©2011 Silicon Storage Technology, Inc. DS25034A 09/11
4
4 Mbit (x16) Multi-Purpose Flash
SST39WF400B
Data Sheet
A
Microchip Technology Company
Pin Assignments
Figure 2: Pin Assignments for 48-Ball WFBGA and 48-Ball XFLGA
Figure 3: Pin Assignments for 48-ball TFBGA
A2
A1
A0
CE#
V
SS
A4
A3
A5
DQ8
OE#
DQ0
A6
A7
NC
DQ10
DQ9
DQ1
A17
NC
NC
DQ2
NC
DQ3
NC
V
DD
WE#
DQ12
NC
NC
NC
DQ13
A9
A10
A8
DQ4
DQ5
DQ14
A11
A13
A12
DQ11
DQ6
DQ15
A14
A15
A16
DQ7
V
SS
TOP VIEW (balls facing down)
AB C D E F GH J K L
6
5
4
3
2
1
1370 48-wfbga M2Q P02.0
SST39WF400B
1370 48-tfbga P01.0
SST39WF400B
TOP VIEW (balls facing down)
6
5
4
3
2
1
ABCDEFGH
A13
A9
WE#
NC
A7
A3
A12
A8
NC
NC
A17
A4
A14
A10
NC
NC
A6
A2
A15
A11
NC
NC
A5
A1
A16
DQ7
DQ5
DQ2
DQ0
A0
NC
DQ14
DQ12
DQ10
DQ8
CE#
DQ15
DQ13
V
DD
DQ11
DQ9
OE#
V
SS
DQ6
DQ4
DQ3
DQ1
V
SS
©2011 Silicon Storage Technology, Inc. DS25034A 09/11
5
4 Mbit (x16) Multi-Purpose Flash
SST39WF400B
Data Sheet
A
Microchip Technology Company
Table 1: Pin Description
Symbol Pin Name Functions
A
MS
1
-A
0
1. A
MS
= Most significant address
A
MS
=A
17
for SST39WF400B
Address Inputs To provide memory addresses. During Sector-Erase A
MS
-A
11
address lines
will select the sector. During Block-Erase A
MS
-A
15
address lines will select
the block.
DQ
15
-DQ
0
Data Input/output To output data during Read cycles and receive input data during Program
cycles.
Data is internally latched during a Program cycle.
The outputs are in tri-state when OE# or CE# is high.
CE# Chip Enable To activate the device when CE# is low.
OE# Output Enable To gate the data output buffers.
WE# Write Enable To control the Program operations.
V
DD
Power Supply To provide power supply voltage: 1.65-1.95V for SST39WF400B
V
SS
Ground
NC No Connection Unconnected pins.
T1.0 25034
©2011 Silicon Storage Technology, Inc. DS25034A 09/11
6
4 Mbit (x16) Multi-Purpose Flash
SST39WF400B
Data Sheet
A
Microchip Technology Company
Device Operation
Commands, which are used to initiate the memory operation functions of the device, are written to the
device using standard microprocessor write sequences. A command is written by asserting WE# low
while keeping CE# low. The address bus is latched on the falling edge of WE# or CE#, whichever
occurs last. The data bus is latched on the rising edge of WE# or CE#, whichever occurs first.
Read
The Read operation of the SST39WF400B is controlled by CE# and OE#; both have to be low for the
system to obtain data from the outputs.
CE# is used for device selection. When CE# is high, the chip is deselected and only standby power is
consumed.
OE# is the output control and is used to gate data from the output pins. The data bus is in high imped-
ance state when either CE# or OE# is high. See Figure 5.
Word-Program Operation
The SST39WF400B is programmed on a word-by-word basis. The sector where the word exists must
be fully erased before programming.
Programming is accomplished in three steps:
1. Load the three-byte sequence for Software Data Protection.
2. Load word address and word data. During the Word-Program operation, the addresses
are latched on the falling edge of either CE# or WE#, whichever occurs last. The data is
latched on the rising edge of either CE# or WE#, whichever occurs first.
3. Initiate the internal Program operation after the rising edge of the fourth WE# or CE#,
whichever occurs first. Once initiated, the Program operation will be completed within 40
µs. See Figures 6 and 7 for WE# and CE# controlled Program operation timing diagrams
and Figure 18 for flowcharts.
During the Program operation, the only valid reads are Data# Polling and Toggle Bit. During the inter-
nal Program operation, the host is free to perform additional tasks. Any commands issued during the
internal Program operation are ignored.

SST39WF400B-70-4I-B3KE

Mfr. #:
Manufacturer:
Microchip Technology
Description:
NOR Flash 4M (256Kx16) 70ns Industrial Temp
Lifecycle:
New from this manufacturer.
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