AD780 Data Sheet
Rev. H | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Values
+V
IN
to Ground 36 V
TRIM Pin to Ground 36 V
TEMP Pin to Ground 36 V
Power Dissipation (25°C) 500 mW
Storage Temperature −65°C to +150°C
Lead Temperature
(Soldering 10 sec)
300°C
Output safe for indefinite short to
ground and momentary short to V
IN
.
ESD Classification Class 1 (1000 V)
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
00841-002
NOTES
1. DNC = DO NOT CONNECT T
O THIS PIN.
AD780
TOP
VIEW
(Not to Scale)
DNC
1
+V
IN
2
TEMP
3
GND
4
2.5V/3.0V O/PSELECT
(DNC OR GND)
DNC
V
OUT
TRIM
8
7
6
5
Figure 2. Pin Configuration, 8-Lead PDIP and SOIC Packages
Table 3. Die Physical Characteristics
Parameter Value Units
Die Size 67 × 96 mil
Back Grind Thickness 10 mil
Bond Pad Opening Size 89 × 136 µm
Passivation Oxynitride
Polyimide None µm
Die Marker 780
Substrate Bias GND V
00841-003
GND
TEMP
96 mils
67 mils
+V
IN
TRIM 2.5V/3.0V
O/P SELECT
V
OUT
GND
Figure 3. Die Layout
NOTES
Both V
OUT
pads must be connected to the output.
Die Thickness: The standard thickness of Analog Devices, Inc.
bipolar dice is 10 mil ± 1 mil.
Die Dimensions: The dimensions given are the maximum possible
die size.
Backing: The standard backside surface is silicon (not plated).
Analog Devices does not recommend gold-backed dice for most
applications.
Edges: A diamond saw is used to separate wafers into dice, thus
providing perpendicular edges halfway through the die. In
contrast to scribed dice, this technique provides a more uniform
die shape and size. The perpendicular edges facilitate handling
(such as tweezer pickup), while the uniform shape and size
simplify substrate design and die attach.
Top Surface: The standard top surface of the die is covered by a
layer of passivation. All areas are covered except bonding pads
and scribe lines.
Surface Metallization: The metallization to Analog Devices
bipolar dice is aluminum/copper. The minimum thickness is
10,000 Å.
Bonding Pads: All bonding pads have a minimum size of
4.0 mil by 6.0 mil. The passivation windows have a minimum
size of 3.5 mil by 5.3 mil.
ESD CAUTION
