LPC2361_62 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 15 October 2013 34 of 65
NXP Semiconductors
LPC2361/62
Single-chip 16-bit/32-bit MCU
8. Limiting values
[1] The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless
otherwise noted.
[2] Including voltage on outputs in 3-state mode.
[3] Not to exceed 4.6 V.
[4] The peak current is limited to 25 times the corresponding maximum current.
[5] The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined
based on required shelf lifetime. Please refer to the JEDEC specification (J-STD-033B.1) for further details.
[6] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
Symbol Parameter Conditions Min Max Unit
V
DD(3V3)
supply voltage (3.3 V) core and external rail 3.0 3.6 V
V
DD(DCDC)(3V3)
DC-to-DC converter supply voltage (3.3 V) 3.0 3.6 V
V
DDA
analog 3.3 V pad supply voltage 0.5 +4.6 V
V
i(VBAT)
input voltage on pin VBAT for the RTC 0.5 +4.6 V
V
i(VREF)
input voltage on pin VREF 0.5 +4.6 V
V
IA
analog input voltage on ADC related pins 0.5 +5.1 V
V
I
input voltage 5 V tolerant I/O pins;
only valid when the
V
DD(3V3)
supply
voltage is present
[2]
0.5 +6.0 V
other I/O pins
[2][3]
0.5 V
DD(3V3)
+ 0.5 V
I
DD
supply current per supply pin
[4]
-100 mA
I
SS
ground current per ground pin
[4]
-100 mA
T
stg
storage temperature non-operating
[5]
65 +150 C
P
tot(pack)
total power dissipation (per package) based on package
heat transfer, not
device power
consumption
-1.5 W
V
ESD
electrostatic discharge voltage human body model;
all pins
[6]
2500 +2500 V
LPC2361_62 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 15 October 2013 35 of 65
NXP Semiconductors
LPC2361/62
Single-chip 16-bit/32-bit MCU
9. Thermal characteristics
The average chip junction temperature, T
j
(C), can be calculated using the following
equation:
(1)
T
amb
= ambient temperature (C),
R
th(j-a)
= the package junction-to-ambient thermal resistance (C/W)
P
D
= sum of internal and I/O power dissipation
The internal power dissipation is the product of I
DD
and V
DD
. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
j
T
amb
P
D
R
th j a
+=
Table 5. Thermal characteristics
V
DD
= 3.0 V to 3.6 V; T
amb
=
40
C to +85
C unless otherwise specified;
Symbol Parameter Conditions Min Typ Max Unit
T
j(max)
maximum junction
temperature
--125 C
Table 6. Thermal resistance value (C/W): ±15 %
V
DD
= 3.0 V to 3.6 V; T
amb
=
40
C to +85
C unless otherwise specified.
LQFP100
ja
JEDEC (4.5 in 4 in)
0 m/s 37.3
1 m/s 32.2
2.5 m/s 29.5
Single-layer (4.5 in 3 in)
0 m/s 54.4
1 m/s 42.9
2.5 m/s 38.8
jc 6.7
jb 12
LPC2361_62 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 15 October 2013 36 of 65
NXP Semiconductors
LPC2361/62
Single-chip 16-bit/32-bit MCU
10. Static characteristics
Table 7. Static characteristics
T
amb
=
40
C to +85
C for commercial applications, unless otherwise specified.
Symbol Parameter Conditions Min Typ
[1]
Max Unit
V
DD(3V3)
supply voltage (3.3 V) core and external rail 3.0 3.3 3.6 V
V
DD(DCDC)(3V3)
DC-to-DC converter
supply voltage (3.3 V)
3.0 3.3 3.6 V
V
DDA
analog 3.3 V pad supply
voltage
3.0 3.3 3.6 V
V
i(VBAT)
input voltage on pin
VBAT
[2]
2.0 3.3 3.6 V
V
i(VREF)
input voltage on pin
VREF
2.5 3.3 V
DDA
V
I
DD(DCDC)act(3V3)
active mode DC-to-DC
converter supply
current (3.3 V)
V
DD(DCDC)(3V3)
=3.3V;
T
amb
=25C; code
while(1){}
executed from flash; no
peripherals enabled;
PCLK = CCLK
CCLK = 10 MHz - 15 - mA
CCLK = 72 MHz - 63 - mA
all peripherals enabled;
PCLK = CCLK / 8
CCLK = 10 MHz - 21 - mA
CCLK = 72 MHz - 92 - mA
all peripherals enabled;
PCLK = CCLK
CCLK = 10 MHz - 27 - mA
CCLK = 72 MHz - 125 - mA
I
DD(DCDC)pd(3V3)
Power-down mode
DC-to-DC converter
supply current (3.3 V)
V
DD(DCDC)(3V3)
= 3.3 V;
T
amb
=25C
[3]
-113-A
I
DD(DCDC)dpd(3V3)
Deep power-down
mode DC-to-DC
converter supply
current (3.3 V)
[3]
-20-A
I
BATact
active mode battery
supply current
[4]
-20-A
I
BAT
battery supply current Deep power-down mode
[3]
-20-A
Standard port pins, RESET
, RTCK
I
IL
LOW-level input current V
I
= 0 V; no pull-up - - 3 A
I
IH
HIGH-level input
current
V
I
=V
DD(3V3)
; no
pull-down
-- 3A
I
OZ
OFF-state output
current
V
O
=0V; V
O
=V
DD(3V3)
;
no pull-up/down
-- 3A

LPC2361FBD100,551

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU 64K FL/34K RAM USB OTG CAN
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