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LTC4070EDDB#TRMPBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
LTC4070
13
4070fc
package DescripTion
DDB Package
8-Lead Plastic DFN (3mm ¥ 2mm)
(Reference LTC DWG # 05-08-1702 Rev B)
2.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
0.56 ± 0.05
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
R = 0.05
TYP
2.15 ±0.05
(2 SIDES)
3.00 ±0.10
(2 SIDES)
14
85
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0 – 0.05
(DDB8) DFN 0905 REV B
0.25 ± 0.05
2.20 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.61 ±0.05
(2 SIDES)
1.15 ±0.05
0.70 ±0.05
2.55 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
PIN 1
R = 0.20 OR
0.25 × 45°
CHAMFER
0.50 BSC
LTC4070
14
4070fc
package DescripTion
MS8E Package
8-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev E)
MSOP (MS8E) 0908 REV E
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.86
(.034)
REF
0.65
(.0256)
BSC
0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
1 2
3
4
4.90 ± 0.152
(.193 ± .006)
8
8
1
BOTTOM VIEW OF
EXPOSED PAD OPTION
7
6
5
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.52
(.0205)
REF
1.83 ± 0.102
(.072 ± .004)
2.06 ± 0.102
(.081 ± .004)
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
2.083 ± 0.102
(.082 ± .004)
2.794 ± 0.102
(.110 ± .004)
0.889 ± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
0.1016 ± 0.0508
(.004 ± .002)
MS8E Package
8-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev E)
DETAIL “B”
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.05 REF
0.29
REF
LTC4070
15
4070fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
revision hisTory
REV DATE DESCRIPTION PAGE NUMBER
A 4/10 Change Q1’s Part Number on Figure 6 12
B 9/10 Updated Description section
Temperature Range updated in Order Information section
Updated Note 2
Text updated in “NTC Qualified Float Voltage, ∆V
FLOAT(NTC)
” section
Text updated in “NTC Protection” section
Updated Related Parts section
1
2
3
7
9, 10
16
C 4/11 Updated Vishay thermistor part number. 1, 7, 10, 11,
12, 16
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

LTC4070EDDB#TRMPBF

Mfr. #:
Buy LTC4070EDDB#TRMPBF
Manufacturer:
Analog Devices / Linear Technology
Description:
Battery Management Simple Low-IQ Battery Charger/Protector with NTC Thermistor Input
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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