwire™ Serial Interface .................................................................................................................... 8
1.3.7. System Response Characteristics ......................................................................................................... 8
1.4. Analog Inputs versus Output Resolution ...................................................................................................... 9
2 Circuit Description ............................................................................................................................................. 11
2.1. Signal Flow and Block Diagram.................................................................................................................. 11
2.2. Analog Front End ........................................................................................................................................ 12
2.2.1. Bandgap/PTAT and PTAT Amplifier .................................................................................................... 12
2.2.2. Bridge Supply ....................................................................................................................................... 12
2.2.3. PREAMP Block .................................................................................................................................... 12
2.2.4. Analog-to-Digital Converter (ADC) ....................................................................................................... 12
2.3. Digital Signal Processor ............................................................................................................................. 13
2.3.1. EEPROM .............................................................................................................................................. 14
2.3.2. One-Wire InterfaceZACwire™ .......................................................................................................... 14
2.4. Output Stage............................................................................................................................................... 15
2.4.1. Digital to Analog Converter (Output DAC) ........................................................................................... 15
2.4.2. Output Buffer ........................................................................................................................................ 15
2.4.3. Voltage Reference Block ..................................................................................................................... 15
2.5. Clock Generator / Power-On Reset (CLKPOR) ......................................................................................... 16
2.5.1. Trimming the Oscillator ........................................................................................................................ 17
3 Functional Description ....................................................................................................................................... 18
3.1. General Working Mode ............................................................................................................................... 18
3.2. ZACwire™ Communication Interface ......................................................................................................... 19
3.2.1. Properties and Parameters .................................................................................................................. 19
3.2.2. Bit Encoding ......................................................................................................................................... 20
3.2.3. Write Operation from Master to ZSC31010 ......................................................................................... 20
3.2.4. ZSC31010 Read Operations ................................................................................................................ 21
3.2.5. High Level Protocol .............................................................................................................................. 24

ZSC31010CEG1-R

Mfr. #:
Manufacturer:
IDT
Description:
Sensor Interface Sensor Signal Conditoner
Lifecycle:
New from this manufacturer.
Delivery:
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