© 2016 Integrated Device Technology, Inc.
1
2
3
4
8
7
6
5
Bsink
VBP
N/C
VBN
VSS
SIG
TM
VDD
Vgate
6 Pin Configuration and Package
The standard package of the ZSC31010 is an SOP-8 (3.81 mm / 150 mil body) with a lead-pitch 1.27 mm / 50 mil.
Table 6.1 Storage and Soldering Conditions for the SOP-8 Package
Parameter Symbol Conditions Min Typ
Max Unit
Maximum Storage Temperature T
max
_
storage
Less than 10hrs, before mounting 150 °C
Minimum Storage Temperature T
min
_
storage
Store in original packing only -50 °C
Maximum Dry-Bake Temperature T
drybake
Less than100 hrs total, before
mounting
125 °C
Soldering Peak Temperature T
peak
Less than 30s
(IPC/JEDEC-STD-020 Standard)
260 °C
Figure 6.1 ZSC31010 Pin-Out Diagram
Table 6.2 ZSC31010 Pin Configuration
Pin No. Name Description
1 Bsink Optional ground connection for bridge ground. Used for power savings.
2 VBP Positive bridge connection
3 N/C No connection
4 VBN Negative bridge connection
5 Vgate Gate control for external JFET regulation/over-voltage protection
6 VDD Supply voltage (2.7 - 5.5 V)
7 SIG™ ZACwire™ interface (analog out, digital out, calibration interface)
8 VSS Ground supply
