NCV7718B
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5
MAXIMUM RATINGS
Rating Symbol Value Unit
Power Supply Voltage (VS1, VS2)
(DC)
(AC), t < 500ms, Ivsx > −2A
VsxdcMax
VSXac −0.3 to 40
−1.0
V
Output Pin OUTx
(DC)
(AC), t< 500ms, IOUTx > −1.1A
(AC), t< 500ms, IOUTx < 1A
VoutxDc
VoutxAc
−0.3 to 40
−1.0
1.0
V
Pin Voltage (Logic Input pins, SI, SCLK, CSB, SO, EN, V
CC
) VioMax −0.3 to 5.5 V
Output Current (OUT1, OUT2, OUT3, OUT4, OUT5, OUT6) IoutxImax −2.0 to 2.0 A
Electrostatic Discharge, Human Body Model, VSx, OUTx (AEC−Q100−002) Vesd4k 4.0 kV
Electrostatic Discharge, Human Body Model, all other pins (AEC−Q100−002) Vesd2k 2.0 kV
Electrostatic Discharge, Machine Model (AEC−Q100−003) Vesd200 200 V
Short Circuit Reliability Characterization AECQ10x Grade A −
Operating Junction Temperature Tj −40 to 150 °C
Storage Temperature Range Tstr −55 to 150 °C
Moisture Sensitivity Level (MAX 260°C Processing) MSL2 2 −
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL INFORMATION (Note 1)
Rating
Symbol Value Unit
Package Thermal Resistance − Still−air
Junction−to−Ambient (Note 2)
(Note 3)
Junction−to−Lead (Note 2)
(Note 3)
R
q
JA
R
y
JBOARD
56
22
28
12
°C/W
1. Thermal Information is based on having 3 high side and 3 low side drivers dissipating 80 mW each.
2. Based on JESD51−3, 1.2 mm thick FR4, 2S0P PCB with 2 oz. copper and 18 thermal vias to 600 mm
2
spreader on bottom layer.
3. Based on JESD51−7, 1.2 mm thick FR4, 1S2P PCB with 2 oz. copper and 18 thermal vias to 80x80 mm 1 oz. internal spreader planes.
RECOMMENDED OPERATING CONDITIONS
Rating Symbol
Value
Unit
Min Max
Digital Supply Input Voltage VccOp 3.15 5.25 V
Battery Supply Input Voltage VsxOp 5.5 28 V
DC Output Current IxOp − 0.55 A
Junction Temperature TjOp −40 125 °C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.