LPC2361_62 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 15 October 2013 43 of 65
NXP Semiconductors
LPC2361/62
Single-chip 16-bit/32-bit MCU
11. Dynamic characteristics
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[3] Bus capacitance C
b
in pF, from 10 pF to 400 pF.
Table 8. Dynamic characteristics
T
amb
=
40
C to +85
C for commercial applications; V
DD(3V3)
over specified ranges.
[1]
Symbol Parameter Conditions Min Typ
[2]
Max Unit
ARM processor clock frequency
f
oper
operating frequency CCLK; 40 C to +85 C1 - 72 MHz
IRC; 40 C to +85 C 3.96 4 4.04 MHz
External clock
f
osc
oscillator frequency 1 - 25 MHz
T
cy(clk)
clock cycle time 40 - 1000 ns
t
CHCX
clock HIGH time T
cy(clk)
0.4 - - ns
t
CLCX
clock LOW time T
cy(clk)
0.4 - - ns
t
CLCH
clock rise time - - 5 ns
t
CHCL
clock fall time - - 5 ns
I
2
C-bus pins (P0[27] and P0[28])
t
f(o)
output fall time V
IH
to V
IL
20 + 0.1 C
b
[3]
--ns
SSP interface
t
su(SPI_MISO)
SPI_MISO set-up time T
amb
= 25 C; measured
in SPI Master mode; see
Figure 14
-11-ns
Fig 12. External clock timing (with an amplitude of at least V
i(RMS)
= 200 mV)
LPC2361_62 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 15 October 2013 44 of 65
NXP Semiconductors
LPC2361/62
Single-chip 16-bit/32-bit MCU
11.1 Internal oscillators
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
11.2 I/O pins
[1] Applies to standard I/O pins and RESET pin.
11.3 USB interface
[1] Characterized but not implemented as production test. Guaranteed by design.
Table 9. Dynamic characteristic: internal oscillators
T
amb
=
40
C to +85
C; 3.0 V
V
DD(3V3)
3.6 V.
[1]
Symbol Parameter Conditions Min Typ
[2]
Max Unit
f
osc(RC)
internal RC oscillator frequency - 3.96 4.02 4.04 MHz
f
i(RTC)
RTC input frequency - - 32.768 - kHz
Table 10. Dynamic characteristic: I/O pins
[1]
T
amb
=
40
C to +85
C; V
DD(3V3)
over specified ranges.
Symbol Parameter Conditions Min Typ Max Unit
t
r
rise time pin configured as output 3.0 - 5.0 ns
t
f
fall time pin configured as output 2.5 - 5.0 ns
Table 11. Dynamic characteristics of USB pins
C
L
= 50 pF; R
pu
= 1.5 k
on D+ to V
DD(3V3)
,unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
t
r
rise time 10 % to 90 % 8.5 - 13.8 ns
t
f
fall time 10 % to 90 % 7.7 - 13.7 ns
t
FRFM
differential rise and fall time
matching
t
r
/t
f
--109%
V
CRS
output signal crossover voltage 1.3 - 2.0 V
t
FEOPT
source SE0 interval of EOP see Figure 13 160 - 175 ns
t
FDEOP
source jitter for differential transition
to SE0 transition
see Figure 13 2-+5ns
t
JR1
receiver jitter to next transition 18.5 - +18.5 ns
t
JR2
receiver jitter for paired transitions 10 % to 90 % 9-+9ns
t
EOPR1
EOP width at receiver must reject as
EOP; see
Figure 13
[1]
40 --ns
t
EOPR2
EOP width at receiver must accept as
EOP; see
Figure 13
[1]
82 --ns
LPC2361_62 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 15 October 2013 45 of 65
NXP Semiconductors
LPC2361/62
Single-chip 16-bit/32-bit MCU
11.4 Flash memory
[1] Number of program/erase cycles.
[2] Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash in blocks of 256 bytes.
11.5 Timing
Table 12. Dynamic characteristics of flash
T
amb
=
40
C to +85
C, unless otherwise specified; V
DD(3V3)
= 3.0 V to 3.6 V; all voltages are measured with respect to
ground.
Symbol Parameter Conditions Min Typ Max Unit
N
endu
endurance
[1]
10000 100000 - cycles
t
ret
retention time powered; 100 cycles
[2]
10--years
unpowered; 100 cycles 20 - - years
t
er
erase time sector or multiple
consecutive sectors
95 100 105 ms
t
prog
programming time
[2]
0.95 1 1.05 ms
Fig 13. Differential data-to-EOP transition skew and EOP width
002aab561
T
PERIOD
differential
data lines
crossover point
source EOP width: t
FEOPT
receiver EOP width: t
EOPR1
, t
EOPR2
crossover point
extended
differential data to
SE0/EOP skew
n × T
PERIOD
+ t
FDEOP

LPC2361FBD100,551

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU 64K FL/34K RAM USB OTG CAN
Lifecycle:
New from this manufacturer.
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