Data Sheet ADG1208/ADG1209
Rev. E | Page 11 of 21
V
SS
S1A
S2A
S3A
S1B
V
DD
S2B
S3B
S4A
DA
DB
S4B
A0
EN
A1
GND
05713-005
12
11
10
1
3
4
9
2
6
5
7
8
16
15
14
13
1. THE EXPOSED PAD IS CONNECTED INTERNALLY.
FOR INCREASED RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY,
IT IS RECOMMENDED THAT THE PAD BE
SOLDERED TO THE SUBSTRATE, V
SS
.
ADG1209
TOP VIEW
(Not to Scale)
Figure 8. 16-Lead LFCSP Pin Configuration (ADG1209)
Table 8. 16-Lead LFCSP Pin Function Descriptions (ADG1209)
Pin No. Mnemonic Description
1 V
SS
Most Negative Power Supply Potential. In single-supply applications, it can be connected to ground.
2 S1A Source Terminal 1A. Can be an input or an output.
3 S2A Source Terminal 2A. Can be an input or an output.
4 S3A Source Terminal 3A. Can be an input or an output.
5 S4A Source Terminal 4A. Can be an input or an output.
6 DA Drain Terminal A. Can be an input or an output.
7 DB Drain Terminal B. Can be an input or an output.
8 S4B Source Terminal 4B. Can be an input or an output.
9 S3B Source Terminal 3B. Can be an input or an output.
10 S2B Source Terminal 2B. Can be an input or an output.
11 S1B Source Terminal 1B. Can be an input or an output.
12 V
DD
Most Positive Power Supply Potential.
13 GND Ground (0 V) Reference.
14 A1 Logic Control Input.
15 A0 Logic Control Input.
16 EN
Active High Digital Input. When low, the device is disabled and all switches are off. When high, Ax logic inputs
determine on switches.
EPAD
Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and maximum
thermal capability, it is recommended that the pad be soldered to the substrate, V
SS
.
Table 9. ADG1209 Truth Table
A1 A0 EN On Switch Pair
X X 0 None
0 0 1 1
0 1 1 2
1 0 1 3
1 1 1 4