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ADG1208YCPZ-REEL7

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21
Data Sheet ADG1208/ADG1209
Rev. E | Page 7 of 21
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Rating
V
DD
to V
SS
35 V
V
DD
to GND −0.3 V to +25 V
V
SS
to GND +0.3 V to −25 V
Analog Inputs
1
V
SS
− 0.3 V to V
DD
+ 0.3 V or
30 mA (whichever occurs first)
Digital Inputs
1
GND − 0.3 V to V
DD
+ 0.3 V or
30 mA (whichever occurs first)
Continuous Current, S or D 30 mA
Peak Current, S or D (Pulsed at
1 ms, 10% Duty Cycle Maximum)
100 mA
Operating Temperature Range
Industrial (Y Version) −40°C to +125°C
Storage Temperature
−65°C to +150°C
Junction Temperature 150°C
θ
JA
Thermal Impedance
TSSOP 112°C/W
LFCSP 30.4°C/W
SOIC 77°C/W
Reflow Soldering Peak
Temperature (Pb-Free)
260(+0/−5)°C
1
Overvoltages at A, EN, S, or D are clamped by internal diodes. Current should
be limited to the maximum ratings given.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
ADG1208/ADG1209 Data Sheet
Rev. E | Page 8 of 21
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
EN
V
SS
S1
S4
S3
S2
A0
A2
GND
V
DD
S7
DS8
S6
S5
A1
ADG1208
TOP VIEW
(Not to Scale)
0
5713-002
Figure 3. 16-Lead TSSOP Pin Configuration (ADG1208)
0
5713-006
1
2
3
4
16
15
14
13
5 12
6 11
7 10
8 9
EN
V
SS
S1
S4
S3
S2
A0
A2
GND
V
DD
S7
DS8
S6
S5
A1
ADG1208
TOP VIEW
(Not to Scale)
Figure 4. 16-Lead SOIC Pin Configuration (ADG1208)
Table 4. 16-Lead TSSOP and 16-Lead SOIC Pin Function Descriptions (ADG1208)
Pin No. Mnemonic Description
1 A0 Logic Control Input.
2 EN
Active High Digital Input. When low, the device is disabled and all switches are off. When high, Ax logic inputs
determine on switches.
3 V
SS
Most Negative Power Supply Potential. In single-supply applications, it can be connected to ground.
4 S1 Source Terminal 1. Can be an input or an output.
5 S2 Source Terminal 2. Can be an input or an output.
6 S3 Source Terminal 3. Can be an input or an output.
7 S4 Source Terminal 4. Can be an input or an output.
8 D Drain Terminal. Can be an input or an output.
9 S8 Source Terminal 8. Can be an input or an output.
10 S7 Source Terminal 7. Can be an input or an output.
11 S6 Source Terminal 6. Can be an input or an output.
12 S5 Source Terminal 5. Can be an input or an output.
13 V
DD
Most Positive Power Supply Potential.
14 GND Ground (0 V) Reference.
15 A2 Logic Control Input.
16 A1 Logic Control Input.
Data Sheet ADG1208/ADG1209
Rev. E | Page 9 of 21
V
SS
S1
S2
S3
V
DD
GND
S5
S6
S4
D
S8
S7
A0
EN
A1
A2
05713-004
12
11
10
1
3
4
9
2
6
5
7
8
16
15
14
13
1. THE EXPOSED PAD IS CONNECTED INTERNALLY.
FOR INCREASED RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY,
IT IS RECOMMENDED THAT THE PAD BE
SOLDERED TO THE SUBSTRATE, V
SS
.
ADG1208
TOP VIEW
(Not to Scale)
Figure 5. 16-Lead LFCSP Pin Configuration (ADG1208)
Table 5. 16-Lead LFCSP Pin Function Descriptions (ADG1208)
Pin No. Mnemonic Description
1 V
SS
Most Negative Power Supply Potential. In single-supply applications, it can be connected to ground.
2 S1 Source Terminal 1. Can be an input or an output.
3 S2 Source Terminal 2. Can be an input or an output.
4 S3 Source Terminal 3. Can be an input or an output.
5 S4 Source Terminal 4. Can be an input or an output.
6 D Drain Terminal. Can be an input or an output.
7 S8 Source Terminal 8. Can be an input or an output.
8 S7 Source Terminal 7. Can be an input or an output.
9 S6 Source Terminal 6. Can be an input or an output.
10 S5 Source Terminal 5. Can be an input or an output.
11 V
DD
Most Positive Power Supply Potential.
12 GND Ground (0 V) Reference.
13 A2 Logic Control Input.
14 A1 Logic Control Input.
15 A0 Logic Control Input.
16 EN
Active High Digital Input. When low, the device is disabled and all switches are off. When high, Ax logic inputs
determine on switches.
EPAD
Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and maximum
thermal capability, it is recommended that the pad be soldered to the substrate, V
SS
.
Table 6. ADG1208 Truth Table
A2 A1 A0 EN On Switch
X X X 0 None
0 0 0 1 1
0 0 1 1 2
0 1 0 1 3
0 1 1 1 4
1 0 0 1 5
1 0 1 1 6
1 1 0 1 7
1 1 1 1 8
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21

ADG1208YCPZ-REEL7

Mfr. #:
Buy ADG1208YCPZ-REEL7
Manufacturer:
Analog Devices Inc.
Description:
Multiplexer Switch ICs 8:1 550MHz 120 Ohm iCMOS
Lifecycle:
New from this manufacturer.
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