Automotive 3-Phase BLDC Controller
and MOSFET Driver
A3930 and
A3931
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Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Package JP, 48-pin LQFP with Exposed Thermal Pad
Copyright ©2006-2013, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to
permit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, Allegro MicroSystems, LLC assumes no re spon si bil i ty for its
use; nor for any in fringe ment of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
www.allegromicro.com
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48
A
Exposed thermal pad (bottom surface)
Terminal #1 mark area
B
B
A
7º
0º
C
SEATING
PLANE
C0.08
48X
GAGE PLANE
SEATING PLANE
1.60 MAX
0.50
5.00 8.60
0.30
1.70
8.60
5.00
For Reference Only
(reference JEDEC MS-026 BBCHD)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
1.40 ±0.05
0.10 ±0.05
0.22 ±0.05
9.00 ±0.20
9.00 ±0.20 7.00 ±0.20
7.00 ±0.20
0.50
PCB Layout Reference View
C
0.25
(1.00)
0.60 ±0.15
4° ±4
0.15
+0.05
–0.06
5.00±0.04
5.00±0.04
C
Reference land pattern layout (reference IPC7351
QFP50P900X900X160-48M); adjust as necessary to meet
application process requirements and PCB layout
tolerances; when mounting on a multilayer PCB, thermal
vias at the exposed thermal pad land can improve thermal
dissipation (reference EIA/JEDEC Standard JESD51-5)
48
2
1
C