LTC3867
28
3867f
APPLICATIONS INFORMATION
Phase-Locked Loop and Frequency Synchronization
The LTC3867 has a phase-locked loop (PLL) comprised
of an internal voltage-controlled oscillator (VCO) and a
phase detector. This allows the turn-on of the top MOSFET
to be locked to the rising edge of an external clock signal
applied to the MODE/PLLIN pin. The phase detector is
an edge sensitive digital type that provides zero degrees
phase shift between the external and internal oscillators.
This type of phase detector does not exhibit false lock to
harmonics of the external clock.
The output of the phase detector is a pair of complemen-
tary current sources that charge or discharge the internal
filter network. There is a precision 20µA current flowing
out of the FREQ pin. This allows the user to use a single
resistor to SGND to set the switching frequency when
no external clock is applied to the MODE/PLLIN pin. The
internal switch between the FREQ pin and the integrated
PLL filter network is on, allowing the filter network to be
pre-charged at the same voltage as of the FREQ pin. The
relationship between the voltage on the FREQ pin and
operating frequency is shown in Figure 14 and specified
in the Electrical Characteristics table. If an external clock
is detected on the MODE/PLLIN pin, the internal switch
mentioned above turns off and isolates the influence of the
FREQ pin. Note that the LTC3867 can only be synchronized
to an external clock whose frequency is within range of
the LTC3867’s internal VCO. A simplified block diagram
is shown in Figure 15.
If the external clock frequency is greater than the inter-
nal oscillators frequency, f
OSC
, then current is sourced
continuously from the phase detector output, pulling up
the filter network. When the external clock frequency is
less than f
OSC
, current is sunk continuously, pulling down
the filter network. If the external and internal frequencies
are the same but exhibit a phase difference, the current
sources turn on for an amount of time corresponding to
the phase difference. The voltage on the filter network is
adjusted until the phase and frequency of the internal and
external oscillators are identical. At the stable operating
point, the phase detector output is high impedance and
the filter capacitor C
LP
holds the voltage.
Typically, the external clock (on the MODE/PLLIN pin) input
high threshold is 1.6V, while the input low threshold is 1V.
Minimum On-Time Considerations
Minimum on-time, t
ON(MIN)
, is the smallest time duration
that the LTC3867 is capable of turning on the top MOSFET.
It is determined by internal timing delays and the gate
charge required to turn on the top MOSFET. Low duty
cycle applications may approach this minimum on-time
limit and care should be taken to ensure that:
t
ON(MIN)
<
V
OUT
V
IN
f
( )
Figure 14. Relationship Between Oscillator
Frequency and Voltage at the FREQ Pin
Figure 15. Phase-Locked Loop Block Diagram
V
FREQ
(V)
0.4
FREQUENCY (kHz)
900
1100
1300
1.0 1.4
3867 F14
700
500
0.6 0.8
1.2 1.6 1.8
300
100
DIGITAL
PHASE/
FREQUENCY
DETECTOR
VCO
2.4V 5V
20µA
R
SET
3867 F15
FREQ
SYNC
EXTERNAL
OSCILLATOR
MODE/PLLIN
LTC3867
29
3867f
APPLICATIONS INFORMATION
If the duty cycle falls below what can be accommodated
by the minimum on-time, the controller will begin to skip
cycles. The output voltage will continue to be regulated,
but the voltage ripple and current ripple will increase.
The minimum on-time for the LTC3867 is approximately
65ns, with good PCB layout, minimum 30% inductor
current ripple and at least 10mV ripple on the current
sense signal. The minimum on-time can be affected by
PCB switching noise in the voltage and current loop. As
the peak sense voltage decreases the minimum on-time
gradually increases to about 100ns. This is of particular
concern in forced continuous applications with low ripple
current at light loads. If the duty cycle drops below the
minimum on-time limit in this situation, a significant
amount of cycle skipping can occur with correspondingly
larger current and voltage ripple.
Efficiency Considerations
The percent efficiency of a switching regulator is equal to
the output power divided by the input power times 100%.
It is often useful to analyze individual losses to determine
what is limiting the efficiency and which change would
produce the most improvement. Percent efficiency can
be expressed as:
%Efficiency = 100% – (L1 + L2 + L3 + ...)
where L1, L2, etc. are the individual losses as a percent-
age of input power.
Although all dissipative elements in the circuit produce
losses, four main sources usually account for most
of the losses in LTC3867 circuits: 1) IC V
IN
current, 2)
INTV
CC
regulator current, 3) I
2
R losses, 4) topside MOSFET
transition losses.
1. The V
IN
current is the DC supply current given in the
Electrical Characteristics table, which excludes MOSFET
driver and control currents. V
IN
current typically results
in a small (<0.1%) loss.
2.
INTV
CC
current is the sum of the MOSFET driver and
control currents. The MOSFET driver current results
from switching the gate capacitance of the power
MOSFETs. Each time a MOSFET gate is switched from
low to high to low again, a packet of charge dQ moves
from INTV
CC
to ground. The resulting dQ/dt is a current
out of INTV
CC
that is typically much larger than the
control circuit current. In continuous mode, I
GATECHG
= f(Q
T
+ Q
B
), where Q
T
and Q
B
are the gate charges
of the topside and bottom side MOSFETs. Supplying
INTV
CC
power through EXTV
CC
from an output-derived
source will scale the V
IN
current required for the driver
and control circuits by a factor of (duty cycle)/(effi-
ciency). For example, in a 20V to 5V application, 10mA
of INTV
CC
current results in approximately 2.5mA of
V
IN
current. This reduces the mid-current loss from
10% or more (if the driver was powered directly from
V
IN
) to only a few percent.
3. I
2
R losses are predicted from the DC resistances of
the fuse (if used), MOSFET, inductor and current sense
resistor. In continuous mode, the average output current
flows through L and R
SENSE
, but is chopped between
the topside MOSFET and the synchronous MOSFET. If
the two MOSFETs have approximately the same R
DS(ON)
,
then the resistance of one MOSFET can simply be
summed with the resistances of L and R
SENSE
to ob-
tain I
2
R losses. For example, if each R
DS(ON)
= 10mΩ,
R
L
= 10mΩ, R
SENSE
= 5mΩ, then the total resistance is
25mΩ. This results in losses ranging from 2% to 8%
as the output current increases from 3A to 15A for a 5V
output, or a 3% to 12% loss for a 3.3V output.
Efficiency varies as the inverse square of V
OUT
for the
same external components and output power level. The
combined effects of increasingly lower output voltages
and higher currents required by high performance digital
systems is not doubling but quadrupling the importance
of loss terms in the switching regulator system!
LTC3867
30
3867f
APPLICATIONS INFORMATION
4. Transition losses apply only to the topside MOSFET(s),
and become significant only when operating at high
input voltages (typically 15V or greater). Transition
losses can be estimated from:
Transition Loss = (1.7) V
IN
2
• I
O(MAX)
• C
RSS
• f
Other hidden losses such as copper trace and internal
battery resistances can account for an additional 5%
to 10% efficiency degradation in portable systems. It
is very important to include these system level losses
during the design phase. The internal battery and fuse
resistance losses can be minimized by making sure that
C
IN
has adequate charge storage and very low ESR at
the switching frequency. A 25W supply will typically
require a minimum of 20µF to 40µF of capacitance
having a maximum of 20mΩ to 50mΩ of ESR. Other
losses including Schottky conduction losses during
dead time and inductor core losses generally account
for less than 2% total additional loss.
Checking Transient Response
The regulator loop response can be checked by looking at
the load current transient response. Switching regulators
take several cycles to respond to a step in DC (resistive)
load current. When a load step occurs, V
OUT
shifts by an
amount equal to I
LOAD
ESR, where ESR is the effective
series resistance of C
OUT
. I
LOAD
also begins to charge or
discharge C
OUT
generating the feedback error signal that
forces the regulator to adapt to the current change and
return V
OUT
to its steady-state value. During this recovery
time V
OUT
can be monitored for excessive overshoot or
ringing, which would indicate a stability problem. The
availability of the I
TH
pin not only allows optimization of
control loop behavior but also provides a DC-coupled and
AC-filtered closed-loop response test point. The DC step,
rise time and settling at this test point truly reflects the
closed-loop response. Assuming a predominantly second
order system, phase margin and/or damping factor can be
estimated using the percentage of overshoot seen at this
pin. The bandwidth can also be estimated by examining the
rise time at the pin. The I
TH
external components shown
in the Typical Application circuit will provide an adequate
starting point for most applications. The I
TH
series R
C
-C
C
filter sets the dominant pole-zero loop compensation.
The values can be modified slightly (from 0.5 to 2 times
their suggested values) to optimize transient response
once the final PC layout is done and the particular output
capacitor type and value have been determined. The output
capacitors need to be selected because the various types
and values determine the loop gain and phase. An output
current pulse of 20% to 80% of full-load current having
a rise time of 1µs to 10µs will produce output voltage and
I
TH
pin waveforms that will give a sense of the overall loop
stability without breaking the feedback loop. Placing a
power MOSFET directly across the output capacitor and
driving the gate with an appropriate signal generator is a
practical way to produce a realistic load step condition. The
initial output voltage step resulting from the step change
in output current may not be within the bandwidth of the
feedback loop, so this signal cannot be used to determine
phase margin. This is why it is better to look at the I
TH
pin signal which is in the feedback loop and is the filtered
and compensated control loop response. The gain of the
loop will be increased by increasing R
C
and the bandwidth
of the loop will be increased by decreasing C
C
. If R
C
is
increased by the same factor that C
C
is decreased, the
zero frequency will be kept the same, thereby keeping the
phase shift the same in the most critical frequency range
of the feedback loop. The output voltage settling behavior
is related to the stability of the closed-loop system and
will demonstrate the actual overall supply performance.
A second, more severe transient is caused by switching
in loads with large (>1µF) supply bypass capacitors. The
discharged bypass capacitors are effectively put in parallel
with C
OUT
, causing a rapid drop in V
OUT
. No regulator can
alter its delivery of current quickly enough to prevent this
sudden step change in output voltage if the load switch
resistance is low and it is driven quickly. If the ratio of
C
LOAD
to C
OUT
is greater than 1:50, the switch rise time
should be controlled so that the load rise time is limited
to approximately 25 C
LOAD
. Thus a 10µF capacitor would
require a 250µs rise time, limiting the charging current
to about 200mA.

LTC3867IUF#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Synchronous Step-Down DC/DC Controller with Differential Remote Sense and Non-Linear Control
Lifecycle:
New from this manufacturer.
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