MAX8819A/MAX8819B/MAX8819C
PMIC with Integrated Chargers and Smart
Power Selector in a 4mm x 4mm TQFN
28 ______________________________________________________________________________________
current is first reduced by lowering charge current. If
the junction temperature still reaches +120°C in spite of
charge current reduction, no input current is drawn
from DC; the battery supplies the entire load and SYS is
regulated 70mV below BAT.
Regulator Thermal-Overload Shutdown
The IC disables all regulator outputs and the battery
charger when the junction temperature rises above
+165°C, allowing the device to cool. When the junction
temperature cools by approximately 15°C the regula-
tors and charger resume the state indicated by the
enable input (EN123, EN4, and CEN) by repeating their
soft-start sequence. Please note that this thermal-over-
load shutdown is a fail-safe mechanism; proper thermal
design should ensure that the junction temperature of
the MAX8819_ never exceeds the absolute maximum
rating of +150°C.
Applications Information
Dynamic Output Voltage Adjustment
for Step-Down Converters
Dynamic output voltage adjustment can be implement-
ed for the step-down converter by adding a resistor
and a switch from FB_ to GND. See Figure 9.
To calculate the resistor-divider, start with the lower
voltage desired and calculate the resistor-divider using
R
T
and R
B
only. Setting R
B
= 100kΩ is acceptable. Use
the following equation to calculate R
T
:
where V
OUTL
is the desired lower output voltage and
V
FB
is the feedback regulation voltage, 1V (typ).
R
D
is calculated using the higher set voltage and the
following equations assuming the switch resistance is
negligible:
where R
PAR
is the parallel resistance of R
B
and R
D
,
V
OUTH
is the higher set voltage, and V
FB
is the feed-
back regulation voltage, 1V (typ).
For example, if V
OUTL
= 3V, V
OUTH
= 3.3V, R
B
=
100kΩ, then:
R
T
= 100kΩ x ((3V/1V) - 1) = 200kΩ
R
PAR
= 200kΩ/((3.3V/1V) - 1) = 86.96kΩ
R
D
= 1/((1/86.96kΩ) - (1/100kΩ)) = 666.7kΩ
Choose R
D
= 665kΩ as the closest standard 1% value.
CH1 = gate drive to switch
CH2 = V1, 1V offset; 3V to 3.3V to 3V, 10Ω load
CH3 = RST1
The scope plot (Figure 10) shows V1 switching from 3V
to 3.3V to 3V with the resistor values of the example.
When the switch is turned on, V1 slews from 3V to 3.3V
in about 20μs, which is less than the 50μs RST1 de-
glitch filter, and therefore, RST1 does not trip. When the
switch is turned off, V1 soars to about 3.35V due to the
energy in the inductor. Since V1 is above the regulation
voltage, REG1 skips until V1 decays to the regulation
voltage. The decay rate is determined by the output
capacitance and the load. In this example, the output
capacitance is 10μF and the load is 10Ω, so the time
R
R
V
V
R
RR
PAR
T
OUTH
FB
D
PAR B
=
=
1
1
11
RR
V
V
TB
OUTL
FB
1
OUT_
R
T
R
B
R
D
FB_
Figure 9. Dynamic Output Voltage Control
100μs/div
5V/div
0V
500mV/div
3V
4.2V
2V/div
3.35V
3.3V
3V
V1
RST1
GATE DRIVE
TO SWITCH
Figure 10. Dynamic Voltage Adjustment with Example Values
MAX8819A/MAX8819B/MAX8819C
PMIC with Integrated Chargers and Smart
Power Selector in a 4mm x 4mm TQFN
constant is R x C = 100μs, and the output voltage
decays to within 1% of final value in about 500μs.
PCB Layout and Routing
Good printed circuit board (PCB) layout is necessary to
achieve optimal performance. Refer to the MAX8819A
Evaluation Kit for Maxim’s recommended layout.
Use the following guidelines for the best results:
The LX_ rapidly switches between PV_ and PG_.
Minimize stray capacitance on LX_ to maintain high
efficiency.
Keep the FB_ node away from noise sources such
as the inductor.
The exposed pad (EP) is the main path for heat to
exit the IC. Connect EP to the ground plane with
thermal vias to allow heat to dissipate from the
device.
Use short and wide traces for high-current and dis-
continuous current paths.
The step-down converter power inputs are critical
discontinuous current paths that require careful
bypassing. Place the step-down converter input
bypass capacitor as close as possible to the PV_
and PG_ pins.
Minimize the area of the loops formed by the step-
down converters’ dynamic switching currents.
Package Marking
The top of the MAX8819_ package is laser etched as
shown in Figure 11:
“8819_ETI” is the product identification code. The full
part number is MAX8819_ETI; however, in this case, the
“MAX” prefix is omitted due to space limitations. The “_”
corresponds to the “A” or “B” version.
“yww” is a date code. “y” is the last number in the
Gregorian calendar year. “ww” is the week number in
the Gregorian calendar. For example:
“801” is the first week of 2008; the week of
January 1st, 2008.
“052” is the fifty-second week of 2010; the week of
December 27th, 2010.
“aaaa” is an assembly code and lot code.
“+” denotes lead-free packaging and marks the
pin 1 location.
8819_ETI
TIyww
+ aaaa
Figure 11. Package Marking Example
MAX8819A
MAX8819B
MAX8819C
TOP VIEW
26
27
25
24
10
9
11
FB4
PG4
LX4
GND
EN4
12
COMP4
PG3
PV13
LX1
DLIM1
PG1
CHG
12
PV2
4567
2021 19 17 16 15
LX2
PG2
CEN
DC
SYS
BAT
OVP4
LX3
3
18
28
8
DLIM2
RST1
EN123
23
13
FB1
FB3
22
14
CISET
FB2
+
EXPOSED PAD (EP)
Pin Configuration
Chip Information
PROCESS: S45T
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
28 TQFN-EP T2844+1
21-0139
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages
.
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________
29
© 2009 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.

MAX8819CETI+

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Power Management Specialized - PMIC PMIC w/Charger & Smart Power Selector
Lifecycle:
New from this manufacturer.
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