NCP81241
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6
Table 1. NCP81241 SINGLE ROW PIN DESCRIPTIONS
22 ROSC A resistance from this pin to ground programs the oscillator frequency
23 COMP Output of the error amplifier and the inverting input of the PWM comparator
24 FB Error amplifier voltage feedback
25 DIFFOUT Output of the differential remote sense amplifier
26 VSN Inverting input to differential remote sense amplifier
27 VSP Non−inverting input to the differential remote sense amplifier
28 Vcc Power for the internal control circuits. A 1uF decoupling capacitor is connected from this pin to ground
29 FLAG/GND
Table 2. ABSOLUTE MAXIMUM RATINGS
Pin Symbol V
MAX
V
MIN
Isource Isink
COMP VCC + 0.3 V −0.3 V 2 mA 2 mA
CSCOMP VCC + 0.3 V −0.3 V 2 mA 2 mA
VSN GND + 300 mV GND – 300 mV 1 mA 1 mA
DIFFOUT VCC + 0.3 V −0.3 V 2 mA 2 mA
VR_RDY VCC + 0.3 V −0.3 V N/A 2 mA
VCC 6.5 V −0.3 V N/A N/A
ROSC VCC + 0.3 V −0.3 V
IOUT 2.0 V −0.3 V
VRMP +25 V −0.3 V
SW 35 V
40 V ≤ 50 ns
−5 V
−10 V ≤ 200 ns
BST 35 V wrt/ GND
40 V ≤ 50 ns wrt/GND
6.5 V wrt/ SW
−0.3 V wrt/SW
LG VCC + 0.3 V −0.3 V
−5 V ≤ 200 ns
HG BST + 0.3 V −0.3 V wrt/ SW
−2 V ≤ 200 ns wrt/SW
All Other Pins VCC + 0.3 V −0.3 V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
*All signals referenced to GND unless noted otherwise.
Table 3. THERMAL INFORMATION
Thermal Characteristic
QFN Package (Note 1)
R
q
JA
68
_C/W
Operating Junction Temperature Range (Note 2) T
J
−10 to 125
_C
Operating Ambient Temperature Range T
A
−10 to 100
_C
Maximum Storage Temperature Range T
STG
−40 to +150
_C
Moisture Sensitivity Level
QFN Package
MSL 1
ESD Human Body Model HBM 2000 V
ESD Machine Model MM 200 V
ESD Charged Device Model CDM 1000 V
*The maximum package power dissipation must be observed.
1. JESD 51−5 (1S2P Direct−Attach Method) with 0 LFM
2. JESD 51−7 (1S2P Direct−Attach Method) with 0 LFM
