AD8194
Rev. 0 | Page 16 of 16
OUTLINE DIMENSIONS
092007-A
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
1
32
8
9
25
24
17
16
2.85
2.70 SQ
2.55
TOP
VIEW
COPLANARITY
0.08
3.50 REF
0.50
BSC
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.20 MIN
*
EXPOSED
PAD
(BOT TOM VIEW)
PIN 1
INDICATOR
0.30
0.25
0.18
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.05 MAX
0.02 NOM
SEATING
PLANE
0.50
0.40
0.30
5.00
BSC SQ
4.75
BSC SQ
*
THE AD8194 HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF
THE DEVICE OVER THE FULL HDMI/DVI TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO AVEE. IT IS RECOMMENDED THAT NO PCB SIGNAL TRACES
OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE SLUG.
ATTACHING THE SLUG TO AN AVEE PLANE REDUCES THE JUNCTION TEMPERATURE OF THE DEVICE WHICH MAY
BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
Figure 27. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature
Range
Package Description
Package
Option
Ordering
Quantity
AD8194ACPZ
1
−40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-8
AD8194ACPZ-R7
1
−40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ], Reel CP-32-8 1,500
AD8194-EVALZ
1
Evaluation Board
1
Z = RoHS Compliant Part.
©2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07004-0-11/07(0)
