MAX1146–MAX1149
Multichannel, True-Differential,
Serial, 14-Bit ADCs
10 ______________________________________________________________________________________
OFFSET ERROR vs. TEMPERATURE
MAX1146 toc28
TEMPERATURE (°C)
OFFSET ERROR (LSB)
6035-15 10
-4
-2
0
2
4
6
-6
-40 85
Typical Operating Characteristics (continued)
(V
DD
= +5.0V (MAX1146/MAX1148), V
DD
= +3.3V (MAX1147/MAX1149), SHDN = V
DD
, V
COM
= 0, f
SCLK
= 2.1MHz, external clock
(50% duty cycle), 18 clocks/conversion (116ksps), V
REFADJ
= V
DD
, external +4.096V reference at REF (MAX1146/MAX1148), exter-
nal +2.500V reference at REF (MAX1147/MAX1149), C
REF
= 2.2µF, C
LOAD
= 50pF, T
A
= +25°C, unless otherwise noted.)
CHANNEL-TO-CHANNEL OFFSET MATCHING
vs. TEMPERATURE
MAX1146 toc26
TEMPERATURE (°C)
OFFSET MATCHING (LSB)
6035-15 10
-4
-2
0
2
4
6
-6
-40 85
GAIN ERROR vs. TEMPERATURE
MAX1146 toc27
TEMPERATURE (°C)
GAIN ERROR (LSB)
6035-15 10
-4
-2
0
2
4
6
-6
-40 85
CHANNEL-TO-CHANNEL OFFSET MATCHING
vs. SUPPLY VOLTAGE (MAX1147/MAX1149)
MAX1146 toc24
SUPPLY VOLTAGE (V)
OFFSET MATCHING (LSB)
3.33.0
-4
-2
0
2
4
6
-6
2.7 3.6
CHANNEL-TO-CHANNEL OFFSET MATCHING
vs. SUPPLY VOLTAGE (MAX1146/MAX1148)
MAX1146 toc25
SUPPLY VOLTAGE (V)
OFFSET MATCHING (LSB)
5.155.054.85 4.95
-4
-2
0
2
4
6
-6
4.75 5.25
CHANNEL-TO-CHANNEL GAIN MATCHING
vs. TEMPERATURE
MAX1146 toc23
TEMPERATURE (°C)
GAIN MATCHING (LSB)
6035-15 10
-4
-2
0
2
4
6
-6
-40 85
MAX1146–MAX1149
Multichannel, True-Differential,
Serial, 14-Bit ADCs
______________________________________________________________________________________ 11
PIN
MAX1148
MAX1149
MAX1146
MAX1147
NAME
FUNCTION
1 1 CH0
2 2 CH1
3 3 CH2
4 4 CH3
5 CH4
6 CH5
7 CH6
8 CH7
Analog Inputs
9 9 COM
Common Input. Negative analog input in single-ended mode. COM sets zero-code voltage in
unipolar and bipolar mode.
10 10 SHDN
Active-Low Shutdown Input. Pulling SHDN low shuts down the device reducing supply current
to 0.2µA. Driving shutdown high enables the devices.
11 11 REF
Reference-Buffer Output/ADC Reference Input. Reference voltage for analog-to-digital
conversion. In internal reference mode, the MAX1146/MAX1148 V
REF
is +4.096V, and the
MAX1147/MAX1149 V
REF
is +2.500V.
12 12
REFADJ
Bandgap Reference Output and Reference Buffer Input. Bypass to AGND with a 0.01µF
capacitor. Connect REFADJ to V
DD
to disable the internal bandgap reference and reference-
buffer amplifier.
13 13
AGND
Analog Ground
14 14
DGND
Digital Ground
15 15 DOUT
Serial Data Output. Data is clocked out at the falling edge of SCLK when CS is low. DOUT is
high impedance when CS is high.
16 16
SSTRB
Serial Strobe Output. In internal clock mode, SSTRB goes low when the ADC conversion
begins, and goes high when the conversion is finished. In external clock mode, SSTRB pulses
high for two clock periods before the MSB decision. SSTRB is high impedance when CS is high
(external clock mode).
17 17 DIN
Serial Data Input. Data is clocked in at the rising edge of SCLK when CS is low. DIN is high
impedance when CS is high.
18 18 CS
Active-Low Chip Select. Data is not clocked into DIN unless CS is low. When CS is high, DOUT
is high impedance.
19 19 SCLK
Serial Clock Input. Clocks data in and out of the serial interface and sets the conversion speed
in external clock mode. (Duty cycle must be 40% to 60%.)
20 20 V
DD
Positive Supply Voltage. Bypass to AGND with a 0.1µF capacitor.
5–8 N.C. No Connection. Not internally connected.
Pin Description
MAX1146–MAX1149
Multichannel, True-Differential,
Serial, 14-Bit ADCs
12 ______________________________________________________________________________________
Detailed Description
The MAX1146–MAX1149 ADCs use a successive-
approximation conversion technique and input T/H cir-
cuitry to convert an analog signal to a 14-bit digital
output. A flexible serial interface provides easy inter-
face to microprocessors (µPs). Figure 4 shows the typi-
cal application circuit and Figure 5 shows a functional
diagram of the MAX1148/MAX1149.
True-Differential Analog Input and
Track/Hold
The MAX1146–MAX1149 analog input architecture con-
tains an analog input multiplexer (MUX), two T/H
capacitors, T/H switches, a comparator, and two
switched capacitor digital-to-analog converters (DACs)
(Figure 6).
In single-ended mode, the analog input MUX connects
IN+ to the selected input channel and IN- to COM. In
differential mode, IN+ and IN- are connected to the
selected analog input pairs such as CH0/CH1. Select
the analog input channels according to Tables 1–5.
The analog input multiplexer switches to the selected
channel on the control byte’s fifth SCLK falling edge. At
this time, the T/H switches are in the track position and
C
T/H+
and C
T/H-
track the analog input signal. At the
control byte’s eighth SCLK falling edge, the MUX opens
and the T/H switches move to the hold position, retain-
ing the charge on C
T/H+
and C
T/H-
as a sample of the
input signal. See Figures 8–11 for input MUX and T/H
switch positioning.
During the conversion interval, the switched capacitive
DAC adjusts to restore the comparator-input voltage to
0 within the limits of 14-bit resolution. This action
requires 15 conversion clock cycles and is equivalent
to transferring a charge of 18pF × (V
IN+
- V
IN-
) from
C
T/H+
and C
T/H-
to the binary-weighted capacitive
DAC, forming a digital representation of the analog
input signal.
After conversion, the T/H switches move from the hold
position to the track position and the MUX switches
back to the last specified position. In internal clock
mode, the conversion is complete on the rising edge of
SSTRB. In external clock mode, the conversion is com-
plete on the eighteenth SCLK falling edge.
The time required for the T/H to acquire an input signal
is a function of the analog input source impedance. If
the input signal source impedance is high, the acquisi-
tion time lengthens. The MAX1146–MAX1149 provide
three SCLK cycles (t
ACQ
) in which the T/H capacitance
must acquire a charge representing the input signal,
typically the last three SCLKs of the control word. The
input source impedance (R
SOURCE
) should be mini-
mized to allow the T/H capacitance to charge within
this allotted time.
t
ACQ
= 11.5 × (R
SOURCE
+ R
IN
) × C
IN
where R
SOURCE
is the analog input source impedance,
R
IN
is 2.6k (which is the sum of the analog input MUX
and T/H switch resistances), and C
IN
is 18pF (which is
the sum of C
T/H+
, C
T/H-
, and input stray capacitance).
To minimize sampling errors with higher source imped-
ances, connect a 100pF capacitor from the analog
input to AGND. This input capacitor reduces the input’s
AC impedance but forms an RC filter with the source
impedance, limiting the analog input bandwidth. For
larger source impedance, use a buffer amplifier such as
the MAX4430 to maintain analog input signal integrity.
Figure 4. Typical Application Circuit
Figure 5. Functional Diagram

MAX1148BEUP+T

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Analog to Digital Converters - ADC 14-Bit 8Ch 116ksps 5V Precision ADC
Lifecycle:
New from this manufacturer.
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