Summary of Intel Cyclone 10 GX Features
Table 3. Summary of Features for Intel Cyclone 10 GX Devices
Feature Description
Technology TSMC's 20-nm process technology
Packaging 1.0 mm ball-pitch FineLine BGA packaging
0.8 mm ball-pitch Ultra FineLine BGA packaging
Multiple devices with identical package footprints for seamless migration between different
FPGA densities
RoHS6-compliance
High-performance
FPGA fabric
Enhanced 8-input ALM with four registers
Improved multi-track routing architecture to reduce congestion and improve compilation time
Hierarchical core clocking architecture
Internal memory
blocks
M20K—20-Kb memory blocks with hard error correction code (ECC), cascadable
Memory logic array block (MLAB)—640-bit memory, cascadable
Embedded Hard IP
blocks
Variable-precision DSP Native support for signal processing precision levels from 18 x 19 to
54 x 54, cascadable
Native support for 27 x 27 multiplier mode
64-bit accumulator and cascade for systolic finite impulse responses
(FIRs)
Internal coefficient memory banks
Preadder/subtractor for improved efficiency
Additional pipeline register to increase performance and reduce
power
Supports floating point arithmetic:
Perform multiplication, addition, subtraction, multiply-add,
multiply-subtract, and complex multiplication.
Supports multiplication with accumulation capability, cascade
summation, and cascade subtraction capability.
Dynamic accumulator reset control.
Support direct vector dot and complex multiplication chaining
multiply floating point DSP blocks.
Memory controller DDR3, DDR3L, and LPDDR3
PCI Express
®
PCI Express (PCIe
®
) Gen2 (x1, x2, or x4) and Gen1 (x1, x2, or x4) hard
IP with complete protocol stack, endpoint, and root port.
Transceiver I/O PCS hard IPs that support:
10 Gbps Ethernet (10GbE)
(1)
PCIe PIPE interface
Interlaken
Gbps Ethernet (GbE)
6G Common Public Radio Interface (CPRI) with deterministic
latency support
Gigabit-capable passive optical network (GPON) with fast lock-
time support
12G Serial Digital Interface (SDI)
8B/10B, 64B/66B, 64B/67B encoders and decoders
Custom mode support for proprietary protocols
continued...
(1)
10GBASE-KR is not supported.
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Feature Description
Core clock networks Up to 300 MHz fabric clocking, depending on the application:
467 MHz external memory interface clocking with 1,866 Mbps DDR3 interface
300 MHz LVDS interface clocking with 1.434 Gbps LVDS interface
Global, regional, and peripheral clock networks
Clock networks that are not used can be gated to reduce dynamic power
Phase-locked loops
(PLLs)
High-resolution fractional synthesis PLLs:
Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)
Support integer mode and fractional mode
Fractional mode support with third-order delta-sigma modulation
Integer PLLs:
Adjacent to general purpose I/Os
Support external memory and LVDS interfaces
FPGA General-purpose
I/Os (GPIOs)
One 3 V I/O bank supporting up to 3.0 V I/O standards
Up to 1.434 Gbps LVDS—every pair can be configured as receiver or transmitter
On-chip termination (OCT)
1.2 V to 3.0 V single-ended LVTTL/LVCMOS interfaces using LVDS I/O or 3 V I/O banks
External Memory
Interface
Hard memory controller—DDR3, DDR3L, and LPDDR3 support
DDR3 speeds up to 933 MHz/1,866 Mbps
Low-power serial
transceivers
Continuous operating range up to 12.5 Gbps
Backplane support up to 6.6 Gbps
Extended range down to 125 Mbps with oversampling
ATX transmit PLLs with user-configurable fractional synthesis capability
Transmitter pre-emphasis and de-emphasis
Dynamic reconfiguration of individual transceiver channels
Configuration Tamper protection—comprehensive design protection to protect your valuable IP investments
Enhanced 256-bit advanced encryption standard (AES) design security with authentication
Configuration via protocol (CvP) using PCIe Gen1 or Gen2
Dynamic reconfiguration of the transceivers and PLLs
Active Serial ×4 Interface
Power management Programmable Power Technology
IntelQuartus
®
Prime Pro Edition integrated power analysis tool
Software and tools IntelQuartus Prime Pro Edition design suite
Transceiver toolkit
Platform Designer (Standard) system integration tool
DSP Builder advanced blockset
OpenCL* support
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Intel Cyclone 10 GX Available Options
Figure 1. Sample Ordering Code and Available Options for Intel Cyclone 10 GX Devices
Family Signature
Package Type
Package Code
Operating Temperature
FPGA Fabric
Speed Grade
X : 12.5 Gbps transceivers
10C : Intel Cyclone 10
085 : 85K logic elements
105 : 105K logic elements
150 : 150K logic elements
220 : 220K logic elements
Y : Standard (0.9 V)
F : FineLine BGA (FBGA)
U : Ultra FineLine BGA (UBGA)
FBGA Package Type
672 : 672 pins
780 : 780 pins
UBGA Package Type
484 : 484 pins
E : Extended (T
J
= 0°C to 100°C)
I : Industrial (T
J
= -40°C to 100°C)
5 (fastest)
6
10C
X
220
Y F 780
I
5
Logic Density
Family Variant
Core Voltage
Optional Suffix
Indicates specific device
options or shipment method
RoHS
G : RoHS6-compliant
ES : Engineering sample
ESG
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DK-DEV-10CX220-A

Mfr. #:
Manufacturer:
Intel
Description:
Programmable Logic IC Development Tools Cyclone 10 GX Development Kit
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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