Data Sheet ADN2526
Rev. B | Page 9 of 16
FREQUENCY (GHz)
150 1 2 3 4 5 6 7 8 9 10 11 12 13 14
DIFFERENTIAL |S22| (dB)
0
–40
–35
–30
–25
–20
–15
–10
–5
07511-035
Figure 11. Differential |S22|
RISE TIME (ps)
3023 24 25 26 27
28 29
OCCURRENCE (%)
16
10
12
14
6
8
4
2
0
07511-012
Figure 12. Worst-Case Rise Time Distribution
(VCC = 3.07 V, IBIAS = 100 mA, IMOD = 80 mA, T
A
= 85°C)
FALL TIME (ps)
3023 24 25 26 27 28 29
OCCURRENCE (%)
16
10
12
14
8
6
4
2
0
07511-013
Figure 13. Worst-Case Fall Time Distribution
(VCC = 3.07 V, IBIAS = 100 mA, IMOD = 80 mA, T
A
= 85°C)
07511-014
Figure 14. Electrical Eye Diagram
(11.3 Gbps, PRBS31, IMOD = 80 mA)
07511-015
Figure 15. Filtered SONET OC192 Optical Eye Diagram (for Reference)
07511-016
Figure 16. Filtered 10 Gb Ethernet Optical Eye
ADN2526 Data Sheet
Rev. B | Page 10 of 16
THEORY OF OPERATION
As shown in Figure 1, the ADN2526 consists of an input stage
and two voltage-controlled current sources for bias and modula-
tion. The bias current, which is available at the IBIAS pin, is
controlled by the voltage applied at the BSET pin and can be
monitored at the IBMON pin. The differential modulation
current, which is available at the IMODP and IMODN pins, is
controlled by the voltage applied to the MSET pin. The output
stage implements the active back-match circuitry for proper
transmission line matching and power consumption reduction.
The ADN2526 can drive a load having differential resistance
ranging from 5to 50 Ω. The excellent back-termination in
the ADN2526 absorbs the signal reflections from the TOSA
end, enabling excellent optical eye quality, even though the
TOSA is significantly misterminated.
INPUT STAGE
The input stage of the ADN2526 converts the data signal applied
to the DATAP and DATAN pins to a level that ensures proper
operation of the high speed switch. The equivalent circuit of the
input stage is shown in Figure 17.
VCC
50Ω
50Ω
VCC
DATAP
DATAN
07511-017
Figure 17. Equivalent Circuit of the Input Stage
The DATAP and DATAN pins are terminated internally with a
100 Ω differential termination resistor. This minimizes signal
reflections at the input, which can otherwise lead to degradation in
the output eye diagram. It is not recommended to drive the
ADN2526 with single-ended data signal sources.
The ADN2526 input stage must be ac-coupled to the signal
source to eliminate the need for matching between the common-
mode voltages of the data signal source and the input stage of
the driver (see Figure 18). The ac-coupling capacitors should
have an impedance much less than 50 Ω over the required
frequency range. Generally, this is achieved using 10 nF to 100 nF
capacitors.
In SFP+ MSA applications, the DATAP and DATAN pins need
to be connected to the SFP+ connector directly. This connection
requires enhanced ESD protection to support the SFP+ module
hot plug-in application.
ADN2526
DATAP
DATAN
C
C
50Ω
50Ω
DATA SIGNAL SOURCE
07511-018
Figure 18. AC-Coupling the Data Source to the ADN2526 Data Inputs
BIAS CURRENT
The bias current is generated internally using a voltage-to-current
converter consisting of an internal operational amplifier and a
transistor, as shown in Figure 19.
GND
200Ω
800Ω
2Ω
R
R
VCC
IBMONBSET
I
BMON
ADN2526
I
BIAS
200Ω
IBIAS
07511-019
Figure 19. Voltage-to-Current Converter Used to Generate IBIAS
The voltage-to-current conversion factor is set at 100 mA/V by
the internal resistors, and the bias current is monitored using a
current mirror with a gain equal to 1/100. By connecting a 1 kΩ
resistor between IBMON and VEE, the bias current can be moni-
tored as a voltage across the resistor. A low temperature coefficient
precision resistor must be used for the IBMON resistor (R
IBMON
).
Any error in the value of R
IBMON
that is due to tolerances or to drift
in its value over temperature contributes to the overall error
budget for the IBIAS monitor voltage. If the IBMON voltage is
connected to an ADC for analog-to-digital conversion, R
IBMON
should be placed close to the ADC to minimize errors due to
voltage drops on the ground plane.
The equivalent circuits of the BSET, IBIAS, and IBMON pins
are shown in Figure 20, Figure 21, and Figure 22.
VCC
BSET
VCC
800Ω
200Ω
07511-020
Figure 20. Equivalent Circuit of the BSET Pin
Data Sheet ADN2526
Rev. B | Page 11 of 16
2Ω
2kΩ
100Ω
IBIAS
VCC
VCC
07511-021
Figure 21. Equivalent Circuit of the IBIAS Pin
VCC
IBMON
VCC
100Ω
500Ω
VCC
07511-022
Figure 22. Equivalent Circuit of the IBMON Pin
The recommended configuration for BSET, IBIAS, and IBMON
is shown in Figure 23.
ADN2526
BSET
V
BSET
GND
IBMON IBMON
IBIAS
TO LASER CATHODE
L
R
1kΩ
IBIAS
07511-023
Figure 23. Recommended Configuration for the BSET, IBIAS, and IBMON Pins
The circuit used to drive the BSET voltage must be able to drive
the 1 kΩ input resistance of the BSET pin. For proper operation
of the bias current source, the voltage at the IBIAS pin must be
between the compliance voltage specifications for this pin over
supply, temperature, and bias current range (see Table 1). The
maximum compliance voltage is specified for only two bias
current levels (10 mA and 100 mA), but it can be calculated for
any bias current by
V
COMPLIANCE_MAX
(V) = VCC (V) − 0.75 − 4.4 × IBIAS (1)
See the Applications Information section for examples of
headroom calculations.
The function of the inductor, L, is to isolate the capacitance of
the IBIAS output from the high frequency signal path. For
recommended components, see Table 7.
AUTOMATIC LASER SHUTDOWN (ALS)
The ALS pin is a digital input that enables/disables both the bias
and modulation currents, depending on the logic state applied,
as shown in Table 5.
Table 5. ALS Functions
ALS Logic State IBIAS and IMOD
High Disabled
Low Enabled
Floating Enabled
The ALS pin is compatible with 3.3 V CMOS and LVTTL logic
levels. Its equivalent circuit is shown in Figure 24.
VCC
ALS
VCC
100Ω
40kΩ
2kΩ
07511-024
Figure 24. Equivalent Circuit of the ALS Pin
MODULATION CURRENT
The modulation current can be controlled by applying a dc
voltage to the MSET pin. This voltage is converted into a dc
current by using a voltage-to-current converter using an
operational amplifier and a bipolar transistor, as shown in
Figure 25.
50Ω
200Ω
800Ω
MSET
GND
IMODP
IMODN
ADN2526
VCC
V
O
g
m
× V
O
FROM INPUT STAGE
IMOD
07511-025
Figure 25. Generation of Modulation Current on the ADN2526
This dc current is switched by the data signal applied to the
input stage (DATAP and DATAN pins) and amplified by the
output stage to generate the differential modulation current at
the IMODP and IMODN pins.
The output stage also generates the active back-termination,
which provides proper transmission line termination. Active
back-termination uses feedback around an active circuit to
synthesize a broadband termination resistance. This provides
excellent transmission line termination, while dissipating less
power than a traditional resistor passive back-termination.
A small portion of the modulation current flows in the virtual
50 active back-termination resistor. All of the preset IMOD
modulation current, the range specified in Table 1, flows into
the external load. The equivalent circuits for MSET, IMODP, and
IMODN are shown in Figure 26 and Figure 27. The two 25
resistors in Figure 27 are not actual resistors. They represent the
active back-termination resistance.

ADN2526ACPZ-R7

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Laser Drivers 10G 25 Ohm Diff Active Backmatch Laser
Lifecycle:
New from this manufacturer.
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