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LTC2404/LTC2408
APPLICATIONS INFORMATION
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mode. However, certain applications may require an exter-
nal driver on SCK. If this driver goes Hi-Z after outputting
a LOW signal, the LTC2404/LTC2408’s internal pull-up
remains disabled. Hence, SCK remains LOW. On the next
falling edge of CSADC, the device is switched to the
external SCK timing mode. By adding an external 10k pull-
up resistor to SCK, this pin goes HIGH once the external
driver goes Hi-Z. On the next CSADC falling edge, the
device will remain in the internal SCK timing mode.
A similar situation may occur during the sleep state when
CSADC is pulsed HIGH-LOW-HIGH in order to test the
conversion status. If the device is in the sleep state
(EOC = 0), SCK will go LOW. Once CSADC goes HIGH
(within the time period defined above as t
EOCtest
), the
internal pull-up is activated. For a heavy capacitive load
on the SCK pin, the internal pull-up may not be adequate
to return SCK to a HIGH level before CSADC goes LOW
again. This is not a concern under normal conditions
where CSADC remains LOW after detecting EOC = 0. This
situation is easily avoided by adding an external 10k pull-
up resistor to the SCK pin.
DIGITAL SIGNAL LEVELS
The LTC2404/LTC2408’s digital interface is easy to use.
Its digital inputs (F
O
, CSADC, CSMUX, CLK, D
IN
and SCK
in External SCK mode of operation) accept standard TTL/
CMOS logic levels and can tolerate edge rates as slow as
100µs. However, some considerations are required to take
advantage of exceptional accuracy and low supply current.
The digital output signals (SDO and SCK in Internal SCK
mode of operation) are less of a concern because they are
not generally active during the conversion state.
In order to preserve the accuracy of the LTC2404/LTC2408,
it is very important to minimize the ground path imped-
ance which may appear in series with the input and/or
reference signal and to reduce the current which may flow
through this path. Pin 6 (GND) should be connected to a
low resistance ground plane through a minimum length
trace. The use of multiple via holes is recommended to
further reduce the connection resistance. The LTC2404/
LTC2408’s power supply current flowing through the
0.01 resistance of the common ground pin will develop
a 2.5µV offset signal. For a reference voltage V
REF
= 2.5V,
this represents a 1ppm offset error.
In an alternative configuration, Pin 6 (GND) of the converter
can be the single-point-ground in a single point grounding
system. The input signal ground, the reference signal
ground, the digital drivers ground (usually the digital
ground) and the power supply ground (the analog ground)
should be connected in a star configuration with the com-
mon point located as close to Pin 6 as possible.
The power supply current during the conversion state
should be kept to a minimum. This is achieved by restrict-
ing the number of digital signal transitions occurring
during this period.
While a digital input signal is in the 0.5V to (V
CC
␣ –␣ 0.5V)
range, the CMOS input receiver draws additional current
from the power supply. It should be noted that, when any
one of the digital input signals (F
O
, CSADC, CSMUX, D
IN
,
CLK and SCK in External SCK mode of operation) is within
this range, the LTC2404/LTC2408 power supply current
may increase even if the signal in question is at a valid logic
level. For micropower operation and in order to minimize
the potential errors due to additional ground pin current,
it is recommended to drive all digital input signals to full
CMOS levels [V
IL
< 0.4V and V
OH
> (V
CC
– 0.4V)].
Severe ground pin current disturbances can also occur
due to the undershoot of fast digital input signals. Under-
shoot and overshoot can occur because of the imped-
ance mismatch at the converter pin when the transition
time of an external control signal is less than twice the
propagation delay from the driver to LTC2404/LTC2408.
For reference, on a regular FR-4 board, signal propaga-
tion velocity is approximately 183ps/inch for internal
traces and 170ps/inch for surface traces. Thus, a driver
generating a control signal with a minimum transition
time of 1ns must be connected to the converter pin
through a trace shorter than 2.5 inches. This problem
becomes particularly difficult when shared control lines
are used and multiple reflections may occur. The solution
is to carefully terminate all transmission lines close to
their characteristic impedance.
Parallel termination near the LTC2404/LTC2408 input
pins will eliminate this problem but will increase the driver
23
LTC2404/LTC2408
APPLICATIONS INFORMATION
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power dissipation. A series resistor between 27 and 56
placed near the driver or near the LTC2404/LTC2408 pin
will also eliminate this problem without additional power
dissipation. The actual resistor value depends upon the
trace impedance and connection topology.
Driving the Input and Reference
The analog input and reference of the typical delta-sigma
analog-to-digital converter are applied to a switched ca-
pacitor network. This network consists of capacitors switch-
ing between the analog input (ADCIN), ground and the
reference (V
REF
). The result is small current spikes seen at
both ADCIN and V
REF
. A simplified input equivalent circuit
is shown in Figure 12.
The key to understanding the effects of this dynamic input
current is based on a simple first order RC time constant
model. Using the internal oscillator, the internal switched
capacitor network of the LTC2404/LTC2408 is clocked at
153,600Hz corresponding to a 6.5µs sampling period.
Fourteen time constants are required each time a capacitor
is switched in order to achieve 1ppm settling accuracy.
Therefore, the equivalent time constant at V
IN
and V
REF
should be less than 6.5µs/14 = 460ns in order to achieve
1ppm accuracy.
Input Current (V
IN
)
If complete settling occurs on the input, conversion re-
sults will be uneffected by the dynamic input current. If the
settling is incomplete, it does not degrade the linearity
performance of the device. It simply results in an offset/
full-scale shift, see Figure 13. To simplify the analysis of
input dynamic current, two separate cases are assumed:
large capacitance at V
IN
(C
IN
> 0.01µF) and small capaci-
tance at V
IN
(C
IN
< 0.01µF).
If the total capacitance at V
IN
(see Figure 14) is small
(<0.01µF), relatively large external source resistances (up
to 20k for 20pF parasitic capacitance) can be tolerated
without any offset/full-scale error. Figures 15 and 16 show
a family of offset and full-scale error curves for various
Figure 12. LTC2404/LTC2408 Equivalent Analog Input Circuit
V
REF
CHX
ADCV
CC
(PIN 2)
R
SW
5k
AVERAGE INPUT CURRENT:
I
DC
= 0.25(V
IN
– 0.5 • V
REF
) • f • C
EQ
I
REF
I
REF
ADCV
CC
(PIN 2)
I
IN(LEAK)
I
IN(LEAK)
±I
DC
MUXV
CC
(PIN 8)
I
IN(MUX)
I
IN(MUX)
R
SW
5k
R
SW
75
C
EQ
10pF (TYP)
R
SW
5k
SELECTED
CHANNEL
24048 F12
f
OUT
= 50Hz, INTERNAL OSCILLATOR: f = 128kHz
f
OUT
= 60Hz, INTERNAL OSCILLATOR: f = 153.6kHz
EXTERNAL OSCILLATOR: 2.56kHz f 307.2kHz
GND
ADCIN
MUXOUT
Figure 13. Offset/Full-Scale Shift
Figure 14. An RC Network at CH0 to CH7
C
IN
24048 F14
INTPUT
SIGNAL
SOURCE
R
SOURCE
CH0 TO
CH7
LTC2404/
LTC2408
C
PAR
20pF
0
TUE
V
REF
/2
V
IN
24048 F13
V
REF
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LTC2404/LTC2408
APPLICATIONS INFORMATION
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Figure 15. Offset vs R
SOURCE
(Small C)
Figure 16. Full-Scale Error vs R
SOURCE
(Small C)
R
SOURCE
()
1
OFFSET ERROR (ppm)
30
40
50
10k
24048 F15
20
10
0
10
100
1k
100k
V
CC
= 5V
V
REF
= 5V
V
IN
= 0V
T
A
= 25°C
C
IN
= 100pF
C
IN
= 1000pF
C
IN
= 0pF
C
IN
= 0.01µF
R
SOURCE
()
1
FULL-SCALE ERROR (ppm)
–20
–10
0
10k
24048 F16
–30
–40
–50
10
100
1k
100k
V
CC
= 5V
V
REF
= 5V
V
IN
= 5V
T
A
= 25°C
C
IN
= 0pF
C
IN
= 100pF
C
IN
= 1000pF
C
IN
= 0.01µF
Figure 18. Full-Scale Error vs R
SOURCE
(Large C)
Figure 17. Offset vs R
SOURCE
(Large C)
R
SOURCE
()
0
OFFSET ERROR (ppm)
100
200
300
50
150
250
200 400 600 800
24048 F17
10001000 300 500 700 900
V
CC
= 5V
V
REF
= 5V
V
IN
= 0V
T
A
= 25°C
C
IN
= 1µF
C
IN
= 10µF
C
IN
= 0.1µF
C
IN
= 0.01µF
small valued input capacitors (C
IN
< 0.01µF) as a function
of input source resistance.
For large input capacitor values (C
IN
> 0.01µF), the input
spikes are averaged by the capacitor into a DC current. The
gain shift becomes a linear function of input source
resistance independent of input capacitance, see Figures
17 and 18. The equivalent input impedance is 1.66M.
This results in ±1.5µA of input dynamic current at the
extreme values of V
IN
(V
IN
= 0V and V
IN
= V
REF
, when
V
REF
= 5V). This corresponds to a 0.3ppm shift in offset
and full-scale readings for every 1 of input source
resistance.
While large capacitance applied to one of the multiplexer
channel inputs may result in offset/full-scale shifts, large
capacitance applied to the MUXOUT/ADCIN results in
linearity errors. The 75 on-resistance of the multiplexer
switch is nonlinear with input voltage. If the capacitance at
node MUXOUT/ADCIN is less than 0.01µF, the linearity is
not degraded. On the other hand, excessive capacitance
(>0.01µF) results in incomplete settling as a function of
the multiplexer on-resistance. Hence, the nonlinearity of
the multiplexer switch is seen in the overall transfer
characteristic.
In addition to the input current spikes, the input ESD
protection diodes have a temperature dependent leakage
current. This leakage current, nominally 1nA (±10nA
max), results in a fixed offset shift of 10µV for a 10k source
resistance.

LTC2404IG#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 24-Bit Power 4/Ch Delta-Sigma ADC
Lifecycle:
New from this manufacturer.
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