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SST39WF400B-70-4I-B3KE

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P32
©2011 Silicon Storage Technology, Inc. DS25034A 09/11
28
4 Mbit (x16) Multi-Purpose Flash
SST39WF400B
Data Sheet
A
Microchip Technology Company
Product Ordering Information
Valid combinations for SST39WF400B
SST39WF400B-70-4C-B3KE SST39WF400B-70-4I-B3KE
SST39WF400B-70-4C-CAQE SST39WF400B-70-4I-CAQE
SST39WF400B-70-4C-MAQE SST39WF400B-70-4I-MAQE
Note:Valid combinations are those products in mass production or will be in mass production. Consult your SST
sales representative to confirm availability of valid combinations and to determine availability of new combi-
nations.
SST 39 WF 400B - 70 - 4C - B3KE
XX XX XXXX - XX - XX
-
XXXX
Environmental Attribute
E
1
= non-Pb
Package Modifier
K = 48 balls
Q = 48 balls (66 possible positions)
Package Type
B3 = TFBGA
CA = XFLGA
MA = WFBGA
Temperature Range
C = Commercial = 0°C to +70°C
I = Industrial = -40°C to +85°C
Minimum Endurance
4 = 10,000 cycles
Read Access Speed
70 = 70 ns
Device Density
400 = 4 Mbit
Voltage
W = 1.65-1.95V
Product Series
39 = Multi-Purpose Flash
1. Environmental suffix “E” denotes non-Pb sol-
der. SST non-Pb solder devices are “RoHS
Compliant”.
©2011 Silicon Storage Technology, Inc. DS25034A 09/11
29
4 Mbit (x16) Multi-Purpose Flash
SST39WF400B
Data Sheet
A
Microchip Technology Company
Packaging Diagrams
Figure 22:48-Ball Thin-Profile, Fine-Pitch Ball Grid Array (TFBGA) 6mm x 8mm
SST Package Code: B3K
A1 CORNER
HGFEDCBA
ABCDEFGH
BOTTOM VIEWTOP VIEW
SIDE VIEW
6
5
4
3
2
1
6
5
4
3
2
1
SEATING PLANE
0.35 0.05
1.10 0.10
0.12
6.00 0.10
0.45 0.05
(48X)
A1 CORNER
8.00 0.10
0.80
4.00
0.80
5.60
48-tfbga-B3K-6x8-450mic-5
Note: 1. Complies with JEDEC Publication 95, MO-210, variant AB-1 , although some dimensions may be more stringent.
2. All linear dimensions are in millimeters.
3. Coplanarity: 0.12 mm
4. Ball opening size is 0.38 mm ( 0.05 mm)
1mm
©2011 Silicon Storage Technology, Inc. DS25034A 09/11
30
4 Mbit (x16) Multi-Purpose Flash
SST39WF400B
Data Sheet
A
Microchip Technology Company
Figure 23: 48-Ball Extremely Thin-Profile, Fine-Pitch Land Grid Array (XFLGA) 4mm x 6mm
SST Package Code: CAQ
LKJHGFEDCBA
ABCDEFGHJKL
6
5
4
3
2
1
6
5
4
3
2
1
0.50
0.50
BOTTOM VIEW
4.00
0.08
0.29
0.05
(48X)
6.00
0.08
2.50
5.00
A1 CORNER
TO P VI EW
48-xflga-CAQ-4x6-29mic-6.0
Note: 1. Complies with JEDEC Publication 95, MO-207, variant CZB-4, dimensions except the bump height
is much less, and the A1 indicator is different.
2. All linear dimensions are in millimeters.
3. Coplanarity: 0.08 mm.
4. For low-profile mounting on PCB, SST recommends underfill for best solder joint reliability.
1mm
DETAIL
SIDE VIEW
SEATING PLANE
0.04
+0.025/-0.015
0.52 max.
0.473 nom.
0.08
A1 INDICATOR
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P32

SST39WF400B-70-4I-B3KE

Mfr. #:
Buy SST39WF400B-70-4I-B3KE
Manufacturer:
Microchip Technology
Description:
NOR Flash 4M (256Kx16) 70ns Industrial Temp
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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