Fremont Micro Devices Preliminary FT25H04/02
© 2014 Fremont Micro Devices Inc. Confidential Rev1.0 DS25H04/02-page2
CONTENTS
1. FEATURES ............................................................................................................................................ 3
2. GENERAL DESCRIPTION.................................................................................................................... 4
3. MEMORY ORGANIZATION................................................................................................................... 6
4. DEVICE OPERATION............................................................................................................................ 8
5. DATA PROTECTION ............................................................................................................................. 8
6. STATUS REGISTER............................................................................................................................ 10
7. COMM ANDS DESCRIPTION ..............................................................................................................11
7.1. WRITE ENABLE (WREN) (06H) ........................................................................................................ 13
7.2. WRITE DISABLE (WRDI) (04H)......................................................................................................... 13
7.3. READ STATUS REGISTER (RDSR) (05H)........................................................................................... 13
7.4. WRITE STATUS REGISTER (WRSR) (01H)......................................................................................... 14
7.5. READ DATA BYTES (READ) (03H) .................................................................................................... 14
7.6. READ DATA BYTES AT HIGHER SPEED (FAST READ) (0BH)................................................................. 15
7.7. PAGE PROGRAM (PP) (02H)............................................................................................................. 15
7.8. SECTOR ERASE (SE) (20H).............................................................................................................. 16
7.9. BLOCK ERASE (BE) (D8H) ............................................................................................................... 17
7.10. CHIP ERASE (CE) (60/C7H)........................................................................................................... 17
7.11. READ MANUFACTURE ID/ DEVICE ID (REMS) (90H)........................................................................ 18
7.12. READ IDENTIFICATION (RDID) (9FH)............................................................................................... 19
8. ELECTRICAL CHARACTERISTICS................................................................................................... 20
8.1. POWER-ON TIMING........................................................................................................................... 20
8.2. INITIAL DELIVERY STATE ................................................................................................................... 20
8.3. DATA RETENTION AND ENDURANCE ................................................................................................... 20
8.4. LATCH UP CHARACTERISTICS ............................................................................................................ 20
8.5. ABSOLUTE MAXIMUM RATINGS .......................................................................................................... 21
8.6. CAPACITANCE MEASUREMENT CONDITION ......................................................................................... 21
8.7. DC CHARACTERISTICS ..................................................................................................................... 22
8.8. AC CHARACTERISTICS ..................................................................................................................... 23
9. ORDERING INFORMATION................................................................................................................ 25
10. PACKAGE INFORMATION.............................................................................................................. 26
10.1. PACKAGE SOP8 150MIL................................................................................................................ 26
10.2. PACKAGE SOP8 208MIL................................................................................................................ 27
10.3. PACKAGE DIP8 300MIL ................................................................................................................. 28
10.4. PACKAGE VSOP8 208MIL ............................................................................................................. 29
10.5. PACKAGE TSSOP8 173MIL........................................................................................................... 30
11. REVISION HISTORY........................................................................................................................ 31
