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ADG1208YCPZ-REEL7

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21
Data Sheet ADG1208/ADG1209
Rev. E | Page 19 of 21
V
OUT
50Ω
NETWORK
ANALYZER
R
L
50Ω
S
D
50Ω
OFF ISOLATION = 20 log
V
OUT
V
S
V
S
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
GND
05713-026
Figure 38. Off Isolation
V
OUT
50Ω
NETWORK
ANALYZER
R
L
50Ω
S
D
INSERTION LOSS = 20 log
V
OUT
WITH SWITCH
V
OUT
WITHOUT SWITCH
V
S
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
GND
05713-027
Figure 39. Bandwidth
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
V
OUT
GND
S1
D
S2
V
OUT
NETWORK
ANALYZER
R
L
50Ω
R
50Ω
V
S
V
S
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
05713-028
Figure 40. Channel to Channel Crosstalk
V
OUT
R
S
AUDIO PRECISION
R
L
10kΩ
IN
V
IN
S
D
V
S
V p-p
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
GND
05713-029
Figure 41. THD + N
ADG1208/ADG1209 Data Sheet
Rev. E | Page 20 of 21
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 42. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
4.10
4.00 SQ
3.90
0.35
0.30
0.25
2.25
2.10 SQ
1.95
1
0.65
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
0.70
0.60
0.50
SEATING
PLANE
0.05 MAX
0.02 NOM
0.203 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
0.80
0.75
0.70
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGC.
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
04-15-2016-A
PKG-004025/5112
P
I
N
1
I
N
D
I
C
A
T
O
R
A
R
E
A
O
P
T
I
O
N
S
(
S
E
E
D
E
T
A
I
L
A
)
DETAIL A
(JEDEC 95)
EXPOSED
PAD
Figure 43. 16-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-16-23)
Dimensions shown in millimeters
Data Sheet ADG1208/ADG1209
Rev. E | Page 21 of 21
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AC
10.00 (0.3937)
9.80 (0.3858)
16
9
8
1
6.20 (0.2441)
5.80 (0.2283)
4.00 (0.1575)
3.80 (0.1496)
1.27 (0.0500)
BSC
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
COPLANARITY
0.10
8°
0°
060606-A
45°
Figure 44. 16-Lead Standard Small Outline Package [SOIC_N]
Narrow Body (R-16)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG1208YRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1208YRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1208YCPZ-REEL −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-23
ADG1208YCPZ-REEL7 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-23
ADG1208YRZ −40°C to +125°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG1208YRZ-REEL7 −40°C to +125°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG1209YRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1209YRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1209YCPZ-REEL7 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-23
ADG1209YRZ −40°C to +125°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG1209YRZ-REEL7 −40°C to +125°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
1
Z = RoHS Compliant Part.
©2006–2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05713-0-6/16(E)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21

ADG1208YCPZ-REEL7

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Buy ADG1208YCPZ-REEL7
Manufacturer:
Analog Devices Inc.
Description:
Multiplexer Switch ICs 8:1 550MHz 120 Ohm iCMOS
Lifecycle:
New from this manufacturer.
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