NCV7718B
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4
GND GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
21
20
22
23
24
Figure 3. Pinout − SSOP24 (Top View)
OUT1
OUT5
NC
VCC
SO
EN
NC
OUT6
OUT4
GND
SI
OUT2
NC
VS1
SCLK
CSB
RESERVED
RESERVED
VS2
NC
OUT3
GND
PACKAGE DESCRIPTION The pin−out for the Hex Half−Bridge in SSOP24 package is shown in the table below.
Pin #
SSOP24
Symbol Description
1 GND Ground. Shorted to pin 24 internally.
2 OUT1 Half Bridge Output 1
3 OUT5 Half Bridge Output 5
4 NC No Connection. This pin should be isolated from any traces or via on the PCB board.
5 SI Serial Input. 16 bit serial communications input. 3.3 V/5 V (TTL) Compatible. Internally pulled down.
6 VCC Power supply input for Logic.
7 SO Serial Output. 16 bit serial communications output. 3.3 V/5 V Complaint
8 EN Enable. Input high wakes the IC up from a sleep mode. 3.3 V/5 V (TTL) Compatible. Internally pulled down.
9 NC No Connection. This pin should be isolated from any traces or via on the PCB board.
10 OUT6 Half Bridge Output 6
11 OUT4 Half Bridge Output 4
12 GND Ground. Shorted to pin 13 internally.
13 GND Ground. Shorted to pin 12 internally.
14 OUT3 Half Bridge Output 3
15 NC No Connection. This pin should be isolated from any traces or via on the PCB board.
16 VS2 Voltage Power Supply input for the Drivers 3, 4 and 6. This pin must be connected to VS1 externally.
17 Reserved Reserved for internal use. This pin must be grounded.
18 Reserved Reserved for internal use. This pin must be grounded.
19 CSB Chip Select Bar. Active low serial port operation. 3.3V/5V (TTL) Compatible. Internally pulled up.
20 SCLK Serial Clock. Clock input for use with SPI communication. 3.3 V/5 V (TTL) Compatible. Internally pulled
down.
21 VS1 Voltage Power Supply input for the Drivers 1, 2 and 5, all the pre−drivers and the charge pump. This pin
must be connected to VS2 externally.
22 NC No Connection. This pin should be isolated from any traces or via on the PCB board.
23 OUT2 Half Bridge Output 2
24 GND Ground. Shorted to pin 1 internally.
EPAD Exposed
Pad
Connect to GND or leave unconnected.
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5
MAXIMUM RATINGS
Rating Symbol Value Unit
Power Supply Voltage (VS1, VS2)
(DC)
(AC), t < 500ms, Ivsx > −2A
VsxdcMax
VSXac −0.3 to 40
−1.0
V
Output Pin OUTx
(DC)
(AC), t< 500ms, IOUTx > −1.1A
(AC), t< 500ms, IOUTx < 1A
VoutxDc
VoutxAc
−0.3 to 40
−1.0
1.0
V
Pin Voltage (Logic Input pins, SI, SCLK, CSB, SO, EN, V
CC
) VioMax −0.3 to 5.5 V
Output Current (OUT1, OUT2, OUT3, OUT4, OUT5, OUT6) IoutxImax −2.0 to 2.0 A
Electrostatic Discharge, Human Body Model, VSx, OUTx (AEC−Q100−002) Vesd4k 4.0 kV
Electrostatic Discharge, Human Body Model, all other pins (AEC−Q100−002) Vesd2k 2.0 kV
Electrostatic Discharge, Machine Model (AEC−Q100−003) Vesd200 200 V
Short Circuit Reliability Characterization AECQ10x Grade A
Operating Junction Temperature Tj −40 to 150 °C
Storage Temperature Range Tstr −55 to 150 °C
Moisture Sensitivity Level (MAX 260°C Processing) MSL2 2
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL INFORMATION (Note 1)
Rating
Symbol Value Unit
Package Thermal Resistance − Still−air
Junction−to−Ambient (Note 2)
(Note 3)
Junction−to−Lead (Note 2)
(Note 3)
R
q
JA
R
y
JBOARD
56
22
28
12
°C/W
1. Thermal Information is based on having 3 high side and 3 low side drivers dissipating 80 mW each.
2. Based on JESD51−3, 1.2 mm thick FR4, 2S0P PCB with 2 oz. copper and 18 thermal vias to 600 mm
2
spreader on bottom layer.
3. Based on JESD51−7, 1.2 mm thick FR4, 1S2P PCB with 2 oz. copper and 18 thermal vias to 80x80 mm 1 oz. internal spreader planes.
RECOMMENDED OPERATING CONDITIONS
Rating Symbol
Value
Unit
Min Max
Digital Supply Input Voltage VccOp 3.15 5.25 V
Battery Supply Input Voltage VsxOp 5.5 28 V
DC Output Current IxOp 0.55 A
Junction Temperature TjOp −40 125 °C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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6
ELECTRICAL CHARACTERISTICS (−40°C < T
J
< 150°C, 5.5 V < VSx < 40 V, 3.15 V < V
CC
< 5.25 V, EN = V
CC
, unless otherwise
specified)
Characteristic
Symbol Conditions Min Typ Max Unit
GENERAL
Supply Current (VS1 + VS2)
Sleep Mode
IqVsx85 VS1 = VS2 = 13.2 V, V
CC
= 0 V −40°C to 85°C
No Load
1.0 2.5
mA
Supply Current (VS1 + VS2)
Active Mode
IvsOp EN = V
CC
, 5.5 V < VSx < 28 V No Load 2.5 5.0 mA
Supply Current (V
CC
)
Sleep Mode
Active Mode
IqV
CC
IV
CC
Op
CSB = V
CC
, EN = SI = SCLK = 0 V
(−40°C to 85°C)
EN = CSB = V
CC
, SI = SCLK = 0 V
No Load
1.0
1.5
2.5
3.0
mA
mA
Total Sleep Mode Current
I(VS1) + I(VS2) + I(VCC)
IqTot Sleep Mode, −40°C to 85°C, No Load 2 5
mA
V
CC
Power−On−Reset Thresh-
old
V
CC
por V
CC
increasing 2.55 2.9 V
VSx Undervoltage Detection
Threshold
VsXuv VSx decreasing 3.7 4.1 4.5 V
VSx Undervoltage Detection
Hysteresis
VsXuHys 100 450 mV
VSx Overvoltage Detection
Threshold
VsXov VSx increasing 32 36 40 V
VSx Overvoltage Detection
Hysteresis
VsXoHys 1 2.5 4 V
THERMAL RESPONSE
Thermal Warning
Twr Not ATE tested 120 140 170 °C
Thermal Warning Hysteresis TwHy Not ATE tested 20 °C
Thermal Shutdown Tsd Not ATE tested 150 175 200 °C
Thermal Shutdown Hysteresis TsdHy Not ATE tested 20 °C
OUTPUTS
Output High R
DS(on)
(source) RDSonHS I
out
= −500 mA, VSx = 13.2 V, V
CC
= 3.15 V 1 2.25
W
Output Low R
DS(on)
(sink) RDSonLS I
out
= 500 mA, VSx = 13.2 V, V
CC
= 3.15 V 1 2.0
W
Output Path R
DS(HSx+LSx)
RDSonPath I
out
= 500 mA 4.0
W
Source Leakage Current IsrcLkg13.2
IsrcLkg40
OUT(1−6) = 0 V, VSx = 13.2 V, V
CC
= 5 V,
−40°C to 85°C
OUT(1−6) = 0 V, VSx = 40 V, V
CC
= 5 V,
−40°C to 85°C
−1.0
−5.0
mA
Sink Leakage Current IsnkLkg13.2
IsnkLkg40
OUT(1−6) = VSx = 13.2 V, V
CC
= 5 V,
−40°C to 85°C
OUT(1−6) = VSx = 40 V, V
CC
= 5 V,
−40°C to 85°C
1.0
5.0
mA
Overcurrent Shutdown Thresh-
old (Source)
IsdSrc V
CC
= 5 V, VSx = 13.2 V −2.0 −1.2 −0.8 A
Overcurrent Shutdown Thresh-
old (Sink)
IsdSnk V
CC
= 5 V, VSx = 13.2 V 0.8 1.2 2.0 A
Over Current Delay Timer TdOc 10 25 50
ms
Under Load Detection Thresh-
old (Low Side)
IuldLS V
CC
= 5 V, VSx = 13.2 V 2.0 11 20 mA
Under Load Detection Delay
Time
TdUld V
CC
= 5 V, VSx = 13.2 V 200 350 600
ms

NCV7718BDQR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Motor / Motion / Ignition Controllers & Drivers HALF BRIDGE DRIVER
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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