LPC2361_62 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 15 October 2013 52 of 65
NXP Semiconductors
LPC2361/62
Single-chip 16-bit/32-bit MCU
14.2 Crystal oscillator XTAL input and component selection
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
C
i
= 100 pF. To limit the input voltage to the specified range, choose an additional
capacitor to ground C
g
which attenuates the input voltage by a factor C
i
/ (C
i
+ C
g
). In
slave mode, a minimum of 200 mV (RMS) is needed.
In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF
(Figure 22
), with an amplitude between 200 mV (RMS) and 1000 mV (RMS). This
corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V.
The XTAL2 pin in this configuration can be left unconnected.
External components and models used in oscillation mode are shown in Figure 23
and in
Table 15
and Table 16. Since the feedback resistance is integrated on chip, only a crystal
and the capacitances C
X1
and C
X2
need to be connected externally in case of
fundamental mode oscillation (the fundamental frequency is represented by L, C
L
and
R
S
). Capacitance C
P
in Figure 23 represents the parallel package capacitance and should
not be larger than 7 pF. Parameters F
OSC
, C
L
, R
S
and C
P
are supplied by the crystal
manufacturer.
Fig 21. LPC2361/2362 USB device port configuration
LPC2361/62
USB-B
connector
33 Ω
33 Ω
002aad968
USB_UP_LED
USB_CONNECT
V
DD
V
DD
D+
D
USB_D+
USB_D
V
BUS
V
BUS
V
SS
Fig 22. Slave mode operation of the on-chip oscillator
LPC2xxx
XTAL1
C
i
100 pF
C
g
002aae718
LPC2361_62 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 15 October 2013 53 of 65
NXP Semiconductors
LPC2361/62
Single-chip 16-bit/32-bit MCU
Fig 23. Oscillator modes and models: oscillation mode of operation and external crystal
model used for C
X1
/C
X2
evaluation
Table 15. Recommended values for C
X1
/C
X2
in oscillation mode (crystal and external
components parameters): low frequency mode
Fundamental oscillation
frequency F
OSC
Crystal load
capacitance C
L
Maximum crystal
series resistance R
S
External load
capacitors C
X1
/C
X2
1 MHz to 5 MHz 10 pF < 300 18 pF, 18 pF
20 pF < 300 39 pF, 39 pF
30 pF < 300 57 pF, 57 pF
5 MHz to 10 MHz 10 pF < 300 18 pF, 18 pF
20 pF < 200 39 pF, 39 pF
30 pF < 100 57 pF, 57 pF
10 MHz to 15 MHz 10 pF < 160 18 pF, 18 pF
20 pF < 60 39 pF, 39 pF
15 MHz to 20 MHz 10 pF < 80 18 pF, 18 pF
Table 16. Recommended values for C
X1
/C
X2
in oscillation mode (crystal and external
components parameters): high frequency mode
Fundamental oscillation
frequency F
OSC
Crystal load
capacitance C
L
Maximum crystal
series resistance R
S
External load
capacitors C
X1
, C
X2
15 MHz to 20 MHz 10 pF < 180 18 pF, 18 pF
20 pF < 100 39 pF, 39 pF
20 MHz to 25 MHz 10 pF < 160 18 pF, 18 pF
20 pF < 80 39 pF, 39 pF
002aag469
LPC2xxx
XTAL1 XTAL2
C
X2
C
X1
XTAL
=
C
L
C
P
R
S
L
LPC2361_62 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 15 October 2013 54 of 65
NXP Semiconductors
LPC2361/62
Single-chip 16-bit/32-bit MCU
14.3 RTC 32 kHz oscillator component selection
The RTC external oscillator circuit is shown in Figure 24. Since the feedback resistance is
integrated on chip, only a crystal, the capacitances C
X1
and C
X2
need to be connected
externally to the microcontroller.
Table 17
gives the crystal parameters that should be used. C
L
is the typical load
capacitance of the crystal and is usually specified by the crystal manufacturer. The actual
C
L
influences oscillation frequency. When using a crystal that is manufactured for a
different load capacitance, the circuit will oscillate at a slightly different frequency
(depending on the quality of the crystal) compared to the specified one. Therefore for an
accurate time reference it is advised to use the load capacitors as specified in Table 17
that belong to a specific C
L
. The value of external capacitances C
X1
and C
X2
specified in
this table are calculated from the internal parasitic capacitances and the C
L
. Parasitics
from PCB and package are not taken into account.
14.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
x1
, C
x2
, and C
x3
in case of
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plane. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of C
x1
and C
x2
should be chosen smaller
accordingly to the increase in parasitics of the PCB layout.
Fig 24. RTC oscillator modes and models: oscillation mode of operation and external
crystal model used for C
X1
/C
X2
evaluation
Table 17. Recommended values for the RTC external 32 kHz oscillator C
X1
/C
X2
components
Crystal load capacitance
C
L
Maximum crystal series
resistance R
S
External load capacitors C
X1
/C
X2
11 pF < 100 k 18 pF, 18 pF
13 pF < 100 k 22 pF, 22 pF
15 pF < 100 k 27 pF, 27 pF
002aaf495
LPC2xxx
RTCX1 RTCX2
C
X2
C
X1
32 kHz XTAL
=
C
L
C
P
R
S
L

LPC2361FBD100,551

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU 64K FL/34K RAM USB OTG CAN
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet