NCP81241
www.onsemi.com
27
PACKAGE DIMENSIONS
QFN28 4x4, 0.4P
CASE 485AR
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
A
D
E
B
C0.10
PIN ONE
REFERENCE
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A
K
D2
E2
C
C0.10
C0.10
C0.08
A1
SEATING
PLANE
e
28X
NOTE 3
b
28X
0.07 C
0.05 C
A
BB
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
b 0.15 0.25
D 4.00 BSC
D2 2.50 2.70
E 4.00 BSC
E2 2.50 2.70
e 0.40 BSC
K
L 0.30 0.50
8
15
22
28X
0.40
PITCH
4.30
0.62
4.30
DIMENSIONS: MILLIMETERS
0.26
28X
1
L
A3 0.20 REF
MOUNTING FOOTPRINT*
NOTE 4
A3
PIN 1
INDICATOR
2.71
2.71
1
PACKAGE
OUTLINE
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTION
DETAIL B
DETAIL A
0.10 C A
BB
0.10 C A
BB
L1 −−− 0.15
0.30 REF
RECOMMENDED
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NCP81241/D
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